Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional MEMS structure. SOLUTION: The method of manufacturing the molded optical MEMS component, having stress thin films has a step of providing the component with a substrate having a surface, a step of adhering a sacrificial layer onto this surface, a step of arranging a lift-off mask on the sacrificial layer in order to delineate the optical MEMS component, a step of adhering a stress gradient layer on the sacrificial layer, a step of removing the lift-off mask and portions of the stress gradient layer existing on the lift-off mask and a step of making the optical MEMS component, by releasing the stress gradient layer from the sacrificial layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a fluidic conduit which can be used in microarraying systems, nano-lithography systems of dip pen type, a fluidic circuit and microfluidic systems. SOLUTION: This fluidic conduit comprises a spring beam 460 which has a fixed part 453 attached to a substrate 440, and a cantilever part 454 having a curvature away from the substrate 440. The spring beam 460 defines a first channel 452 extending approximately parallel with the curvature of the cantilever part 454, in order to carry fluid along the cantilever part 454 of the spring beam 460. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an improved micro-electro-mechanical system for controlling deflections caused by static electricity of a supporting structure associated with a movable electrode. SOLUTION: The micro-electro-mechanical system comprises a substrate 108, the movable electrode 114 moving on a track within a moving plane surface 110 approximately vertical to the substrate surface, and at least one fixed electrode 116 for controlling movement of the movable electrode 114. Ninety percent of the electrode surface of the fixed electrode 116 extends over the surface covered with the movable electrode 114 when the electrode 114 moves on the moving plane surface 110 maximizing the contact of the movable electrode 114 with the substrate 108. COPYRIGHT: (C)2004,JPO