公开(公告)号：EP2489683A4

公开(公告)日：2015-03-18

申请号：EP10823349

申请日：2010-10-08

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIIZEKI SHOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/00 ,  B32B15/08 ,  C09C1/62 ,  C09C1/64 ,  C09C3/10 ,  C23C22/08 ,  H05K3/28 ,  H05K9/00

CPC classification number: C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

公开(公告)号：EP2080773A4

公开(公告)日：2010-06-02

申请号：EP07831242

申请日：2007-11-06

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIWA HIROYUKI ,  TATSUTA YOSHIKO ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/44 ,  C08F290/00 ,  C08F290/06 ,  C08K3/30 ,  C08L43/02 ,  C08L63/00 ,  G02B6/12

CPC classification number: G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

公开(公告)号：EP2234118A4

公开(公告)日：2017-08-16

申请号：EP09702030

申请日：2009-01-14

Applicant: TORAY INDUSTRIES

Inventor： SHIMBA YOICHI ,  HARA YOSHITAKE ,  MIZUGUCHI TSUKURU ,  NONAKA TOSHIHISA

IPC: H01B3/00 ,  C08K3/00 ,  H01G4/12 ,  H01G4/33

CPC classification number: H01G4/206 ,  C04B35/4682 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/63404 ,  C04B35/63468 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01B3/12 ,  H01B3/306 ,  H01G4/1227 ,  H05K1/162 ,  H05K2201/0209 ,  C04B41/4529 ,  C04B41/5155 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5041 ,  C04B35/10 ,  C04B35/00 ,  C04B35/565 ,  C04B35/581

公开(公告)号：EP2647685A4

公开(公告)日：2014-09-17

申请号：EP11845999

申请日：2011-11-28

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  SHINBA YOICHI ,  NONAKA TOSHIHISA

IPC: C09J179/08 ,  C08G73/10 ,  C08G77/14 ,  C08K3/28 ,  C08L79/08 ,  C09J7/00 ,  C09J11/04 ,  C09J163/00 ,  C09J183/10 ,  H01L23/00 ,  H01L23/36

CPC classification number: C09J163/00 ,  C08G77/14 ,  C08K3/28 ,  C08K2003/2227 ,  C08L63/00 ,  C08L101/10 ,  C09J7/20 ,  C09J9/02 ,  C09J179/08 ,  C09J183/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  C08L79/08 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

公开(公告)号：EP1788412A4

公开(公告)日：2013-05-01

申请号：EP05777036

申请日：2005-09-02

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  ASAHI NOBORU ,  TATSUTA YOSHIKO

IPC: G02B6/12 ,  G02B6/122 ,  H05K1/02

CPC classification number: G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068

公开(公告)号：EP2492331A4

公开(公告)日：2016-09-07

申请号：EP10824860

申请日：2010-10-15

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  TACHIBANA YASUKO ,  NIWA HIROYUKI ,  NONAKA TOSHIHISA

IPC: C09J163/02 ,  C09J4/02 ,  C09J7/02 ,  C09J11/00 ,  C09J179/08 ,  H01L21/52

CPC classification number: C09J163/00 ,  C08G59/245 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1075 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/10 ,  C09J179/08 ,  C09J2463/00

Abstract: Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): wherein m and n in the general formula (1) are integers of 0 or more, which satisfy the relationship: 1 ‰¤ m + n ‰¤ 10, x is an integer of 1 or more and 5 or less, y is an integer of 1 or more and 10 or less, and y = 2x; and wherein R 1 to R 8 in the general formula (2) may be respectively the same or different, and selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen, a sulfone group, a nitro group and a cyano group. The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.

公开(公告)号：EP2857470A4

公开(公告)日：2016-02-17

申请号：EP13797952

申请日：2013-05-21

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA KAZUYUKI ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C09J7/02 ,  C08G73/10 ,  C09J163/00 ,  C09J179/08 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/29 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/106 ,  C08L63/00 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/11831 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/27831 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

公开(公告)号：EP2452964A4

公开(公告)日：2014-06-11

申请号：EP10797017

申请日：2010-06-23

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  NONAKA TOSHIHISA ,  TATSUTA YOSHIKO

IPC: C08G59/40 ,  C08G73/10 ,  C08L63/00 ,  C08L79/08 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09J179/08 ,  C09J163/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81204 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512

公开(公告)号：EP1895580A4

公开(公告)日：2009-09-30

申请号：EP06747164

申请日：2006-06-05

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: H01L21/60 ,  B32B27/00 ,  C08L63/00 ,  C08L79/08 ,  C09J7/02 ,  C09J179/08 ,  H01L21/52

CPC classification number: C09J179/08 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J163/00 ,  H01L21/563 ,  H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T428/287 ,  Y10T428/31515 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: [Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a semiconductor wafer provided with bump electrodes of which bump electrodes have a narrow pitch and a high pin proportion, that at the time of dicing, permits a high-speed cutting without any dicing dust contamination or defect, and that facilitates detection of alignment marks at the time of dicing and flip chip assembly. [Means for Solving Problems] There is provided an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25°C under 1.013×10 5 N/m 2 and a compound being solid at 25°C under 1.013×10 5 N/m 2 , and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt% or more and 60 wt% or less.