-
公开(公告)号：JP2014205237A
公开(公告)日：2014-10-30
申请号：JP2014126143
申请日：2014-06-19
Applicant: ハネウェル・インターナショナル・インコーポレーテッド , Honeywell Internatl Inc
Inventor： CARLSON ROBERT J
CPC classification number: B29C33/3842 , B29C41/00 , B29C59/14 , B29C59/16 , B29K2909/00 , B29K2995/0037 , B81B7/00 , B81B2201/05 , B81B2201/058 , B81B2203/0127 , B81C99/009 , B81C2201/0132 , B81C2201/0143 , B81C2201/034 , C23F1/02 , H01L21/30604 , H05K999/00 , Y10T428/24496
Abstract: 【課題】微小電気機械システム(MEMS)においてパターン形成された材料層を形成するために必要とされる時間を削減する。【解決手段】基板30上のエアロゲルベース層31にパターン形成する。エアロゲルベース層は、微小電気機械特徴の少なくとも一部の型として機能する。エアロゲルベース層に形成された微小電気機械特徴の少なくとも一部の外形上に、重い材料層34を直接堆積し、重い材料の層を残すように基板からエアロゲルベース層を取り除くことで微小電気機械構造を形成する。エアロゲルの密度は、ポリシリコン、酸化シリコン、単結晶シリコン、金属、合金等のMEMS製造に用いられる典型的な材料よりも小さい。それゆえ、重い材料で構造的特徴を形成する場合の速度よりも、エアロゲルベース層で構造的特徴を有意に高い速度で形成することができる。【選択図】図3
Abstract translation: 要解决的问题：减少在微机电系统（MEMS）中形成图案化材料层所需的时间。解决方案：将气凝胶基层31沉积到基底30上。气凝胶基层至少用作模具 部分微机电特征。 致密材料层34直接沉积在已经形成在气凝胶基层中的微机电特征的至少一部分的轮廓上，并且气相凝胶基材料从基底去除以留下致密材料层， 从而制造微机电结构。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，气凝胶层中的结构特征可以以比在更致密的材料中形成结构特征的速率显着更高的速率形成。
-
公开(公告)号：JP2014144529A
公开(公告)日：2014-08-14
申请号：JP2013267160
申请日：2013-12-25
Applicant: Commissariat A L'energie Atomique & Aux Energies Alternatives , コミサリア ア レネルジィ アトミーク エ オ ゼネ ルジイ アルテアナティーフCommissariat A L’Energie Atomique Et Aux Energies Alternatives
Inventor： RAPHAEL RENAUDOT , VINCENT AGACHE , YVES FOUILLET
IPC: B81C1/00 , B01J19/00 , C09J4/00 , C09J163/00 , C09J183/04 , G01N37/00
CPC classification number: C25D1/12 , B81C99/009 , B81C2201/034
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a micro fluid channel having a semicircular cross-section by a program-controllable and reconfigurable method.SOLUTION: There is provided a method for forming a micro fluid array which comprises at least one channel of a semicircular cross-section, which includes: a step of allowing first liquid to contact an array of electrodes of a micro fluid chip 1 provided with at least one pair of electrodes 3a, 3b, which are arranged on a substrate, substantially parallel and on the same plane; a step of activating the first liquid by liquid dielectrophoresis (LDEP), and driving the electrode array so as to form a fluid structure including at least one fluid finger; and a step of using the fluid structure as a mold, and forming the micro fluid array by solidification or curing of second liquid (11) accumulated on the micro fluid chip while the liquid is tightly fitted to the shape of the fluid structure.
Abstract translation: 要解决的问题：提供一种通过程序可控和可重新配置的方法有效地制造具有半圆形横截面的微流体通道的方法。解决方案：提供了一种用于形成微流体阵列的方法，该方法包括至少一个通道 其包括：允许第一液体接触设置有至少一对电极3a，3b的微流体芯片1的电极阵列的步骤，所述至少一对电极3a，3b布置在基板上，基本上平行， 在同一架飞机上 通过液体介电电泳（LDEP）激活第一液体的步骤，以及驱动电极阵列以形成包括至少一个流体手指的流体结构; 以及使用流体结构作为模具的步骤，以及当液体紧密地配合到流体结构的形状时，通过使积聚在微流体芯片上的第二液体（11）的固化或固化来形成微流体阵列。
-
公开(公告)号：JP5361130B2
公开(公告)日：2013-12-04
申请号：JP2006554396
申请日：2006-08-25
Applicant: 公益財団法人神奈川科学技術アカデミー
CPC classification number: B81C99/0085 , B01D67/0065 , B01D71/025 , B01D2325/021 , B81C2201/034 , C25D11/045
Abstract: Pores of an anodized porous alumina having a porous surface structure are filled with a material and then the anodized porous alumina is dissolved and removed, thereby forming a stamper which is made of the material and has a reverse structure of the surface structure of the alumina. By transferring the reverse structure of the stamper to a polymer, there is produced a porous polymer membrane having the surface structure of the alumina. Consequently, a large-sized porous polymer membrane having a surface structure, wherein pores of a uniform size are formed orthogonal to the membrane surface, can be produced without requiring a complicated process.
-
公开(公告)号：JP4709322B2
公开(公告)日：2011-06-22
申请号：JP2010226766
申请日：2010-10-06
Inventor： アルバート・エフ・イェー , イェン・ペン・コン , ステラ・ダブリュー・パン , ホン・イェー・ロウ
IPC: B29C59/02 , B28B11/08 , B81C1/00 , B81C99/00 , B82B1/00 , B82B3/00 , G03C5/00 , G03F7/00 , H01L21/027
CPC classification number: A61M25/00 , B27N3/08 , B28B3/06 , B81C99/0085 , B81C2201/034 , B81C2203/032 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24479 , Y10T428/254
-
295.发明专利Imprinting method for three-dimensional micro- or nano-structure supported and independent 有权支持和独立的三维微结构或纳米结构的印刷方法
公开(公告)号：JP2011011558A
公开(公告)日：2011-01-20
申请号：JP2010226766
申请日：2010-10-06
Applicant: Agency For Science Technology & Research , Regents Of The Univ Of Michigan , エージェンシー フォー サイエンス,テクノロジー アンド リサーチ , ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン
Inventor： KONG YEN PENG , LOW HONG YEE , PANG STELLA W , YEE ALBERT F
IPC: B29C59/02 , B28B11/08 , B81C1/00 , B81C99/00 , B82B1/00 , B82B3/00 , G03C5/00 , G03F7/00 , H01L21/027
CPC classification number: A61M25/00 , B27N3/08 , B28B3/06 , B81C99/0085 , B81C2201/034 , B81C2203/032 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24479 , Y10T428/254
Abstract: PROBLEM TO BE SOLVED: To provide a method for assembling a 3D polymer structure, which is structured to have characterized goods in the size of a range from a nanoscale to a microscale.SOLUTION: The method for assembling the 3D polymer structure includes (a) the step of forming the first 3D polymer structure on a substrate, (b) the step of forming the second 3D polymer structure in a surface-treated mold, (c) the step of connecting the first and second 3D polymer structures, and (d) the steps of separating the surface-treated mold from the second 3D polymer structure, and forming the assembling structure made of the second 3D polymer structure on the first 3D polymer structure.
Abstract translation: 要解决的问题：提供一种组装3D聚合物结构的方法，该3D聚合物结构被构造成具有从纳米级到微米级的尺寸的特征商品。解决方案：组装3D聚合物结构的方法包括（a） 在基板上形成第一3D聚合物结构的步骤，（b）在表面处理的模具中形成第二3D聚合物结构的步骤，（c）连接第一和第二3D聚合物结构的步骤，和（d ）分离表面处理的模具与第二3D聚合物结构的步骤，以及在第一3D聚合物结构上形成由第二3D聚合物结构制成的组装结构。
-
Patent Agency Ranking296.发明专利
公开(公告)号：JP4586021B2
公开(公告)日：2010-11-24
申请号：JP2006527164
申请日：2004-09-23
Applicant: カリフォルニア インスティテュート オブ テクノロジー , ザ ユニバーシティ オブ ノース カロライナ アット チャペル ヒルThe University Of North Carolina At Chapel Hill
Inventor： ピー． ロルランド ジャソン , ヤルブロウグフ ジャソン , エム． デシモネ ジョセプフ , アール． クアケ ステプハン , エー． スチョルズマン デレク , バン ダム ミカエル
IPC: G01N35/08 , B29C39/10 , B29K27/12 , B29K71/00 , B81B1/00 , C08G20060101 , G01N21/78 , G01N30/88 , G01N37/00
CPC classification number: B01L3/502707 , B01L3/0268 , B01L3/502738 , B01L7/52 , B01L2200/12 , B01L2300/0816 , B01L2400/0481 , B01L2400/0655 , B81B1/006 , B81B2201/058 , B81B2203/0323 , B81C2201/034 , B82Y10/00 , B82Y40/00 , C08G18/5015 , C08G18/8116 , C08G65/007 , C08G65/33348 , C08G2650/48 , C09D163/00 , C09D171/02 , F16K99/0001 , F16K99/0015 , F16K99/0026 , F16K99/0034 , F16K99/0036 , F16K99/0042 , F16K99/0046 , F16K99/0051 , F16K99/0059 , F16K99/0061 , F16K99/0065 , F16K2099/008 , F16K2099/0084 , F16K2099/0086 , G03F7/0002 , Y10T137/0396 , Y10T428/24479 , Y10T428/249954 , Y10T428/3154
-
297.发明专利
公开(公告)号：JP4466074B2
公开(公告)日：2010-05-26
申请号：JP2003431801
申请日：2003-12-26
Applicant: 株式会社日立製作所
IPC: B81C1/00 , G01N33/53 , B29C33/38 , B29C33/42 , B81C99/00 , B82B3/00 , C12M1/00 , C12N15/09 , C23C18/16 , C23C18/42 , G01N37/00 , H01J1/304 , H01J9/02 , H01L21/027
CPC classification number: B29C33/3842 , B29C33/424 , B81B2203/0361 , B81C1/00111 , B81C1/00206 , B81C99/0085 , B81C99/009 , B81C2201/034 , B82Y10/00 , B82Y40/00 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1657 , C23C18/1689 , C23C18/208 , C23C18/42 , G03F7/0002 , H01J1/304 , H01J9/025 , Y10T428/12389 , Y10T428/12993
Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.
-
公开(公告)号：JP4457229B2
公开(公告)日：2010-04-28
申请号：JP2005510475
申请日：2003-11-10
Inventor： ユアン キュイ， , ペイ イング， ジョイス タン， , メイ マ チェン， , チョングリ リ， , チー， イェン リム，
IPC: A61M37/00 , A61M5/32 , B29C33/38 , B29C33/42 , B29C45/00 , B29C45/37 , B29L15/00 , B81B1/00 , B81C1/00 , B81C99/00
CPC classification number: B81C1/00111 , A61M37/0015 , A61M2037/003 , A61M2037/0046 , A61M2037/0053 , B29C33/3878 , B29C33/42 , B29C45/00 , B29C2045/0094 , B29L2031/7544 , B29L2031/756 , B81B2201/055 , B81C2201/034
-
公开(公告)号：JP4350732B2
公开(公告)日：2009-10-21
申请号：JP2006192551
申请日：2006-07-13
IPC: C01B31/02
CPC classification number: H01L21/76877 , B81B2203/04 , B81B2207/07 , B81C99/0085 , B81C2201/034 , B82Y10/00 , H01F41/041 , H01L21/76885 , H01L23/5223 , H01L23/5227 , H01L23/53276 , H01L51/0048 , H01L2221/1094 , H01L2924/0002 , H01L2924/00
Abstract: A method of fabricating a semiconductor device by filling carbon nanotubes in a recess is disclosed. The method of fabricating the semiconductor device comprises patterning a mold on a substrate, coating carbon nanotubes on an entire surface of the recess and the mold formed by the patterning, filling the carbon nanotubes coated on the an entire surface of the mold in the recess, and removing the mold.
-
300.发明专利Method of forming carbon nanotube on substrate, method of forming conducting wire utilizing same, and manufacturing method of inductor element utilizing same 有权在基板上形成碳纳米管的方法，使用其形成导线的方法以及利用其的电感元件的制造方法
公开(公告)号：JP2007063116A
公开(公告)日：2007-03-15
申请号：JP2006192551
申请日：2006-07-13
Applicant: Korea Advanced Inst Of Sci Technol , 韓国科学技術院
Inventor： LEE BYONCHORU , LEE JEONG OEN , CHOI YANG-KYU , YOON JUN BO
IPC: C01B31/02
CPC classification number: H01L21/76877 , B81B2203/04 , B81B2207/07 , B81C99/0085 , B81C2201/034 , B82Y10/00 , H01F41/041 , H01L21/76885 , H01L23/5223 , H01L23/5227 , H01L23/53276 , H01L51/0048 , H01L2221/1094 , H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an element, in more details, to provide a method of manufacturing an element through filling a groove with a carbon nanotube. SOLUTION: The manufacturing method of an element comprises a step of patterning a mold on a substrate, a step of applying a carbon nanotube in the groove formed by the patterning and on the whole surface of the mold, a step of filling the groove with the carbon nanotube applied on the whole surface of the mold, and a step for removing the mold. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种制造元件的方法，更详细地，提供一种通过用碳纳米管填充凹槽来制造元件的方法。 解决方案：元件的制造方法包括在基板上图案化模具的步骤，在通过图案化形成的凹槽中和在模具的整个表面上施加碳纳米管的步骤，填充 具有施加在模具的整个表面上的碳纳米管的凹槽和用于移除模具的步骤。 版权所有（C）2007，JPO＆INPIT
-
-
-
-
-
-
-
-
-
Search Results
534
records
(took 0.035 seconds)
