公开(公告)号：DE69732004D1

公开(公告)日：2005-01-27

申请号：DE69732004

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：DE69739429D1

公开(公告)日：2009-07-09

申请号：DE69739429

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: H01L21/60 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：AT285623T

公开(公告)日：2005-01-15

申请号：AT97904577

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：AT432531T

公开(公告)日：2009-06-15

申请号：AT04009915

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: H01L21/60 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：HK1008913A1

公开(公告)日：1999-07-30

申请号：HK98109639

申请日：1998-08-03

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L ,  C08G ,  C09J

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：DE69732004T2

公开(公告)日：2006-01-19

申请号：DE69732004

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：HK1064803A1

公开(公告)日：2005-02-04

申请号：HK04107533

申请日：2004-09-30

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G20090101 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J20090101 ,  C09J7/02 ,  C09J163/00 ,  H01L20090101 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：EP0823729A4

公开(公告)日：2000-05-03

申请号：EP97904577

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

CPC classification number: H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

Abstract translation: 用于连接由具有在上的基材粘合剂层的层压体的基材的半导体用粘接片，worin所述粘合剂层含有热塑性树脂（A）和环氧树脂（B）和所述环氧树脂（B）含有至少一个环氧基 从（I）二环戊二烯骨架的环氧树脂中选择的树脂（B），（II）萜烯骨架的环氧树脂（III）联苯环氧树脂和（IV）的含萘骨架的环氧树脂作为必要成分骨架的; 对于TAB由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层叠的背涂粘合剂的带的worin所述粘合层具有60的软化温度到110℃，在固化后和50小时或更长时间 在绝缘电阻滴加时间已经被允许在130℃和85％RH的环境用DC 100V的应用静置后; 并用粘合剂进行引线接合连接由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层压的带worin所述粘合层具有120的软化温度至170℃已被固化后，存储 弹性模量E“20至100MPa，在150℃，并在绝缘电阻滴加50小时或更多的时间之后具有被允许在130℃和85％RH的环境中静置以DC 100V的应用。 用于连接衬底的半导体用粘接片，用于TAB的粘合剂背衬带和本发明的引线接合连接的粘合剂背衬带具有优异的粘合强度，insulatability，尺寸精度等，并且可以提高可靠性 一种半导体集成电路分别连接基板和半导体装置的高密度封装。

公开(公告)号：JPH10178069A

公开(公告)日：1998-06-30

申请号：JP22170897

申请日：1997-08-18

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive containing aluminum hydroxide as an adhesive composition for constituting and adhesive layer. SOLUTION: In substrate for connecting semiconductor integrated circuit with at least one layer of each of a wiring substrate layer 4 that consists of an insulator layer 3 and a conductor pattern, a layer 7 where no conductor patterns are formed, and an adhesive layer 6, an adhesive composition for constituting the adhesive layer 6 is an epoxy resin, a thermoplastic resin, and a thermosetting adhesive containing silica powder. Any epoxy resin with at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymerization constituent is preferable for the thermoplastic resin. Aluminum hydroxide is not limited particularly in terms of grain diameter and shape but one having an average grain size of at most 1μm is preferably used, and the amount of blend is preferably 2-40wt.% in the adhesive composition.

公开(公告)号：JPH10178064A

公开(公告)日：1998-06-30

申请号：JP21652297

申请日：1997-08-11

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin and a thermoplastic resin that contains a specific epoxy resin as an essential constituent as an adhesive composition which constitutes an adhesive layer. SOLUTION: An epoxy resin A that contains, as an essential constituent, an epoxy resin (a) indicated by an expression and a thermoplastic resin B are used as an adhesive composition which constitutes an adhesive layer. R1-R4 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. An example of the epoxy resin (a) is terpendiphenodiglycidylether. The epoxy resin (a) is contained in an epoxy resin A preferably by 60wt.% or hither and the epoxy resin A is preferably contained in the adhesive composition by 20-60wt.% A thermoplastic resin B contained in the adhesive layer preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, and methyol group as a functional group that can react with the epoxy resin.