Abstract:
PROBLEM TO BE SOLVED: To provide an inexpensive laser-incorporated micro electric/mechanical mechanism with high reliability by applying a flip chip method. SOLUTION: A first laser bonding pad 28 positioned on the first side of a laser 26 is arranged in adjacent to a first substrate bonding pad 14 at the upper face of the micro electric/mechanical mechanism substrate 10. A second laser bonding pad positioned on the second side of the laser 26 is disposed in adjacent to a second substrate bonding pad 18. A first solder connection part 38 which is brought into contact with the first substrate bonding pad 14 and the first laser bonding pad 28, and a second solder connection part 40 which is brought into contact with the second substrate bonding pad 18 and the second laser bonding pad are fused by solder reflow.
Abstract:
PROBLEM TO BE SOLVED: To provide a microhinge provided with mechanical reliability and strength necessary for out-of-a plane rotation and motion in a vertical direction of a SOI device layer structure, and of a simple structure and low cost. SOLUTION: A micro-electromechanical assembly 18 comprises an out-of-plane device (for example a mirror) 22 formed in a single crystal silicon device layer in a silicon-on-insulator substrate and a flexible ribbon structure 20 formed in the device layer. The out-of-plane device 22 and the ribbon structure are integrated. The ribbon structure 20 has width or depth smaller than those of the out-of-plane device 22. One end of the out-of-plane device 22 and one end of the ribbon structure 20 are connected at a point.
Abstract:
PROBLEM TO BE SOLVED: To connect electrically a hinge component to a micro device by simple constitution. SOLUTION: The present invention provides a micro device formed on or in a device layer in a single crystal silicon substrate, and ribon structure (a ribon hinge) 42 used as one portion of a micro assembly. The ribon structure 42 is formed in the device layer as the micro device. A thickness of the ribon structure 42 is thinner than that of the micro device. A conductive material 65 is deposited on a surface of the ribon structure. The first end of the micro assembly and the first end of the ribon structure 42 are connected each other when realized as the one portion of the micro assembly. The ribon structure 42 and an off-plane device are integrated thereby as one component.
Abstract:
PROBLEM TO BE SOLVED: To provide a monolithic multiple laser structure which has the capability of emitting a multiple wavelength laser beam of close intervals in a wide wavelength spectrum range from infrared to red and blue wavelengths. SOLUTION: A red/infrared parallel type laser structure 100 is bonded to a blue laser structure 200 with solder bumps 402, 404 by flip-chip bonding to form a red/blue/infrared integrated laser structure 400 integrated by a hybrid method. The method allows a laser array structure having laser elements of different wavelengths to be manufactured, even in a semiconductor materials which are not suitable for a manufacturing method based on etching and regrowth. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional MEMS structure. SOLUTION: The method of manufacturing the molded optical MEMS component, having stress thin films has a step of providing the component with a substrate having a surface, a step of adhering a sacrificial layer onto this surface, a step of arranging a lift-off mask on the sacrificial layer in order to delineate the optical MEMS component, a step of adhering a stress gradient layer on the sacrificial layer, a step of removing the lift-off mask and portions of the stress gradient layer existing on the lift-off mask and a step of making the optical MEMS component, by releasing the stress gradient layer from the sacrificial layer.
Abstract:
PROBLEM TO BE SOLVED: To develop an independently accessible monolithic laser array which has an accurately defined and controlled oxide region, providing electrical and optical confinement. SOLUTION: Each laser in an edge-emitting laser array 100 comprises a wave guide 21 comprising a substrate, a plurality of semiconductor layers formed thereon, one or a plurality of semiconductor layers forming an active region, and a semiconductor layer formed on the active region. A wave guide 214 confining the light emitted from the active region is defined by a native oxide layer 212 formed in a trench 210 made in the semiconductor layer, while extending below the side face of the wave guide 214. The native oxide layer 212 gives the adjacent edge-emitting lasers in the array electrical isolation. First and second electrodes for biasing the active region are also provided.
Abstract:
PROBLEM TO BE SOLVED: To provide a ridge-waveguide semiconductor laser having a natural oxide layer, which imparts confinement. SOLUTION: To manufacture a ridge-waveguide semiconductor layer 100, including the following parts. A substrate 102 is provided, and an n-type Al0.5 In0.5 P first clad layer 104 is formed on the substrate 102. A non-doped Al0.4 Ga0.6 As first enclosing layer 106 forms the active layer on the first clad layer 4. A GaAs active layer 108 and a non-doped Gl0.4 Ga0.6 As second confinement layer 110 are formed. This is a ridge waveguide 208, which is formed of these parts and a p-type Al0.5 In0.5 P second clad layer 112, formed on the above described active region. The ridge waveguide 208 imparts an optical closing for the optical radiation from the active region. The ridge waveguide 208 is marked by a natural oxide layer 206 formed in a groove 204. The natural oxide layer 206 includes the ridge waveguide 208 formed of the second clad layer 112 and the active layer and first and second electrodes 216 and 218, which makes biasing of the active region possible.
Abstract:
PROBLEM TO BE SOLVED: To develop a monolithic independent addressable laser array for providing electric and optical confinement and accurately having an accurately defined and controlled oxide region. SOLUTION: Each of edge emitting lasers of an array 100 of the edge emitting lasers includes: a substrate; a plurality of semiconductor layers formed on the substrate; one or one and more of the plurality of the semiconductor layers forming an active region; a waveguide 214 formed from the semiconductor layer on the active region wherein the waveguide 214 provides optical confinement in light emission from the active region, the waveguide 214 is defined by a natural oxide layer 212 formed on grooves 210, the grooves 210 are formed in the plurality of the semiconductor layers and the waveguide 214 extends downward to the side of the waveguide 214 formed from semiconductors; the natural oxide layer 212 giving electric separation to the adjacent edge emitting laser in the array; and a first electrode and a second electrode enabling bias of the active region. COPYRIGHT: (C)2009,JPO&INPIT