公开(公告)号：US20180265699A1

公开(公告)日：2018-09-20

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  MING-JAAN HO

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08J3/246 ,  C08J5/18 ,  C08J2351/00 ,  C08J2351/04 ,  C08J2351/06 ,  C08J2351/08 ,  C08J2379/08 ,  C08J2447/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08L51/003 ,  C08L51/006 ,  C08L51/08 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2312/00 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0104 ,  H05K2201/0154 ,  C08L71/12 ,  C08L51/04

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US20180223048A1

公开(公告)日：2018-08-09

申请号：US15686232

申请日：2017-08-25

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MAO-FENG HSU ,  SHOU-JUI HSIANG ,  SZU-HSIANG SU ,  YU-WEN KAO ,  CHIA-YIN TENG ,  MING-JAAN HO ,  YAO-YI CHENG ,  HSIN-MIN HSIAO

IPC: C08G81/02 ,  C09D179/08 ,  C03C17/32 ,  H05K1/03 ,  H05K3/22 ,  H05K1/02

CPC classification number: C08G81/024 ,  C03C17/32 ,  C03C2218/32 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/22 ,  H05K2201/0158 ,  H05K2203/0759

Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.

公开(公告)号：US20180188649A1

公开(公告)日：2018-07-05

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： CHEN-FENG YEN ,  CHANG-HUNG LEE ,  YI-FANG LIN ,  YEN-CHIN HSIAO ,  SHOU-JUI HSIANG ,  MAO-FENG HSU

IPC: G03F7/029 ,  H05K1/03

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

公开(公告)号：US20170369747A1

公开(公告)日：2017-12-28

申请号：US15231723

申请日：2016-08-08

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  HONG-PING LIN

IPC: C09J109/06 ,  B32B27/30 ,  B32B27/18 ,  C09J1/00 ,  C09J7/02 ,  H05K1/03 ,  C08L9/06

CPC classification number: C09J109/06 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/102 ,  B32B2405/00 ,  B32B2457/08 ,  C08L9/06 ,  C08L53/02 ,  C08L2201/02 ,  C08L2203/162 ,  C08L2203/206 ,  C08L2207/324 ,  C09J1/00 ,  C09J153/02 ,  C09J2203/326 ,  C09J2205/114 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  C08L9/00 ,  C08K5/541

Abstract: A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

公开(公告)号：US20170369653A1

公开(公告)日：2017-12-28

申请号：US15497322

申请日：2017-04-26

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： YU-WEN KAO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  SZU-HSIANG SU ,  CHIA-YIN TENG

IPC: C08G73/10 ,  C08J5/18 ,  H05K3/10 ,  H05K1/09 ,  H05K1/03

CPC classification number: C08G73/1085 ,  C08J5/18 ,  C08J2379/08 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/10 ,  H05K2201/0154

Abstract: A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad laminate using the polyamic acid are also provided.

公开(公告)号：US20170079136A1

公开(公告)日：2017-03-16

申请号：US14920634

申请日：2015-10-22

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4626 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0133 ,  H05K2201/0195

Abstract: A circuit board includes at least two substrates and an adhesive film sandwiched between the two substrates. Each substrate includes a base board. The base board includes conductive wires. Each base board is connected to the other base board by the adhesive film. The adhesive film includes two first adhesive layers and a second adhesive layer. The second adhesive layer is sandwiched between the two first adhesive layers. An adhesion force of the first adhesive layer is greater than an adhesion force of the second adhesive layer. A major composition of the second adhesive layer is rubber. The rubber is selected from a group consisting of isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber, acrylic rubber, and polybutadiene rubber, and mixtures thereof.

Abstract translation: 电路板包括至少两个基板和夹在两个基板之间的粘合膜。 每个基板包括基板。 基板包括导线。 每个基板通过粘合膜连接到另一个基板。 粘合剂膜包括两个第一粘合剂层和第二粘合剂层。 第二粘合剂层夹在两个第一粘合剂层之间。 第一粘合剂层的粘附力大于第二粘合剂层的粘附力。 第二粘合剂层的主要组成是橡胶。 橡胶选自异戊二烯橡胶，苯乙烯丁二烯橡胶，乙丙橡胶，丁基橡胶，丙烯酸橡胶和聚丁二烯橡胶，以及它们的混合物。