公开(公告)号：JP2689805B2

公开(公告)日：1997-12-10

申请号：JP3931092

申请日：1992-02-26

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  TESHIBA TOSHIHIRO ,  TANAKA MASAYUKI

IPC: C08G59/62 ,  H01L23/29 ,  H01L23/31

公开(公告)号：EP2192167A4

公开(公告)日：2013-07-03

申请号：EP08832197

申请日：2008-09-12

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  TSUCHIYA HIROHUMI ,  KIMURA SHINSUKE ,  SAWAMURA YASUSHI

IPC: C09J7/02 ,  C08L33/08 ,  C08L63/00 ,  C08L83/04 ,  C09J7/00 ,  C09J163/00 ,  C09J183/04 ,  C09J201/00 ,  H01L21/52 ,  H01L23/00 ,  H01L23/29

CPC classification number: C09J183/04 ,  C08L33/08 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L23/296 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  Y10T428/1471 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2224/0401

Abstract: In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is -10°C to 50°C and the rate of change of Tg after heat-treating the composition at 175°C for 1000 hours is 15% or less.

公开(公告)号：EP0823729A4

公开(公告)日：2000-05-03

申请号：EP97904577

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

CPC classification number: H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

Abstract translation: 用于连接由具有在上的基材粘合剂层的层压体的基材的半导体用粘接片，worin所述粘合剂层含有热塑性树脂（A）和环氧树脂（B）和所述环氧树脂（B）含有至少一个环氧基 从（I）二环戊二烯骨架的环氧树脂中选择的树脂（B），（II）萜烯骨架的环氧树脂（III）联苯环氧树脂和（IV）的含萘骨架的环氧树脂作为必要成分骨架的; 对于TAB由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层叠的背涂粘合剂的带的worin所述粘合层具有60的软化温度到110℃，在固化后和50小时或更长时间 在绝缘电阻滴加时间已经被允许在130℃和85％RH的环境用DC 100V的应用静置后; 并用粘合剂进行引线接合连接由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层压的带worin所述粘合层具有120的软化温度至170℃已被固化后，存储 弹性模量E“20至100MPa，在150℃，并在绝缘电阻滴加50小时或更多的时间之后具有被允许在130℃和85％RH的环境中静置以DC 100V的应用。 用于连接衬底的半导体用粘接片，用于TAB的粘合剂背衬带和本发明的引线接合连接的粘合剂背衬带具有优异的粘合强度，insulatability，尺寸精度等，并且可以提高可靠性 一种半导体集成电路分别连接基板和半导体装置的高密度封装。

公开(公告)号：EP0780436A4

公开(公告)日：2000-04-19

申请号：EP96923051

申请日：1996-07-10

Applicant: TORAY INDUSTRIES

Inventor： SHIMIZU KEN ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI

IPC: C08K3/22 ,  H01L23/29 ,  C08L63/00 ,  C08K3/36

CPC classification number: H01L23/295 ,  C08K3/22 ,  H01L23/293 ,  H01L2924/0002 ,  C08L63/00 ,  H01L2924/00

Abstract: An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt% and the inorganic filler (C) contains 0.1-50 wt% of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.

公开(公告)号：EP0749996A4

公开(公告)日：2000-05-03

申请号：EP95942299

申请日：1995-12-27

Applicant: TORAY INDUSTRIES

Inventor： TOKUNAGA ATSUTO ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI

IPC: C08G59/24 ,  C08G59/62 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29

CPC classification number: C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  Y10S524/919 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L61/04 ,  H01L2924/00

Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler, wherein the curing agent (B) is one containing at least two phenolic and/or naphtholic hydroxyl groups in its molecule and the inorganic filler contains silica (C) as the essential ingredient, the silica comprising 1-99 wt.% of synthetic silica and 99-1 wt.% of molten natural silica; and a semiconductor device comprising semiconductor elements sealed therewith. The composition does not cause failure in resin filling, resin peeling, resin streak, stage shift and vent clogging in the molding step. The sealed semiconductor device is excellent in moisture-resistance reliability, high-temperature reliability and soldering resistance.

Abstract translation: 本文公开了包含环氧树脂（A），硬化剂（B）和无机填料的环氧树脂化合物，其特征在于，所述无机填料含有二氧化硅（C）作为必要成分，所述硬化剂（B）是 在分子中含有至少两个酚羟基和/或萘酚羟基，所述二氧化硅（C）含有1-99重量％的合成二氧化硅和99-1重量％的天然熔融二氧化硅。 此处还公开了一种其中密封有所述环氧树脂化合物的半导体元件的半导体器件。 环氧树脂化合物在成型时不会引起短丸，树脂剥离，断线，载物台移位，排气堵塞等问题。 此外，当用作密封材料时，其产生在高温和高湿度下具有良好的可靠性以及良好的耐焊接热的半导体器件。