Abstract:
A wavelength conversion element having an improved property-maintaining life and a method for manufacturing the wavelength conversion element are provided. A wavelength conversion element 10a has an optical waveguide 13. The wavelength of incoming light 101 input from one end 13a of the optical waveguide 13 is converted and outgoing light 102 is output from the other end 13b of the optical waveguide 13. The wavelength conversion element includes a first crystal 11 composed of Al x Ga (1-x )N (0.5 ‰¤ x ‰¤ 1); and a second crystal 12 having the same composition as that of the first crystal. The first and second crystals 11 and 12 form a domain-inverted structure in which a polarization direction is periodically reversed along the optical waveguide 13, and the domain-inverted structure satisfies quasi phase matching conditions with respect to the incoming light 101. At least one of the first and second crystals has a dislocation density of 1 × 10 3 cm -2 or more and less than 1 × 10 7 cm -2 .
Abstract:
A method for preparing a porous ceramic which comprises mixing a metal powder as a precursor of a ceramic (1) and a sintering aid, and subjecting the resulting mixture to a heat treatment by microwave heating, thereby allowing the metal powder to undergo oxidation or nitrogenation from the surface thereof and allowing the metal to diffuse toward and outside of an oxide or nitride layer formed in the outer shell of the powder, to prepare a porous ceramic (1) having fine and uniform closed pores (1a). The porous ceramic (1) has fine closed pores (1a) dispersed uniformly in a high proportion and thus exhibits excellent characteristics when used, for example, in an electronic circuit substrate which needs good resistance to moisture, a low dielectric constant and a low dielectric loss as well as good mechanical strength.
Abstract:
An Si3N4 ceramic composite substrate not cracking even if a mechanical or thermal shock is given to it and excellent in heat-radiation and heat-cycle-resistance characteristics. The Si3N4 substrate has a heat conductivity of more than 90 W/m. K, and a three-point flexural strength of more than 700 MPa. The relationship between the thickness tm of a metallic layer joined to a major surface of the Si3N4 substrate and the thickness tc of the Si3N4 substrate is given by 2 tm