Abstract:
It is an object of the present invention to provide an projection imaging type electron microscope in which the imposition of restrictions on the design of the illumination electron optical system by the conditions of the projection electron optical system is alleviated, so that the degree of freedom in the design of the illumination electron optical system is increased. Generated electrons 6b (principal rays) emitted from the sample 5 parallel to the optical axis are focused by a cathode lens so that these electrons cross the optical axis 3 at one point. This point is the first crossover. The generated electrons 6b are oriented parallel to the optical axis by the cathode lens 4a, and are focused as an image at the position of the electromagnetic prism 2; these electrons pass through the stigmator 7, and are incident on the relay lens 8a. These electrons are again focused, and cross the optical axis 3 at one point. This position is the second crossover. An aperture diaphragm 11 is disposed in this second crossover position. As a result, the need to install an aperture diaphragm in the first crossover position is eliminated, so that design of the illumination electron optical system is facilitated.
Abstract:
It is an object of the present invention to provide an projection imaging type electron microscope in which the imposition of restrictions on the design of the illumination electron optical system by the conditions of the projection electron optical system is alleviated, so that the degree of freedom in the design of the illumination electron optical system is increased. Generated electrons 6b (principal rays) emitted from the sample 5 parallel to the optical axis are focused by a cathode lens so that these electrons cross the optical axis 3 at one point. This point is the first crossover. The generated electrons 6b are oriented parallel to the optical axis by the cathode lens 4a, and are focused as an image at the position of the electromagnetic prism 2; these electrons pass through the stigmator 7, and are incident on the relay lens 8a. These electrons are again focused, and cross the optical axis 3 at one point. This position is the second crossover. An aperture diaphragm 11 is disposed in this second crossover position. As a result, the need to install an aperture diaphragm in the first crossover position is eliminated, so that design of the illumination electron optical system is facilitated.
Abstract:
An object (14) is imaged on an imaging surface (16) by means of a telescopic system of rotationally symmetrical electron lenses (10, 12). The imaging system includes two quadrupoles, each of which coincides with one of the two round lenses (10, 12), so that the electrons are concentrated in line-shaped focal spots instead of a (small) circular cross-over (18). The system remains telescopic to a high degree and the imaging remains stigmatic.
Abstract:
According to a known projection lithography method an object (14) is imaged on an imaging surface (16) by means of a telescopic system of rotationally symmetrical electron lenses (10, 12). The throughput during the production of integrated circuits by means of projection lithography is determined by the amount of current in the imaging electron beam; this current is limited by the resolution-limiting interaction of the electrons (Coulomb interaction). The invention allows for a larger beam current in that areas (18) with a high current concentration are avoided. To this end, the imaging system includes five mutually perpendicular quadrupoles (32, 34, 36, 38, 40), so that the electrons are concentrated in line-shaped focal spots instead of a (small) circular cross-over (18). The system is telescopic and the imaging is stigmatic with equal magnifications in the x-z plane and the y-z plane.
Abstract:
According to a known projection lithography method an object (14) is imaged on an imaging surface (16) by means of a telescopic system of rotationally symmetrical electron lenses (10, 12). The throughput during the production of integrated circuits by means of projection lithography is determined by the amount of current in the imaging electron beam; this current is subject to a limit which is imposed by the resolution-limiting interaction of the electrons (Coulomb interaction). The invention allows for a larger beam current in that areas (18) with a high current concentration are avoided. To this end, the imaging system includes two quadrupoles, each of which coincides with one of the two round lenses (10, 12), so that the electrons are concentrated in line-shaped focal spots instead of a (small) circular cross-over (18). The system remains telescopic to a high degree and the imaging remains stigmatic.
Abstract:
According to a known projection lithography method an object (14) is imaged on an imaging surface (16) by means of a telescopic system of rotationally symmetrical electron lenses (10, 12). The throughput during the production of integrated circuits by means of projection lithography is determined by the amount of current in the imaging electron beam; this current is limited by the resolution-limiting interaction of the electrons (Coulomb interaction). The invention allows for a larger beam current in that areas (18) with a high current concentration are avoided. To this end, the imaging system includes five mutually perpendicular quadrupoles (32, 34, 36, 38, 40), so that the electrons are concentrated in line-shaped focal spots instead of a (small) circular cross-over (18). The system is telescopic and the imaging is stigmatic with equal magnifications in the x-z plane and the y-z plane.