Abstract:
The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.
Abstract:
A package to receive a memory device including an electromagnetic motor comprises a body having a top surface and a bottom surface. Conductive leads extend through the body so that the conductive leads are at least partially exposed within the package. A base is connectable with the bottom surface of the body, and a lid is connectable with the top surface of the body. The base and the lid have substantially matched thermal expansion characteristics and provide magnetic flux return paths for the electromagnetic motor.
Abstract:
In one embodiment, the present invention includes a method for forming a sacrificial oxide layer on a base layer of a microelectromechanical systems (MEMS) probe, patterning the sacrificial oxide layer to provide a first trench pattern having a substantially rectangular form and a second trench pattern having a substantially rectangular portion and a lateral portion extending from the substantially rectangular portion, and depositing a conductive layer on the patterned sacrificial oxide layer to fill the first and second trench patterns to form a support structure for the MEMS probe and a cantilever portion of the MEMS probe. Other embodiments are described and claimed.
Abstract:
The hinge (13) should preferably be formed to have a higher resistance than ever against the pivoting of the mirror body (12) to effectively prevent the hinge (13) from being damaged. By adopting a suitable one of a variety of production steps as necessary, the hinge (13) can be formed more finely and with a higher precision and thus the micro mirror unit can be produced more easily in a shorter time. To this end, the hinge (13) is formed from a different material, such as SiNx, from the mirror substrate material from which the frame (11) and mirror body (12) are formed.
Abstract translation:优选地,铰链(13)形成为具有比以往更高的抗反射镜主体(12)的枢转的阻力,以有效地防止铰链(13)被损坏。 通过根据需要采用各种生产步骤中的合适的一种,铰链(13)可以更精细地形成并且具有更高的精度,从而可以在更短的时间内更容易地制造微反射镜单元。 为此,铰链(13)由形成框架(11)和反射镜主体(12)的反射镜基板材料由不同的材料(例如SiN x x)形成。
Abstract:
A thermal actuator includes a first arm having a proximal end and a distal end, a second arm, parallel to the first arm, having a proximal end and a distal end, and a third arm arranged between and parallel to the first and second arms, the third arm having a proximal end and a distal end. The third arm has at least one portion at the distal end of the third arm having a width that is substantially larger than a width of the first arm and a width of the second arm. The distal ends of the first, second and third arms are coupled together to form a distal end of the thermal actuator, and the first, second and third arms preferably are made of a single material. When the proximal end of the third arm is coupled to ground and current is applied to the proximal end of the first arm, the distal end of the thermal actuator moves and applies force in a first direction, and when the proximal end of the third arm is coupled to ground and current is applied to the proximal end of the second arm, the distal end of the thermal actuator moves and applies force in a direction opposite to the first direction. A number of thermal actuators can be arranged in an array. The thermal actuator or array of thermal actuators can be coupled to an applicator.
Abstract:
The hinge (13) should preferably be formed to have a higher resistance than ever against the pivoting of the mirror body (12) to effectively prevent the hinge (13) from being damaged. By adopting a suitable one of a variety of production steps as necessary, the hinge (13) can be formed more finely and with a higher precision and thus the micro mirror unit can be produced more easily in a shorter time. To this end, the hinge (13) is formed from a different material, such as SiNx, from the mirror substrate material from which the frame (11) and mirror body (12) are formed.
Abstract:
A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.
Abstract:
The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.