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    LAMINATED PRODUCT AND CIRCUIT BOARD USING SAID LAMINATED PRODUCT
    21.
    发明专利
    LAMINATED PRODUCT AND CIRCUIT BOARD USING SAID LAMINATED PRODUCT 失效

    公开(公告)号：JPH04224941A

    公开(公告)日：1992-08-14

    申请号：JP41500490

    申请日：1990-12-27

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  KIDA KENJI ,  DEGUCHI YUKICHI

    IPC: B32B7/02 ,  B32B15/08 ,  B32B17/02 ,  B32B27/00 ,  B32B27/12 ,  H05K1/03

    Abstract: PURPOSE:To provide a heat-resistant base material having well-balanced properties such as heat resistance, size stability against heat and humidity, flame retardation and stability against high frequency, and besides, self-fusion which allows thermal fusion even at comparatively low temperature, and especially best suited for use on a circuit board. CONSTITUTION:A laminated product consists of a non-stretched sheet (B-layer) containing poly-p-phenylenesulfide as a main component without using an adhesive as an intermediately, fixed to at least, one surface of a fibrous sheet (A layer). In addition, the laminated product has the residual crystallization energy DELTAHt of the B layer which is equipment to 20% or higher of the crystallization energy DELTA Hq of resin constituting the B layer. A circuit board has an electric circuit provided at least, on one surface of the laminated product.

    COMPOSITE METAL LAMINATED SHEET AND USAGE THEREOF
    22.
    发明专利
    COMPOSITE METAL LAMINATED SHEET AND USAGE THEREOF 失效

    公开(公告)号：JPH03112641A

    公开(公告)日：1991-05-14

    申请号：JP25022189

    申请日：1989-09-26

    Applicant: TORAY INDUSTRIES

    Inventor： DEGUCHI YUKICHI ,  MIYAJI SHINICHIRO

    IPC: B32B15/08 ,  H01F41/04 ,  H05K1/02 ,  H05K3/00 ,  H05K3/02 ,  H05K3/38

    Abstract: PURPOSE:To obtain composite metal laminated sheet, the base layer of which consists of ultra-thin organic polymeric film and the processing of which is very easy, by a structure wherein the base layer consisting of organic polymeric film, which is thinner than substrate layer, is bonded onto one side of the substrate layer consisting of organic polymeric film by peelable adhesion and further metal foil is laminated to the base layer side. CONSTITUTION:The composite metal laminated sheet concerned is produced by laminating metal foil to the base layer side of laminated film, which is formed by bonding base layer consisting of organic polymeric film having the thickness of 0.2 - 6 mum or being thinner than the thickness of substrate layer onto at least one side of the substrate layer consisting of organic polymeric film by peelable adhesion with the substrate layer. Adhesive is applied to the metal layer side of the composite metal laminated sheet. By peelingly removing the substrate layer from the resultant composite metal laminated sheet, to which the adhesive is applied, coated sheet is obtained. In succession, the coated sheet is wound and cut normal to the winding axis in narrow lengths so as to manufacture laminated coil. Or by slitting the coated sheet in narrow lengths and, after that, winding the slitted sheet, laminated coil is manufactured.

    CIRCUIT BOARD
    23.
    发明专利
    CIRCUIT BOARD 失效

    公开(公告)号：JPH0195585A

    公开(公告)日：1989-04-13

    申请号：JP25312887

    申请日：1987-10-07

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  DEGUCHI YUKICHI ,  KOBAYASHI HIROAKI

    IPC: H05K1/03 ,  B32B27/00

    Abstract: PURPOSE:To enhance thermal resistance, size stability and a mechanical characteristic by a method wherein an electric circuit is formed on the side of a biaxially oriented polyphenylene sulfide film of a laminate where the biaxially oriented polyphenylene sulfide film and a specific fiber sheet have been laminated. CONSTITUTION:An electric circuit is formed on the side of a biaxially oriented polyphenylene sulfide film of a laminate where the biaxially oriented polyphenylene sulfide film which has been formed by melting a resin composition composed mainly of polyphenylene sulfide to shape a sheet, by stretching it biaxially and by heat-treating it and a fiber sheet (paper) which cannot be melted at 300 deg.C and whose coefficient of thermal expansion at 100-200 deg.C is 50X10 1/ deg.C or less have been laminated. Accordingly, even when an adhesive is hardened and even when this circuit board is floated is a solder bath, it is not curved substantially. By this setup, thermal resistance, size stability and a mechanical characteristic become excellent.

    ENCAPSULATION FILM FOR PHOTOVOLTAIC MODULE AND PHOTOVOLTAIC MODULE
    25.
    发明公开
    ENCAPSULATION FILM FOR PHOTOVOLTAIC MODULE AND PHOTOVOLTAIC MODULE 审中-公开
    密封薄膜太阳能电池组件和太阳能电池为模块

    公开(公告)号：EP1930953A4

    公开(公告)日：2014-08-13

    申请号：EP06810271

    申请日：2006-09-19

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  NOGUCHI MASAKAZU ,  KAWAJI NAOKI

    IPC: H01L31/048 ,  B32B27/36

    CPC classification number: B32B27/36 ,  B32B17/10018 ,  B32B17/10788 ,  B32B2367/00 ,  H01L31/048 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50

    Abstract: An encapsulation film and photovoltaic module using the same are provided, being excellent in long-term reliability and wherein the degradation of gas-barrier property over long-term use (a problem in the conventional art) is curtailed. The film has as a base material an inexpensive polyester film that is excellent in mechanical characteristics and processability. Furthermore, the encapsulation film and photovoltaic module using the same are hydrolysis-resistant, transparent, weather-resistant, and lightweight. The encapsulation film comprises: a polyester film having a thermal shrinkage ratio of (± 2) % at 150 °C in both the length-wise and width-wise directions, and additionally, wherein the difference between the thermal shrinkage ratios in the length-wise and width-wise directions at 150 °C is 2 % or less; and a layer composed of at least one member selected from the group consisting of metals, metal oxides, and inorganic compounds. The photovoltaic module uses the encapsulation film as a front sheet layer and/or a back sheet layer thereof.

    FILM FOR SEALING REAR SURFACE OF SOLAR CELL AND SOLAR CELL USING THE SAME
    28.
    发明专利
    FILM FOR SEALING REAR SURFACE OF SOLAR CELL AND SOLAR CELL USING THE SAME 失效

    公开(公告)号：JP2002026354A

    公开(公告)日：2002-01-25

    申请号：JP2000209438

    申请日：2000-07-11

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  TAJIMA KOICHI

    IPC: C08J7/04 ,  C08J5/18 ,  H01L31/04

    Abstract: PROBLEM TO BE SOLVED: To provide a film for sealing the rear surface of a solar cell and a solar cell using the same by which environmental resistance such as hydrolysis resistance or weatherability, etc., can be improved by using a PET-BO that is inexpensive and has excellent mechanical characteristic and heat resistance, and high reflection rate advantageous for electric conversion of sunlight, reduction of leak current and lightweight be given. SOLUTION: This film for sealing the rear surface of a solar cell has a gas barrier layer compounded with a polyethylene terephthalate, and the polyethylene terephthalate is composed of polymer whose number-average molecular weight ranges 18500 to 4000 and its thickness is 7% or more of the total thickness of the film. The solar cell is featured in that a film sealing the rear surface is applied to the solar cell system.

    POLYPHENYLENE SULFIDE RESIN COMPOSITION AND FILM USING SAME
    29.
    发明专利
    POLYPHENYLENE SULFIDE RESIN COMPOSITION AND FILM USING SAME 失效

    公开(公告)号：JP2001192555A

    公开(公告)日：2001-07-17

    申请号：JP2000000766

    申请日：2000-01-06

    Applicant: TORAY INDUSTRIES

    Inventor： WATANABE YASUTOSHI ,  MIYAJI SHINICHIRO ,  HAGIWARA IKUO

    IPC: C08J5/18 ,  B29C55/00 ,  C08K3/00 ,  C08L81/02

    Abstract: PROBLEM TO BE SOLVED: To provide polyphenylene sulfide films which solve the color specks when films are formed and improve the film-forming yield by stable when films are formed and also excel in fabricability in the condenser use. SOLUTION: Polyphenylene sulfide resin compositions comprise a polyphenylene sulfide resin and have a melt viscosity at 316 deg.C after heat treatment of 1,500 P to less than 6,000 P and, at the same time, a difference in melt viscosity between before and after heat treatment of less than 2,000 P, and the polyphenylane sulfide films are produced by using the same.

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