SUBSTRATE FOR SEMICONDUCTOR STRUCTURE HAVING HIGH THERMAL CONDUCTIVITY

    公开(公告)号:JP2003124407A

    公开(公告)日:2003-04-25

    申请号:JP2002288232

    申请日:2002-10-01

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To obtain a substrate having a high thermal conductivity and a structural integrality with a thick board, related to a semiconductor device. SOLUTION: The substrate 100 includes a body 11 having an upper surface 114 and a bottom surface 112 opposite to the upper surface 114 and having the first thermal conductivity, a cavity 116 defined by an inner surface 113 of the body 110 and opened at least on the bottom surface 112, and at least one material 120 disposed in the cavity 116 having the second thermal conductivity higher than the first thermal conductivity and coming into contact with at least a part of the inner surface 113.

    SPRING STRUCTURE WITH STRESS-BALANCING LAYER
    26.
    发明专利

    公开(公告)号:JP2003218292A

    公开(公告)日:2003-07-31

    申请号:JP2002294382

    申请日:2002-10-08

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To improve the strength and durability of a spring structure. SOLUTION: A stress-balancing layer is formed over a portion of a spring metal finger 120 that remains attached to a substrate 101 to counter balance internal stresses inherently formed in the spring metal finger 120. The internal stress (for example, positive internal stress) of the spring metal finger 120 causes the safety lug 125 (tip) of the spring metal finger 120 to bend away from the substrate 101 when a underlying release substance is removed. A stress-balancing pad 130 is formed on an anchor portion 122 of the spring metal finger 120, and made to include an internal stress (for example, negative internal stress) that counter balances the positive stress of the spring metal finger 120. COPYRIGHT: (C)2003,JPO

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