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公开(公告)号：KR20200128006A
公开(公告)日：2020-11-11
申请号：KR20207024568
申请日：2019-02-13
Applicant: TORAY INDUSTRIES
Inventor： MATSUBA SATOSHI , UMEHARA MASAAKI , SATO SHINJI , KOJIMA HIDEKI , SAWAMURA YASUSHI
Abstract: 본발명은투광성, 내열성, 내환경성등이우수하고, 또한내굴곡성이매우우수한플라스틱광파이버를제공하는것을과제로하는것이며, 그해결수단으로서코어와, 적어도 1층의클래드로이루어지는플라스틱광파이버로서, 최내층의클래드의굽힘탄성률이 20~70㎫이며, 또는최내층의클래드의유리전이온도가 10℃이하이며, 또한최내층의클래드의 30℃에있어서의저장탄성률이 1×106Pa~4×107Pa인것을특징으로하는플라스틱광파이버라고하는것을제안한다.
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公开(公告)号：AU6368996A
公开(公告)日：1997-02-10
申请号：AU6368996
申请日：1996-07-10
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU KEN , SAWAMURA YASUSHI , TANAKA MASAYUKI
Abstract: An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt% and the inorganic filler (C) contains 0.1-50 wt% of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.
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公开(公告)号：DE69739429D1
公开(公告)日：2009-07-09
申请号：DE69739429
申请日：1997-02-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: H01L21/60 , C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L23/495 , H01L23/498
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：AT285623T
公开(公告)日：2005-01-15
申请号：AT97904577
申请日：1997-02-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L23/495 , H01L23/498 , H01L21/60
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：AU4356196A
公开(公告)日：1996-07-24
申请号：AU4356196
申请日：1995-12-27
Applicant: TORAY INDUSTRIES
Inventor： TOKUNAGA ATSUTO , SAWAMURA YASUSHI , TANAKA MASAYUKI
Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt% of synthetic silica and 99-1 wt% of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.
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Patent Agency Ranking
公开(公告)号：CA2039669A1
公开(公告)日：1991-10-05
申请号：CA2039669
申请日：1991-04-03
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , SAWAMURA YASUSHI , TANAKA MASAYUKI , KAYABA KEIJI , TESHIBA TOSHIHIRO
Abstract: SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A)containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
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公开(公告)号：DE69732004T2
公开(公告)日：2006-01-19
申请号：DE69732004
申请日：1997-02-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L21/60 , H01L23/495 , H01L23/498
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：HK1064803A1
公开(公告)日：2005-02-04
申请号：HK04107533
申请日：2004-09-30
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: C08G20090101 , C08G59/24 , C08L55/00 , C08L77/00 , C09J20090101 , C09J7/02 , C09J163/00 , H01L20090101 , H01L23/495 , H01L23/498
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：DE69222670T2
公开(公告)日：1998-03-12
申请号：DE69222670
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4 min -dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：DE69023019D1
公开(公告)日：1995-11-23
申请号：DE69023019
申请日：1990-02-20
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA YASUSHI , TANAKA MASAYUKI
IPC: H01L23/29
Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.
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