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公开(公告)号：JPH10265550A
公开(公告)日：1998-10-06
申请号：JP7609997
申请日：1997-03-27
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition causing no mold fouling, and excellent in fluidity, curability, cracking resistance and storage stability. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic curing agent consisting of a compound of the formula: R -(-CH2 - R -CH2 -R -)n -CH2 -R -CH2 -R (R is a hydroxyl-free divalent aromatic group; R is a huydroxyl-bearing divalent aromatic group; R is a hydroxyl-bearing monovalent aromatic group; R to R may be the same as or differ from one another; (n) is an integer of 0 or >=1), (C) a curing promoter, a combination of a tetra-substituted phosphonium/tetra-substituted borate with at least one kind of metal compound selected from metal alkoxides, organic acid metal salts and metal complexes, and (D) 86-95 wt.% of an inorganic filler.
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公开(公告)号：JPH10265549A
公开(公告)日：1998-10-06
申请号：JP7609897
申请日：1997-03-27
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition causing no mold fouling, and excellent in fluidity, curability, cracking resistance and storage stability. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic curing agent consisting of a compound of the formula: R -(-CH2 - R -CH2 -R -)n -CH2 -R -CH2 -R (R is a hydroxyl-free divalent aromatic group; R is a huydroxyl-bearing divalent aromatic group; R is a hydroxyl-bearing monovalent aromatic group; R to R may be the same as or differ from one another; (n) is an integer of 0 or >=1), (C) a curing promoter, a combination of a tetra-substituted phosphonium.tetra-substituted borate with a tertiary amine, and (D) 86-95 wt.% of an inorganic filler.
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公开(公告)号：JPH10265546A
公开(公告)日：1998-10-06
申请号：JP6360997
申请日：1997-03-17
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in adhesion properties and reliability and provide a semiconductor-device sealed with the epoxy resin composition by bringing the device smaller and to have higher performance. SOLUTION: This semiconductor-device is installed with a semiconductor element 1, a substrate 2 on which the semiconductor element 1 is mounted and an epoxy resin composition 3 for sealing the semiconductor element and the epoxy resin composition is formed solely on one side of the substrate. The epoxy resin composition contains an epoxy resin, a curing agent and an inorganic filler. The flexural modulus of elasticity of a cured resin composition is >10 GPa and /K and (flexural modulus of elasticity at 23 deg.C)×(coefficient of linear expansion from 23 deg.C to the glass transition temperature) GPa/K.
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公开(公告)号：JPH10245432A
公开(公告)日：1998-09-14
申请号：JP5199497
申请日：1997-03-06
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
IPC: C08K3/00 , C08G59/24 , C08G59/40 , C08G59/62 , C08G59/68 , C08K3/36 , C08L63/00 , H01L23/29 , H01L23/31
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition capable of expressing excellent flowability, curability, rack resistance, etc., by compounding an epoxy resin, a phenolic curing agent, a curing accelerator and specified amount of an inorganic filler. SOLUTION: This resin composition contains (A) an epoxy resin [preferably an epoxy resin of formula I (R1 -R8 are each H, a monovalent organic group, a halogen)], (B) a phenolic curing agent containing a compound of formula II [R is divalent aromatic group; R is a divalent aromatic group having a hydroxyl group; R is a monovalent aromatic group having a hydroxyl group; (n) is 0 or a larger integer), (C) (i) a tetra-substituted phosphonium.tetra- substituted borate and (ii) a compound having a structure having two or more N atoms in the molecule and having a double bond bound to a carbon atom on at least one of the nitrogen atoms, preferably an imidazole compound, as curing accelerators, and (D) an inorganic filler in an amount of 86-95wt.% based on the whole amount of the composition.
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公开(公告)号：JPH10182941A
公开(公告)日：1998-07-07
申请号：JP34968096
申请日：1996-12-27
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU TAKESHI , ICHIJO TSUTOMU , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition effective for settling environmental problem, reducing the generation of corrosive gas, developing excellent flame- retardancy, moldability, soldering heat-resistance and reliability and useful for the sealing of semiconductor device by using a specific amount of alumina as a part of an inorganic filler. SOLUTION: This resin composition contains (A) an epoxy resin such as a compound of the formula (R1 to R8 are each a halogen, a 1-4C alkyl or H), (B) a curing agent, (C) an inorganic filler containing 0.1-20wt.% of (C1 ) alumina and optionally further 80-99.9wt.% of (C2 ) silica and (D) a silicone. The amount of the component C is 70-97wt.% in the composition. The composition is produced by melting and kneading the components A to D at 50-170 deg.C.
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Patent Agency Ranking
公开(公告)号：JPH1060094A
公开(公告)日：1998-03-03
申请号：JP8625897
申请日：1997-04-04
Applicant: TORAY INDUSTRIES
Inventor： TESHIBA TOSHIHIRO , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition useful for sealing semiconductors, etc., capable of exhibiting characteristics excellent in quick curing properties, reliability and storage stability by adding a biphenyl skeleton-containing epoxy resin with a specific curing promoter. SOLUTION: This composition comprises (A) an epoxy resin composed of an epoxy resin containing a skeleton of the formula (R to R are each H, a 1-4C alkyl or Br) as an essential component, (B) a hardener, (C) a filler and (D) a curing promoter constituted of a mixture of a tetra-substituted borate compound (e.g. tetra-substituted phosphonium tetra-substituted borate) (D1 ) and triphenylphosphine (D2 ) as an essential component. Preferably, the component D comprises a mixture as the essential component obtained by mixing the components D1 and D2 in the molecular ratio of the components D1 /D2 of 1/1 to 1/2 and the amount of the component D is 0.5-5wt.% based on the total of the phenol resin.
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公开(公告)号：JPH09235449A
公开(公告)日：1997-09-09
申请号：JP34471696
申请日：1996-12-25
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU TAKESHI , TOKUNAGA ATSUTO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition improved in flame retardancy, high-temperature reliability, soldering-heat resistance, package filling properties and reliability of humidity resistance by mixing an epoxy resin with a curing agent, a specified amount of an inorganic filler and a phosphoric ester compound. SOLUTION: This composition is prepared by melt-mixing 0.05-15wt.% epoxy resin (A) essentially consisting of a biphenyl type epoxy component having a structure represented by formula I (wherein R1 to R8 are each H, a 1-4 C alkyl or a halogen) with a curing agent (B) which cures component A, is represented by formula II (wherein m is 0 or greater; X is an aromatic group; Y is a monovalent or bivalent aromatic group having a phenol group) and is used in such an amount that the chemical equivalent ratio of the curing functional groups of component B to the epoxy groups of component A is 0.5-1.5, 85-98wt.%, based on the resin composition, inorganic filler (C) (e.g. amorphous silica), 0.01-10wt.% (in terms of the phosphorus atoms), based on the components except component C, phosphoric ester compound (C) having a structure represented by formula III (wherein X is an at least monovalent aromatic group) in the molecule and an ion-trapping agent.
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公开(公告)号：JPH0977958A
公开(公告)日：1997-03-25
申请号：JP17403796
申请日：1996-07-04
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU TAKESHI , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has high flame retardancy, good moldability and high resistance to soldering heat and gives a semiconductor device with high reliability. SOLUTION: This resin composition contains an epoxy resin, a curing agent and an inorganic filler, wherein the inorganic filler accounts for 70-97wt.% of the composition and contains 0.1-20wt.% alumina.
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公开(公告)号：JP2560469B2
公开(公告)日：1996-12-04
申请号：JP4105889
申请日：1989-02-20
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA TAIJI , TANAKA MASAYUKI
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公开(公告)号：JP2541712B2
公开(公告)日：1996-10-09
申请号：JP14514791
申请日：1991-06-18
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , KAYABA KEIJI , TANAKA MASAYUKI
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