公开(公告)号：EP1016519B1

公开(公告)日：2004-09-29

申请号：EP99310459.5

申请日：1999-12-22

Applicant: Xerox Corporation

Inventor： Bringans, Ross D. ,  Noolandi, Jaan ,  Biegelsen, David K. ,  Fork, David K. ,  Elrod, Scott A.

IPC: B41C1/10

CPC classification number: B41C1/1041 ,  B41C1/1058

公开(公告)号：EP1353443A2

公开(公告)日：2003-10-15

申请号：EP03252001.7

申请日：2003-03-28

Applicant: Xerox Corporation

Inventor： Fork, David K. ,  Solberg, Scott E. ,  Littau, Karl A.

IPC: H03K3/40 ,  H01R13/00

Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.

Abstract translation: 公开了用于制造弹簧结构的方法，其通过减少或消除通过操纵制造工艺参数和/或弹簧材料组成形成弹簧的薄膜中的应力各向异性来最小化螺旋扭转。 在一个实施例中，通过在弹簧材料膜形成期间操纵制造参数（即，温度，压力和电偏压）来实现各向同性内部应力，以在弹簧材料的饱和点处产生拉伸或压缩应力。 还公开了通过使用高温或软化金属的引入来调节饱和点的方法。 在其他实施例中，通过随机沉积（例如，压力均化）或定向沉积技术（例如，偏置溅射，脉冲溅射或长投射溅射）产生各向同性内部应力。 群集工具用于分离释放和弹簧材料的沉积。

公开(公告)号：EP1176635A3

公开(公告)日：2003-04-16

申请号：EP01305899.5

申请日：2001-07-09

Applicant: Xerox Corporation

Inventor： Fork, David K. ,  Ho, Jackson H. ,  Lau, Rachel King-Ha ,  Lu, Jeng Ping

IPC: H01L21/48 ,  H01L23/48 ,  B81B3/00 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06716 ,  B81B2203/0118 ,  B81C1/00484 ,  B81C2201/0136 ,  B81C2203/058 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/48 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  H01L2924/00

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate (301) containing contact pads or metal vias (305) by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material (310) is self-aligned to the spring metal finger (320) using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract translation: 通过使用单个掩模通过形成弹簧金属和释放材料层，将含有接触垫或金属过孔的弹性结构光刻制造到衬底上的高效方法。 具体地，使用光致抗蚀剂掩模或电镀金属图案，或使用剥离处理技术，释放材料垫与弹簧金属指自对准。 然后使用释放掩模来释放弹簧金属指，同时保持将弹簧金属指的锚定部分固定到基底的释放材料的一部分。 当释放材料是导电的（例如钛）时，该释放材料部分直接位于接触垫或金属通孔上方，并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时，形成金属带以将弹簧金属指连接到接触垫或金属通孔，并且还将弹簧金属指状物进一步锚定到基底。

公开(公告)号：EP1277696A2

公开(公告)日：2003-01-22

申请号：EP02254667.5

申请日：2002-07-03

Applicant: Xerox Corporation

Inventor： Fork, David K. ,  Chua, Christopher L.

IPC: B81B3/00

CPC classification number: B81C1/00666 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81C1/00476 ,  G01R1/06727 ,  G01R3/00 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/035 ,  H01R13/24 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  H01L2924/00

Abstract: Methods are disclosed for fabricating spring structures (127) in which a passive, conductive coating (130) is deposited onto the spring structure (127) after release. A release layer (110) is deposited on a substrate (101) and then a spring metal layer (120) is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger (127). A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer (110) and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material (130) on the cantilevered tip of the finger (127). The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating (130) on the upper surface and front edge (128) of the finger tip.

Abstract translation: 公开了用于制造弹簧结构（127）的方法，其中在释放之后将无源导电涂层（130）沉积到弹簧结构（127）上。 释放层（110）沉积在基板（101）上，然后在其上形成弹簧金属层（120）。 然后使用第一掩模来蚀刻弹簧金属层以形成弹簧金属指（127）。 然后沉积第二（释放）掩模，其限定用于去除释放层（110）的一部分并释放弹簧金属指的自由端的释放窗口。 在随后将导电涂层材料（130）定向沉积在手指（127）的悬臂尖端上时，第二掩模也用作掩模。 然后剥去第二个掩模，并且将其上沉积的残余涂层剥离。 所得到的弹簧结构包括在指尖的上表面和前边缘（128）上的导电涂层（130）。

公开(公告)号：EP1202296A1

公开(公告)日：2002-05-02

申请号：EP01125671.6

申请日：2001-10-26

Applicant: Xerox Corporation

Inventor： Van Schuylenbergh, Koenraad F. ,  Fork, David K.

IPC: H01F17/00 ,  H01L23/64

CPC classification number: H01L24/49 ,  H01F17/0033 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/45647 ,  H01L2924/00

Abstract: An out-of-plane microcoil (e.g., inductor) including conductive traces formed on a substrate, and then connecting the conductive traces using standard wire bonding techniques. The conductive traces of each microcoil include first and second spaced-apart contact pads, and an elongated interconnect line located between the first and second contact pads. Wire bonding is then performed to place a first wire such that the wire extends from the first contact pad over the substrate surface to a first end of the interconnect line, and to place a second wire such that the wire extends from the second contact pad over the substrate to a second end of the interconnect line. The conductive traces are formed during the final metallization step typically used to form device contact pads on the IC substrate. The wires are placed during, for example, device packaging (i.e., connection of the IC substrate to package terminals). Modern ICs typically require dozens to hundreds of such bonding wires, so the addition of a few wires to produce out-of-plane microcoils does not significantly increase the packaging time or expense.

Abstract translation: 包括形成在衬底上的导电迹线，然后使用标准引线键合技术连接导电迹线的面外微线圈（例如，电感器）。 每个微线圈的导电迹线包括第一和第二间隔开的接触焊盘，以及位于第一和第二接触焊盘之间的细长互连线。 然后执行引线接合以放置第一线，使得导线从衬底表面上的第一接触焊盘延伸到互连线的第一端，并且放置第二线，使得线从第二接触垫延伸到 衬底到互连线的第二端。 在通常用于在IC基板上形成器件接触焊盘的最终金属化步骤期间形成导电迹线。 在例如器件封装（即，IC基板连接到封装端子）期间放置导线。 现代IC通常需要数十至数百种这样的接合线，因此添加几根线以产生平面外的微线圈不会显着增加封装时间或费用。

公开(公告)号：EP1388369B1

公开(公告)日：2015-04-29

申请号：EP03254696.2

申请日：2003-07-28

Applicant: Xerox Corporation

Inventor： Hantschel, Thomas ,  Fork, David K. ,  Rosa, Michael A. ,  DeBruyer, Dirk ,  Chow, Eugene M.

IPC: B01L3/02 ,  B01L3/00 ,  B81B3/00 ,  B01J19/00 ,  G01N35/10 ,  B41J2/16 ,  B41J2/14 ,  C40B60/14 ,  G03F7/00 ,  G01N35/00 ,  B82Y40/00 ,  B82Y10/00

CPC classification number: G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

公开(公告)号：EP1729174A1

公开(公告)日：2006-12-06

申请号：EP06016933.1

申请日：2001-05-10

Applicant: Xerox Corporation

Inventor： Chua, Christopher L. ,  Lemmi, Francesco ,  Schuylenbergh, Koenraad F. ,  Lu, Jeng Ping ,  Fork, David K. ,  Peeters, Eric ,  Sun, Decai ,  Smith, Donald L. ,  Romano, Linda T.

IPC: G03C5/56 ,  G03C5/58 ,  H01L33/00 ,  H01L21/027 ,  G03F7/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可用于高Q电感和变压器的片上集成的平面外微结构使磁场方向平行于衬底（14）平面，而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性部件（61a）。 固有应力分布使形成环形绕组（142）的衬底（14）远离自由部分（11）。 锚定部分（12）保持固定到基底（14）上。 自由部分端部成为可以通过焊接或电镀连接到基板（14）的第二锚定部分（61c）。 一系列单独的线圈结构（140）可以经由其锚固部分连接以形成电感器和变压器。

公开(公告)号：EP1193527B1

公开(公告)日：2006-03-22

申请号：EP01307609.6

申请日：2001-09-07

Applicant: Xerox Corporation

Inventor： Rosa, Michel A. ,  Peeters, Eric ,  Fork, David K.

IPC: G02B26/08 ,  B81B3/00 ,  G02B6/35

CPC classification number: G02B6/3518 ,  B81B2201/045 ,  B81B2203/04 ,  B81C1/00666 ,  G02B6/3556 ,  G02B6/358 ,  G02B6/3584 ,  G02B26/0841

公开(公告)号：EP1193523B1

公开(公告)日：2006-03-22

申请号：EP01307629.4

申请日：2001-09-07

Applicant: Xerox Corporation

Inventor： Peeters, Eric ,  Rosa, Michel A. ,  Fork, David K.

IPC: G02B26/02 ,  G02B26/08 ,  G02B6/35

CPC classification number: G02B6/3518 ,  G02B6/3556 ,  G02B6/358 ,  G02B6/3584 ,  Y10S359/904

公开(公告)号：EP1353443A3

公开(公告)日：2004-08-11

申请号：EP03252001.7

申请日：2003-03-28

Applicant: Xerox Corporation

Inventor： Fork, David K. ,  Solberg, Scott E. ,  Littau, Karl A.

IPC: G01R1/067 ,  G01R3/00

Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.