Abstract:
Improvement of control of size and structure of nanoclusters with a nanocluster production apparatus is intended. Increase of an obtained amount and a yield of nanoclusters having size and structure, at least one of which is selected, is intended. A nanocluster production apparatus has a vacuum chamber, a sputtering source that generates plasma by pulse discharge, a pulse power supply that supplies a pulsed power to the sputtering source, a first inert gas supply device that supplies a first inert gas to the sputtering source, a nanocluster growth cell stored in the vacuum chamber and a second inert gas introduction device that introduces a second inert gas into the nanocluster growth cell.
Abstract:
High density plasma is obtained by generating plasma by electron cyclotron resonance utilizing microwave and entrapping the plasma in a plasma generation chamber by a mirror magnetic field. A target (23) is disposed in the plasma generation chamber (14) and is sputtered by ions in the high density plasma. Thus, large quantities of ions can be generated. The ion generation apparatus of the invention can be applied to a thin film formation apparatus which introduces the ions and neutral particles onto a substrate (21) to form a thin film, and also to an ion source by providing an ion pickup grid in order to form a thin film on the substrate or to etch the thin film. The film can be formed at a high speed even when the voltage to be applied to the target is reduced, by disposing permanent magnets (34A, 34B) for leaking the inner surface magnetic flux of the target at the positions corresponding to the upper and lower ends of the target (23) in the plasma generation chamber (14).
Abstract:
Improvement of control of size and structure of nanoclusters with a nanocluster production apparatus is intended. Increase of an obtained amount and a yield of nanoclusters having size and structure, at least one of which is selected, is intended. A nanocluster production apparatus has a vacuum chamber, a sputtering source that generates plasma by pulse discharge, a pulse power supply that supplies a pulsed power to the sputtering source, a first inert gas supply device that supplies a first inert gas to the sputtering source, a nanocluster growth cell stored in the vacuum chamber and a second inert gas introduction device that introduces a second inert gas into the nanocluster growth cell.
Abstract:
The device comprises a cylindrical casing (1) provided with an internal cavity (2) and with a flange (3) and an arc chamber (15) superimposed over the cylindrical casing (1) and including a filament (20) electrically supplied through supply conductors (8, 7, 6) external to said casing (1) and supported by said flange (3), a repeller plate (21) held at a negative voltage through supply conductors (8, 7, 6) external to said casing (1) and supported by said flange (3) and an inlet (19) for a gas which may be ionized. Inside the arc chamber (15) there is also a support (23) for the metal to be ionized (24) supported and connected electrically to an electrode (13) at a negative voltage by means of a rod (9) passing through the internal cavity (2) of said cylindrical casing (1).
Abstract:
Disclosed are embodiments of an ion beam sample preparation and coating apparatus and methods. A sample may be prepared in one or more ion beams and then a coating may be sputtered onto the prepared sample within the same apparatus. A vacuum transfer device may be used with the apparatus in order to transfer a sample into and out of the apparatus while in a controlled environment. Various methods to improve preparation and coating uniformity are disclosed including: rotating the sample retention stage; modulating the sample retention stage; variable tilt ion beam irradiating means, more than one ion beam irradiating means, coating thickness monitoring, selective shielding of the sample, and modulating the coating donor holder.
Abstract:
In order to simplify the structure of a metal-ion source, in particular a source for the implantation of low doses of non-volatile metals in semiconductor wafers, the invention calls for the metal-ion source to include an electrically-heated thermionic cathode in the form of a hot wire inside an ion chamber (1a), the hot wire (3) being located close to an element (6) made of the metal to be ionized and being at substantially the same potential.
Abstract:
The device comprises a cylindrical casing (1) provided with an internal cavity (2) and with a flange (3) and an arc chamber (15) superimposed over the cylindrical casing (1) and including a filament (20) electrically supplied through supply conductors (8, 7, 6) external to said casing (1) and supported by said flange (3), a repeller plate (21) held at a negative voltage through supply conductors (8, 7, 6) external to said casing (1) and supported by said flange (3) and an inlet (19) for a gas which may be ionized. Inside the arc chamber (15) there is also a support (23) for the metal to be ionized (24) supported and connected electrically to an electrode (13) at a negative voltage by means of a rod (9) passing through the internal cavity (2) of said cylindrical casing (1).
Abstract:
A deposition tool includes a vacuum chamber and a physical vapor deposition module including a target source in the vacuum chamber. The target source includes a target material for depositing on a workpiece. An evaporator module is independent of the physical vapor deposition module and is mounted within an enclosure in the vacuum chamber. A gate is configured to selectively open the enclosure to permit evaporation of a coating element to coat the target source in the physical vapor deposition module.
Abstract:
A Zr-based or Zr—Cu based metallic glass thin film (MGTF) coated on aluminum alloy substrate and a method of fabricating the metallic glass and MGTF coated on aluminum alloy substrate are disclosed. The Zr-based metallic glass thin film-coated aluminum alloy substrate of the present invention comprises: an aluminum alloy substrate; and a Zr-based metallic glass thin film located on the substrate, in which the Zr-based metallic glass is represented by the formula of (ZraCubNicAld)100-xSix, wherein 45=