公开(公告)号：US20140124913A1

公开(公告)日：2014-05-08

申请号：US13668077

申请日：2012-11-02

Applicant: NVIDIA CORPORATION

Inventor： Leilei Zhang ,  Ron Boja ,  Abraham Yee ,  Zuhair Bokharey

IPC: H01L23/52

CPC classification number: H01L23/3128 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/2009 ,  H01L2224/05599

Abstract: A packaging substrate, a packaged semiconductor device, a computing device and methods for forming the same are provided. In one embodiment, a packaging substrate is provided that includes a packaging structure having a chip mounting surface and a bottom surface. The packaging structure has at a plurality of conductive paths formed between the chip mounting surface and the bottom surface. The conductive paths are configured to provide electrical connection between an integrated circuit chip disposed on the chip mounting surface and the bottom surface of the packaging structure. The packaging structure has an opening formed in the chip mounting surface proximate a perimeter of the packaging structure. A stiffening microstructure is disposed in the opening and is coupled to the packaging structure.

Abstract translation: 提供了一种封装基板，封装半导体器件，计算装置及其形成方法。 在一个实施例中，提供了包括具有芯片安装表面和底面的封装结构的封装基板。 封装结构具有形成在芯片安装表面和底表面之间的多个导电路径。 导电路径被配置为在布置在芯片安装表面上的集成电路芯片和封装结构的底表面之间提供电连接。 包装结构具有接近包装结构的周边的芯片安装表面中形成的开口。 加强的微观结构设置在开口中并且联接到包装结构。

公开(公告)号：US20140014399A1

公开(公告)日：2014-01-16

申请号：US13754185

申请日：2013-01-30

Applicant: IBIDEN CO., LTD.

Inventor： Takashi KARIYA ,  Toshiki FURUTANI ,  Takeshi FURUSAWA

IPC: H05K1/02

CPC classification number: H05K1/02 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

Abstract translation: 印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。 芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层 第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，以及第一和第二结构 第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。 ％。

公开(公告)号：US08525042B2

公开(公告)日：2013-09-03

申请号：US12690147

申请日：2010-01-20

Applicant: Mitsunori Abe ,  Takashi Fukuda

Inventor： Mitsunori Abe ,  Takashi Fukuda

IPC: H05K1/16 ,  H05K7/00

CPC classification number: H05K1/111 ,  H01L2224/0401 ,  H01L2224/16238 ,  H01L2224/81385 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/046 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: A printed circuit board on which a surface mount electronic device is mounted. The printed circuit board includes a substrate on which land arrangements are disposed in an array. Each land arrangement includes a core portion and drawing portions. The drawings are disposed along diagonal directions relative to the core portions of the array of the land arrangements.

Abstract translation: 安装有表面安装电子装置的印刷电路板。 印刷电路板包括基板，其上布置有阵列布置。 每个平台布置包括芯部分和绘图部分。 附图相对于陆地排列的阵列的芯部沿对角线方向设置。

公开(公告)号：US20130168140A1

公开(公告)日：2013-07-04

申请号：US13730149

申请日：2012-12-28

Applicant: PEKING UNIVERSITY FOUNDER GROUP CO., LTD. ,  ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD.

Inventor： Xianren CHEN ,  Lianghong LIAO ,  Xin CHEN ,  Yongshuan HU

IPC: H05K3/00 ,  H05K1/02

CPC classification number: H05K3/0044 ,  H05K1/02 ,  H05K3/0008 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2203/167 ,  Y10T409/303752

Abstract: A method of manufacturing a printed circuit board (PCB) is provided. The method includes defining an area on the PCB to be subjected to a controlled-depth milling. The area includes a warp. The method further includes providing a plurality of positioning holes adjacent to edges of the area of the PCB, installing positioning members in the positioning holes so as to fix the PCB on a flat surface of a table of a milling equipment, and milling the area of the PCB. A PCB is also provided. The PCB includes a controlled-depth area containing patterns and having a surface lower than a surface of the PCB. The PCB further includes a plurality of positioning holes formed adjacent to edges of the controlled-depth area.

Abstract translation: 提供一种制造印刷电路板（PCB）的方法。 该方法包括在PCB上限定要进行受控深度铣削的区域。 该区域包括翘曲。 该方法还包括提供与PCB的区域的边缘相邻的多个定位孔，将定位构件安装在定位孔中，以将PCB固定在铣削设备的工作台的平坦表面上，并铣削 PCB。 还提供PCB。 PCB包括受控深度区域，其包含图案并且具有低于PCB表面的表面。 PCB还包括与受控深度区域的边缘相邻形成的多个定位孔。

公开(公告)号：US08410375B2

公开(公告)日：2013-04-02

申请号：US12245025

申请日：2008-10-03

Applicant: Yoshitaka Matsushita ,  Kazuhiro Oshima ,  Akio Horiuchi

Inventor： Yoshitaka Matsushita ,  Kazuhiro Oshima ,  Akio Horiuchi

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/00 ,  H05K1/14

CPC classification number: H05K3/284 ,  H01L21/481 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K2201/09136 ,  H05K2201/10318 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10T29/49124

Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.

Abstract translation: 布线板具有布线构件，第一加强构件和第二加强构件。 布线构件具有层叠的布线层和绝缘层，并且布线层包括形成在布线构件的表面上的第一连接电极和形成在布线构件的背面上的第二连接电极。 销形成在第二连接电极上。 第二加强构件由树脂形成，用于加强布线构件。 除了设置在第二连接电极上的销之外，第一加强构件形成在布线构件的整个背面上。

公开(公告)号：US08334461B2

公开(公告)日：2012-12-18

申请号：US12262442

申请日：2008-10-31

Applicant: Yuichi Taguchi ,  Teruaki Chino ,  Kiyoshi Oi

Inventor： Yuichi Taguchi ,  Teruaki Chino ,  Kiyoshi Oi

IPC: H05K1/00 ,  H05K1/11 ,  H05K7/00

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.

Abstract translation: 适于安装电子部件的布线板具有以下结构的形式：其中多个布线层一层叠置在一起而隔着绝缘层，并分别通过形成在绝缘层中的通孔相互连接。 在没有形成布线的区域中，通过该结构形成多个开口，在其厚度方向上延伸穿过该结构。 此外，阻焊层分别形成在最外面的布线层上，并且在最外面布线层中的期望位置限定出露出焊盘部分。

公开(公告)号：US08286340B2

公开(公告)日：2012-10-16

申请号：US11841393

申请日：2007-08-20

Applicant: Yukihiko Ohashi

Inventor： Yukihiko Ohashi

IPC: H05K3/20

CPC classification number: H05K3/0058 ,  H05K1/0271 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A printed circuit board for mounting an electronic part includes a mounting surface configured so that the electronic part is mounted. A warpage correcting metal pattern is provided on a back surface of the printed circuit board opposite to the mounting surface. The warpage correcting metal pattern may be formed of a metal film or a metal layer joinable with a thermally meltable joining material.

Abstract translation: 一种用于安装电子部件的印刷电路板，包括安装在电子部件上的安装面。 翘曲校正金属图案设置在印刷电路板的与安装表面相对的背面上。 翘曲校正金属图案可以由与可热熔接合材料接合的金属膜或金属层形成。

公开(公告)号：US08272123B2

公开(公告)日：2012-09-25

申请号：US13009802

申请日：2011-01-19

Applicant: Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

Inventor： Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

IPC: H01R43/00

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/10

Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Abstract translation: 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。

公开(公告)号：US08232642B2

公开(公告)日：2012-07-31

申请号：US12835043

申请日：2010-07-13

Applicant: Seong Cheol Kim ,  Chang Jun Park

Inventor： Seong Cheol Kim ,  Chang Jun Park

IPC: H01L23/488

CPC classification number: H01L23/488 ,  H01L24/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/112 ,  H05K3/3436 ,  H05K2201/0191 ,  H05K2201/09136 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09736 ,  Y02P70/613

Abstract: A printed circuit board includes a body part formed with connection pads on a first surface thereof; and a warpage compensating part formed over the first surface of the body part and having a height that increases from edges toward a center of the warpage compensating part so that an upper surface of the warpage compensating part facing away from the first surface of the body part is convex upward. The warpage compensating part comprises conductive layer patterns formed over the first surface of the body part to be electrically connected to the connection pads; and a solder resist formed over the first surface of the body part so as to expose the conductive layer patterns. The height of the solder resist gradually increases from both edges toward a center of the solder resist.

Abstract translation: 印刷电路板包括在其第一表面上形成有连接焊盘的主体部分; 以及翘曲补偿部，其形成在主体部的第一表面上，并且具有从边缘朝向翘曲补偿部的中心增加的高度，使得翘曲补偿部的上表面背离主体部的第一表面 向上凸起 翘曲补偿部分包括形成在主体部分的第一表面上以电连接到连接焊盘的导电层图案; 以及形成在主体部分的第一表面上的阻焊剂，以暴露导电层图案。 阻焊剂的高度从阻焊层的两个边缘向中心逐渐增加。

公开(公告)号：US20120176759A1

公开(公告)日：2012-07-12

申请号：US13331105

申请日：2011-12-20

Applicant: Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

Inventor： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

IPC: H05K7/06 ,  H05K1/03 ,  B23K31/02 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Abstract translation: 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。