公开(公告)号：JP4167597B2

公开(公告)日：2008-10-15

申请号：JP2003547301

申请日：2001-11-29

Applicant: アオイ電子株式会社 ,  株式会社テクノネットワーク四国

Inventor： 豊 三原 ,  隆文 原 ,  岳生 吹野 ,  原 橋口 ,  博之 藤田

IPC: B82B3/00 ,  B25J7/00 ,  B25J15/08 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  F03G7/06 ,  G02B21/32

CPC classification number: B81C99/002 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0253 ,  B81B2201/031 ,  F03G7/06 ,  Y10S977/962

公开(公告)号：JP2004509368A

公开(公告)日：2004-03-25

申请号：JP2002527522

申请日：2001-08-17

Applicant: スリーエム イノベイティブ プロパティズ カンパニー

Inventor： ウィーバー，ビリー　エル． ,  ゴーツ，ダグラス　ピー． ,  サイス，シルバ　ケー． ,  スミス，ロバート　ジー． ,  ハマリー，マイク　イー． ,  ヘイゲン，キャシー　エル．

IPC: G02B26/08 ,  H01H1/00 ,  H01H61/01

CPC classification number: B81B3/0024 ,  B81B2201/031 ,  H01H1/0036 ,  H01H61/01 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H2061/008

Abstract: A micrometer sized, single-stage, horizontal and vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The horizontal and vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above and laterally offset from the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator exhibits horizontal and vertical displacement when current is applied to at least the hot arm.

公开(公告)号：KR1020100041710A

公开(公告)日：2010-04-22

申请号：KR1020097027214

申请日：2008-06-26

Applicant: 알카텔-루센트 유에스에이 인코포레이티드

Inventor： 가스패리안아르만 ,  게이츠존반아타 ,  시몬마리아엘리나

IPC: B81B3/00

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H37/00 ,  H01H2001/0047 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract translation: 本发明提供一种双向微电子机械元件，包括双向元件的微机电开关，以及减少双向元件中机械蠕变的方法。 在一个实施例中，双向微机电元件包括​​具有自由端的冷梁和连接到冷束锚的第一端。 冷梁锚附接到基板。 第一束对通过自由端系绳连接到冷束，并且被构造成在被加热时延伸到比冷束的温度更大的温度。 第二光束对位于与第一光束对的冷光束的相对侧上，并且通过自由端系绳耦合到第一光束对和冷光束。 第二束对被配置成在被加热时延长到更高的温度。

公开(公告)号：EP3322665A1

公开(公告)日：2018-05-23

申请号：EP16823599.2

申请日：2016-07-13

Applicant: Intrepid Visions Inc.

Inventor： MENON, Carlo ,  KOMEILI, Mojtaba

IPC: B81B3/00 ,  B81B7/02

CPC classification number: B81B3/0024 ,  B81B7/02 ,  B81B2201/031 ,  B81B2203/053 ,  F03G7/065 ,  H01H2061/006

Abstract: A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce displacement in different direction and amplitudes.

公开(公告)号：EP2785633A1

公开(公告)日：2014-10-08

申请号：EP12794949.3

申请日：2012-11-29

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： CASSET, Fabrice

IPC: B81B3/00 ,  F03G7/06 ,  H01L41/113 ,  H02N10/00 ,  H02N2/00 ,  H03H9/15 ,  F24J3/00 ,  H03H9/24

CPC classification number: F24V99/00 ,  B81B3/0024 ,  B81B3/0081 ,  B81B2201/0271 ,  B81B2201/031 ,  B81B2201/032 ,  F03G7/06 ,  H01L41/1136 ,  H02N2/18

Abstract: The invention relates to a device for generating a second temperature variation ΔΤ
2 from a first use temperature variation ΔΤ
1 , comprising an elastocaloric material layer (30), the internal temperature of which is capable of varying from ΔΤ
2 in response to a given variation Δσ in a mechanical stress applied onto said elastocaloric material layer, the given variation Δσ being induced by the first temperature variation ΔΤ
1 , and a suspended element (24) in mechanical contact with the elastocaloric material layer such as to apply, onto said layer, a mechanical stress that varies in response to the use temperature variation ΔΤ
1 . Said suspended element (24) is set up such as to cause variation, from Δσ, in the mechanical stress applied onto the elastocaloric material layer in response to the temperature variation ΔΤ
1 such as to thereby generate the second temperature variation ΔΤ
2 .

公开(公告)号：EP2038205A4

公开(公告)日：2014-06-18

申请号：EP07720006

申请日：2007-06-21

Applicant: SUN YU ,  KIM KEEKYOUNG

Inventor： SUN YU ,  KIM KEEKYOUNG

IPC: B81C99/00 ,  B25J13/08

CPC classification number: B81C99/002 ,  B25J9/104 ,  B81B2201/0292 ,  B81B2201/031 ,  B81B2201/033

公开(公告)号：EP1085219A3

公开(公告)日：2003-07-09

申请号：EP00810798.9

申请日：2000-09-05

Applicant: Memscap S.A.

Inventor： Dhuler, Vijayakumar R. ,  Hill, Edward ,  Cowen, Allen

IPC: F15C5/00 ,  H01H37/32

CPC classification number: F16K99/0001 ,  B81B3/0024 ,  B81B2201/031 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0036 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H1/0036 ,  H01H37/32 ,  H01H2037/008 ,  Y10S310/06

Abstract: The MEMS thermal actuator (10) includes a microelectronic substrate (14) having a first surface (26) and at least one anchor structure (18,20) affixed to the first surface (26). A composite beam (12) extends from the anchor(s) (18,20) and overlies the first surface (26) of the substrate (14). The composite beam (12) is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface (26) of the microelectronic substrate (14). In one embodiment the composite beam (12) comprises two or more layers (28,30) having materials that have correspondingly different thermal coefficients of expansion. An electrically conductive path may extend throughout the composite beam (12) to effectuate thermal actuation. In one embodiment of the invention a two layer composite beam comprises a first layer (28) of a semiconductor material and a second layer (30) of a metallic material. The semiconductor material may be selectively doped during fabrication so as to create a self-contained heating mechanism within the composite beam. The invention also comprises a MEMS thermal actuator that includes two or more composite beams disposed in an array.

公开(公告)号：EP1081391A3

公开(公告)日：2003-07-02

申请号：EP00810770.8

申请日：2000-08-29

Applicant: Memscap S.A.

Inventor： Dhuler, Vijayakumar R. ,  Walters, Mark David

IPC: F15C5/00

CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

Abstract: A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (50) and a thermally actuated microactuator (20). For example, the MEMS device (10) may be a valve. As such, the valve may include at least one valve plate (30) that is controllably brought into engagement with at least one valve opening (40) in the microelectronic substrate (50) by selective actuation of the microactuator (20). While the MEMS device (10) can include various microactuators (20), the microactuator advantageously includes a pair of spaced apart supports (22) disposed on the substrate (50) and at least one arched beam (24) extending therebetween. The microactuator (20) may further include metallization traces (70) on distal portions (23) of the arched beams (24) to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch (680) for maintaining the valve plate (30) in a desired position without requiring continuous energy input to the microactuator (20).

公开(公告)号：EP3159703A1

公开(公告)日：2017-04-26

申请号：EP16193853.5

申请日：2016-10-14

Applicant: Vmicro ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： WALTER, Benjamin ,  FAUCHER, Marc

IPC: G01Q10/04 ,  B81B3/00 ,  G01Q20/04

CPC classification number: B81B3/0045 ,  B81B3/0021 ,  B81B3/0024 ,  B81B3/0086 ,  B81B2201/02 ,  B81B2201/031 ,  B81B2203/0118 ,  G01P15/123 ,  G01Q10/045 ,  G01Q20/04

Abstract: Dispositif microélectromécanique comprenant une structure mécanique (P1) s'étendant principalement selon une direction longitudinale (x), reliée à un substrat planaire (S) par au moins un ancrage (APLM, APLM2) situé à l'une de ses extrémités et susceptible de fléchir dans un plan parallèle au substrat, ladite structure mécanique comprenant une portion de raccord, qui la relie audit ou à chaque dit ancrage et qui inclut une région résistive (R1) présentant une première (PL1M1) et une deuxième (12) zone d'injection d'un courant électrique pour former un transducteur résistif, ladite région résistive s'étendant principalement dans ladite direction longitudinale à partir dudit ou d'un dit ancrage et étant agencée de telle sorte qu'une flexion de ladite structure mécanique dans ledit plan parallèle au substrat induise dans ladite région résistive une contrainte moyenne non nulle et réciproquement; caractérisé en ce que : ladite première zone d'injection est portée par ledit ancrage ; et ladite deuxième zone d'injection est portée par un élément conducteur non fixé audit substrat et s'étendant principalement dans une direction dite latérale, sensiblement perpendiculaire à ladite direction longitudinale.

Abstract translation: 一种微机电装置，包括一机械结构沿纵向方向延伸，通过在锚固位于其端部中的一个，并能够在平行于基板的平面内弯曲地连接到平面基底，所述机械结构包括接合部分，其离开它 到每个锚固和包括电阻区域呈现第一和第二区，用于电流注入以形成电阻换能器，所述阻性区域从在锚固在纵向方向上延伸并且布置为机械结构的在平行于平面的弯曲 基板诱导在电阻区，反之亦然非零平均应变; worin：第一喷射区由锚固承载; 和第二注入区是由不固定于基板，并在方向上延伸的导电元件，基本上垂直于纵向方向横向称之携带。

公开(公告)号：EP1968885A2

公开(公告)日：2008-09-17

申请号：EP07712639.9

申请日：2007-01-05

Applicant: Centre National de la Recherche Scientifique

Inventor： LUCAT, Claude ,  MENIL, Francis ,  DEBEDA-HICKEL, Hélène ,  GINET, Patrick

IPC: B81C5/00

CPC classification number: B81C99/0095 ,  B81B2201/0271 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/0118 ,  H01L41/107 ,  H01L41/27 ,  H01L41/29 ,  H01L41/314 ,  Y10T29/42 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: The invention relates to the production of multilayer microcomponents comprising one or more layers, each consisting of a material M chosen from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing, on a substrate, one or more layers of an ink P and one or more layers of an ink M, each layer being deposited in a predetermined pattern, each ink layer being at least partially consolidated before deposition of the next layer, in completely consolidating the partially consolidated layers of ink M after their deposition, and in completely or partially removing the material of each of the layers of ink P. An ink P consists of a thermosetting resin containing a mineral filler or of a mixture comprising a mineral material and an organic binder. An ink M consists of a mineral material that is a precursor of the material M and an organic binder. The inks are deposited by casting or by extrusion.