公开(公告)号：US20240241395A1

公开(公告)日：2024-07-18

申请号：US18623009

申请日：2024-03-31

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Yueqiang WANG ,  Haofeng ZHANG ,  Yongjian LI ,  Yunbin CHEN ,  Fen YOU ,  Lei ZHANG

IPC: G02C11/00 ,  G02C5/14 ,  G02C5/22 ,  G02C11/06 ,  H04R1/02 ,  H04R1/04 ,  H04R1/06 ,  H04R1/10 ,  H04R1/28 ,  H04R9/02 ,  H04R9/06 ,  H04R25/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02C11/10 ,  G02C5/14 ,  G02C5/143 ,  G02C5/22 ,  G02C5/2254 ,  G02C11/06 ,  H04R1/02 ,  H04R1/028 ,  H04R1/04 ,  H04R1/06 ,  H04R1/10 ,  H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1075 ,  H04R1/1083 ,  H04R1/28 ,  H04R9/02 ,  H04R9/025 ,  H04R9/06 ,  H04R25/65 ,  H05K1/028 ,  H05K1/189 ,  H04R2460/13 ,  H05K2201/05

Abstract: The present disclosure provides glasses including: a glasses rim; a glasses temple comprising a control circuit or a battery; a rotating shaft configured to connect the glasses rim and the glasses temple, so that the glasses rim and the glasses temple are able to relatively rotate around the rotating shaft, the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; a connection wire passing through the rotating shaft wiring channel and extending to the glasses rim and the glasses temple, respectively; a speaker comprising an earphone core and being connected to the glasses temple, the control circuit or the battery driving the earphone core to vibrate to generate a sound through the connection wire; and at least two microphones disposed in the glasses temple or the speaker, the at least two microphones being located at positions with different distances from a mouth of a user.

公开(公告)号：US20240215153A1

公开(公告)日：2024-06-27

申请号：US18239782

申请日：2023-08-30

Applicant: JX Metals Corporation

Inventor： Yuji Ishino ,  Takao Ikeda

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K3/4635 ,  H05K2201/0355 ,  H05K2201/05

Abstract: A copper foil, wherein at least one surface of the copper foil has a developed interfacial area ratio (sdr) of 0.0030 or less.

公开(公告)号：US12007355B2

公开(公告)日：2024-06-11

申请号：US16747663

申请日：2020-01-21

Applicant: Kuan-Chien Chou ,  Boon-Ping Soh

Inventor： Kuan-Chien Chou ,  Boon-Ping Soh

IPC: G01N27/414 ,  A61B5/00 ,  A61B5/024 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01N27/4146 ,  H05K1/0283 ,  H05K1/189 ,  A61B5/02438 ,  A61B5/6804 ,  H05K2201/05

Abstract: A stretchable and flexible sensing device includes a first elastic membrane, a first strain sensor and a processing unit. The first elastic membrane has a first surface, a second surface and a plurality of electrode contacts. The first surface and the second surface are disposed of opposite to each other and the electrode contacts are disposed on the first surface. One of the electrode contacts is as ground terminal. The first strain sensor is disposed on the first surface by printing technology so as to electrically connect to the electrode contacts. The processing unit is electrically connected to the electrode contacts. The processing unit operates according to a stretch resistance value of one of the first strain sensor.

公开(公告)号：US11968788B2

公开(公告)日：2024-04-23

申请号：US17333274

申请日：2021-05-28

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： Yong-Quan Yang ,  Han-Pei Huang

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/303 ,  H05K2201/0364 ,  H05K2201/05

Abstract: A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.

公开(公告)号：US20230413427A1

公开(公告)日：2023-12-21

申请号：US18458457

申请日：2023-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongki JEONG ,  Jingook KIM ,  Chijoon KIM ,  Seungwhee CHOI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K5/00 ,  G06F1/16

CPC classification number: H05K1/028 ,  H05K1/181 ,  H05K3/4038 ,  H05K5/0026 ,  G06F1/1652 ,  H05K2201/05 ,  H05K2201/10128 ,  H05K2203/1147 ,  H05K2201/0137

Abstract: An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.

公开(公告)号：US20230397332A1

公开(公告)日：2023-12-07

申请号：US18027590

申请日：2021-09-13

Applicant: JUMATECH GMBH

Inventor： Philipp WÖLFEL

IPC: H05K1/05 ,  H05K3/04 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/05 ,  H05K3/043 ,  H05K1/147 ,  H05K1/028 ,  H05K2203/0307 ,  H05K2201/05

Abstract: A method for producing a circuit board and a shaped part for use in this method are provided. To simplify the production of circuit boards, save insulating material and thereby also reduce the height of the circuit board for efficient heat management, the method according to the invention for producing circuit boards comprises the following steps: Step A: providing an electrically conducting shaped part (1) with at least two segments (2a-g), which are integrally connected just by webs of material (M); Step B: embedding the segments (2a-g) in insulating material to form at least one circuit-board substrate (LS); Step C: applying a conductor structure (4a, 4b) to the circuit-board substrate (LS) to form the circuit board (LP); and Step D: releasing the integral connection of the segments (2a-g) by breaking through the webs of material (M).

公开(公告)号：US20230358615A1

公开(公告)日：2023-11-09

申请号：US18356772

申请日：2023-07-21

Applicant: LISA DRÄXLMAIER GMBH

Inventor： Stephan SCHAFFERHANS ,  Krzysztof MURGOTT

IPC: H05K1/05 ,  H05K1/02 ,  G01K1/143

CPC classification number: G01K1/143 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/05 ,  G01K2217/00 ,  H05K2201/05 ,  H05K2201/06 ,  H05K2201/10303

Abstract: The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.

公开(公告)号：US11698297B2

公开(公告)日：2023-07-11

申请号：US17020733

申请日：2020-09-14

Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.

Inventor： Chaoxi Chen

IPC: G01J1/42 ,  G01J1/02 ,  G06F1/16 ,  H05K5/00 ,  H04M1/02 ,  H04M1/72454 ,  G09G3/36 ,  G06F3/041

CPC classification number: G01J1/4204 ,  G01J1/0271 ,  G06F1/1647 ,  G06F1/1652 ,  G06F1/1677 ,  H04M1/0214 ,  H04M1/0241 ,  H04M1/0268 ,  H05K5/0017 ,  G06F1/1684 ,  G06F3/0416 ,  G09G3/36 ,  G09G2320/0626 ,  H04M1/72454 ,  H05K2201/05

Abstract: The present disclosure relates to a method and device for detecting ambient light, an electronic device and a storage medium. The electronic device includes: a first screen, the first screen being a foldable flexible screen; multiple light sensors, orientations of light sensing surfaces of the multiple light sensors being different; and at least one processor electronically connected with the first screen and the light sensors respectively and configured to select a target light sensor from the multiple light sensors according to a present state of the first screen and obtain target detection data representing present ambient brightness according to detection data of the target light sensor.

公开(公告)号：US11696402B2

公开(公告)日：2023-07-04

申请号：US17951547

申请日：2022-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung Bae ,  Wonkyu Kwak ,  Cheolgeun An

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/00 ,  G02F1/1345 ,  H05K3/36 ,  H05K3/30 ,  H01L23/495

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L24/06 ,  H05K1/111 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/50

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.