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公开(公告)号:SE1850830A1
公开(公告)日:2020-01-03
申请号:SE1850830
申请日:2018-07-02
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , PHAM HUYNH TRAM ANH , HJELM LARS , JANSSON LI , TORSSELL STAFFAN
IPC: C09J197/00 , C08H7/00 , C08L97/00 , C09J161/12
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-3 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) , high density fiberboards (HDF) and particle boards.
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公开(公告)号:CA3016291A1
公开(公告)日:2017-09-28
申请号:CA3016291
申请日:2017-03-20
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , ARESKOGH DIMITRI , EKSTROM JESPER
IPC: C09J197/00 , C07G1/00 , C08H7/00 , C08L97/00 , C09D197/02 , C09J161/00
Abstract: The present invention relates to a liquid lignin mixture comprising 3-50 wt% methanol, 12-50 wt% ligninand5-85 wt% aqueous alkali solution wherein the concentration of said aqueous alkali solution is 1 to 50 wt% of alkali in water, based on the weight of said alkali solution prior to mixing with the other components of the mixture. The liquid lignin mixture can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.
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公开(公告)号:BR112021025809A2
公开(公告)日:2022-02-08
申请号:BR112021025809
申请日:2020-06-22
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , EKSTRÖM JESPER
IPC: B27N3/00 , B32B21/00 , C08H7/00 , C08L63/00 , C08L97/00 , C09D163/00 , C09D197/00 , C09J163/00 , C09J197/00
Abstract: processo para preparar uma resina de ligação.a presente invenção se refere a um processo para preparar uma resina de ligação, lignina na forma sólida ou na forma de uma dispersão em água é misturada com um reticulador; e opcionalmente um ou mais aditivos seguidos pela adição de uma solução básica. a resina de ligação é útil, por exemplo, na fabricação de laminados, isolamento de lã mineral e produtos de madeira, como madeira compensada, painel de partículas orientadas (osb), madeira folheada laminada (lvl), painéis de fibra de média densidade (mdf), painéis de fibra de alta densidade (hdf), piso de tacos de madeira, madeira compensada curva, madeira aglomerada folheada, madeira aglomerada ou mdf folheados, laminados ou isolamento de lã mineral.
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公开(公告)号:CA2924977C
公开(公告)日:2021-11-09
申请号:CA2924977
申请日:2014-09-25
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , ARESKOGH DIMITRI
IPC: C09D197/00 , C07G1/00 , C08G59/04 , C08G59/18 , C08G59/40 , C08H7/00 , C08L63/00 , C08L63/02 , C09J197/00
Abstract: The present invention relates to a composition for coating, in particular a composition comprising lignin and one or more epoxy-group containing compounds,and methods for the manufacturing thereof and uses thereof. The present invention also relates to products obtainable by said methods and uses thereof.
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公开(公告)号:SE1951516A1
公开(公告)日:2021-06-21
申请号:SE1951516
申请日:2019-12-20
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , PHAM HUYNH TRAM ANH , EKSTRÖM JESPER , HÄGG KATARINA
IPC: C09J197/02 , B27N3/00 , B32B21/00 , C07G1/00 , C08H7/00 , C08L63/00 , C08L97/02 , C09D163/00 , C09D197/02 , C09J163/00
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.
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公开(公告)号:ES2827323T3
公开(公告)日:2021-05-20
申请号:ES16771516
申请日:2016-04-01
Applicant: STORA ENSO OYJ
Inventor: ARESKOGH DIMITRI , ZAFAR ASHAR
IPC: D21D1/00 , B27N3/00 , C08G8/20 , C08G8/24 , C08G8/38 , C08L97/00 , C09J161/12 , C09J197/00
Abstract: Método para preparar una composición de lignina activada que comprende las etapas siguientes: i) proporcionar una lignina, ii) añadir uno o más dispersantes acuosos o solubles en agua, iii) añadir un catalizador ácido o basado en metal alcalino, iv) mezclar dichos componentes y simultáneamente reducir el tamaño de partícula de la lignina, mediante la utilización de un tratamiento de mezcla a alta cizalla, en el que dichos componentes se someten a alta cizalla y flujo, proporcionando de esta manera dicha composición, en el que el tratamiento de alta cizalla utiliza un mezclador con un conjunto de rotor-estator en configuración por lotes o en línea en el que el conjunto de rotor-estator comprende un elemento giratorio que gira a altas velocidades con un elemento estacionario, o dicho conjunto consiste en un elemento giratorio de tipo discoidal con dientes de sierra y/o un elemento giratorio en forma de estrella que gira a altas velocidades sin un elemento estacionario, generando de esta manera alta cizalla y turbulencia, y en el que el tratamiento de alta cizalla implica velocidades de rotación superiores a por lo menos 1.000 rpm.
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公开(公告)号:SE543597C2
公开(公告)日:2021-04-13
申请号:SE1950773
申请日:2019-06-24
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , EKSTRÖM JESPER
IPC: B27N3/00 , C09J197/00 , B32B21/00 , C08H7/00 , C08L63/00 , C08L97/00 , C09J163/00
Abstract: The present invention relates to a process for preparing a bonding resin, lignin in solid form is mixed with one or more cross-linker, such as a glycidyl ether, and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.
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公开(公告)号:CA3141289A1
公开(公告)日:2020-12-30
申请号:CA3141289
申请日:2020-06-22
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , EKSTROM JESPER
IPC: C09J197/00 , B27N3/00 , B32B21/00 , C08H7/00 , C08L63/00 , C08L97/00 , C09D163/00 , C09D197/00 , C09J163/00
Abstract: The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.
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公开(公告)号:CA3139905A1
公开(公告)日:2020-11-19
申请号:CA3139905
申请日:2020-05-13
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTROM JESPER
IPC: C09J163/00 , B27N3/00 , B32B21/00 , C08L1/00 , C08L3/00 , C08L5/00 , C08L63/00 , C08L89/00 , C08L93/00 , C08L99/00 , C09J101/00 , C09J103/00 , C09J105/00 , C09J189/00 , C09J193/00 , C09J199/00
Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.
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公开(公告)号:SE542795C2
公开(公告)日:2020-07-07
申请号:SE1851217
申请日:2018-10-08
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , ARESKOGH DIMITRI , EKSTRÖM JESPER
IPC: C07G1/00 , C08H8/00 , C08L97/00 , C09J197/00
Abstract: The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.
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