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公开(公告)号：JPWO2015151433A1
公开(公告)日：2017-04-13
申请号：JP2015536702
申请日：2015-03-18
Applicant: パナソニックIpマネジメント株式会社
CPC classification number: H05K3/341 , H05K3/3494 , H05K2201/09072 , H05K2201/10628 , H05K2201/10636 , H05K2203/304 , Y02P70/611 , Y02P70/613
Abstract: 部品実装基板(7)は、配線基板(8)と、第1実装部品(9)と、第2実装部品(10)と、を含む。配線基板(8)は、金属層(11)と、金属層(11)の両面を覆った樹脂層(12,13)と、樹脂層(12,13)に設けられた実装配線パターン(14)と、を有する。第1実装部品(9)は、リード端子(16)により配線基板(8)へ実装され、第2実装部品(10)は、接合端子(18)により配線基板(8)へ実装され、かつ、第1実装部品(9)よりも熱容量が小さい。第1実装部品(9)は配線基板(8)に対し空間(20)を介して配置され、かつ、配線基板(8)における第1実装部品(9)の対向部分には貫通孔(21)が設けられる。第2実装部品(10)は、第2実装体(17)と第2実装体(17)に設けられた接合端子(18)とを有し、第2実装体(17)が、実装配線パターン(14)もしくは配線基板(8)に接触して配置されている。
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公开(公告)号：JP2014096536A
公开(公告)日：2014-05-22
申请号：JP2012248605
申请日：2012-11-12
Applicant: Kitagawa Ind Co Ltd , 北川工業株式会社
Inventor： NAKAMURA TATSUYA
CPC classification number: H01G2/106 , H01G2/04 , H01G2/06 , H01G4/38 , H01G9/26 , H01G11/10 , H05K1/184 , H05K2201/10015 , H05K2201/10628
Abstract: PROBLEM TO BE SOLVED: To avoid reducing capacitor packaging density even when a metal pin which is to be soldered to a printed circuit board is used in a capacitor holder that holds a cylindrical capacitor so that an axis of the capacitor becomes perpendicular to the printed circuit board.SOLUTION: In a capacity holder 1 that is integrally formed with a resin in a shape where a cylindrical part 5 is erected at a circumference of a discoid bottom 3 and a pair of protrusions 5B support metal pins 7 for soldering at a circumference of the cylindrical part 5, when X represents an inner diameter of the cylindrical part 5 and Y represents a distance from an axis of the cylindrical part 5 to the circumference of the cylindrical part 5, by making Y/X
Abstract translation: 要解决的问题：即使当将要焊接到印刷电路板的金属针用于保持圆柱形电容器的电容器支架中以避免电容器的轴线垂直于印刷电路时，为了避免降低电容器封装密度 在与盘状底部3的圆周上竖立有圆筒形部分5的一种树脂一体形成的容量保持器1和一对突出部分5B支撑金属销7以在圆周方向上焊接 圆筒部5，当X表示圆筒部5的内径，Y表示从圆筒部5的轴线到圆筒部5的圆周的距离时，通过使Y / X <0.76，金属销7 可以由突起5B稳定地支撑，并且容量保持器1可以密集地设置。
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公开(公告)号：JP5285428B2
公开(公告)日：2013-09-11
申请号：JP2008543403
申请日：2006-11-29
Applicant: アムフェノール・コーポレーション
Inventor： ガイラス，マーク・ダブリュー , クヒルチェンコ，レオン・エム
CPC classification number: H05K3/321 , H01L2924/0002 , H05K2201/10628 , H05K2201/10795 , H05K2201/10984 , H01L2924/00
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324.发明专利
公开(公告)号：JP5270667B2
公开(公告)日：2013-08-21
申请号：JP2010508797
申请日：2008-05-13
Applicant: ジェマルト エスアーGemalto S.A.
Inventor： マルティナン，ジャン−フランソワ , ローブル，ロランス , ルセル，フランソワ
IPC: G06K19/077 , G06K19/07 , H01Q1/14
CPC classification number: H01Q1/2225 , G06K19/027 , G06K19/07749 , G06K19/0775 , H05K1/00 , H05K1/038 , H05K3/328 , H05K2201/029 , H05K2201/10628 , H05K2203/0278 , H05K2203/0285 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49124 , Y10T29/4913
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公开(公告)号：JPS61105812A
公开(公告)日：1986-05-23
申请号：JP22746984
申请日：1984-10-29
Applicant: Sanyo Electric Co Ltd , Tokyo Sanyo Electric Co Ltd
Inventor： MIURA YOSHIO
CPC classification number: H01F27/292 , H05K3/328 , H05K2201/10287 , H05K2201/10628 , H05K2203/0285
Abstract: PURPOSE:To obtain an extremely miniature and cheap inductance element as compared with chip inductance by forming an insulating coil into an inductance element directly on a circuit substrate with a supersonic bonding device. CONSTITUTION:After a conductive route 2 is formed on a circuit substrate 1 and a bobbin 6 is arranged, an end of a coil 3 is supersonically bonded on the conductive route 2 of the substrate 1 with a supersonic bonding device. An insulating coil 3 is entangled with the bobbin 6 through moving the circuit substrate 1 with an X-Y axis transfer device. A rotary center is moved to be provided in a center or near the center of the bobbin 6 with the X-Y axis transfer device. After the bobbin 6 is rotated through starting a rotary device 17 of the supersonic bonding device after then, the insulating coil 3 sent from a reel 14 is wound on the bobbin 6 homogeneously by a predetermined number of turns. Another end of the insulating coil 3 is supersonically bonded to another conductive route 2. Plural inductance elements are formed through repeating this process.
Abstract translation: 目的：通过使用超声波接合装置在电路基板上直接形成绝缘线圈到电感元件，与芯片电感相比，获得极小的和便宜的电感元件。 构成：在电路基板1上形成导电路径2并配置有线轴6之后，用超声波接合装置将线圈3的一端超声波地接合在基板1的导电路径2上。 绝缘线圈3通过用X-Y轴传送装置移动电路基板1与线轴6缠结。 旋转中心通过X-Y轴传送装置移动到绕线筒6的中心或中心附近。 在通过启动超声波接合装置的旋转装置17使线筒6旋转之后，从卷轴14发送的绝缘线圈3以规定的匝数均匀地卷绕在线轴6上。 绝缘线圈3的另一端被超声波接合到另一导电路线2上。通过重复该过程形成多个电感元件。
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Patent Agency Ranking
公开(公告)号：JPS61105809A
公开(公告)日：1986-05-23
申请号：JP22746684
申请日：1984-10-29
Applicant: Sanyo Electric Co Ltd , Tokyo Sanyo Electric Co Ltd
Inventor： MIURA YOSHIO
CPC classification number: H05K3/328 , H01F27/292 , H01L2924/19107 , H05K2201/10287 , H05K2201/10628 , H05K2203/0285
Abstract: PURPOSE:To form a bobbin, an insulating coil and minimum of parts into an inductance element by forming an insulating coil into the inductance element directly on an insulating substrate with a supersonic bonding device. CONSTITUTION:After a conductive route 2 is formed on an insulating substrate 1 and a bobbin 3 is arranged, an end of a coil 5 built in a reel 12 on the conductive route 2 of the substrate 1 is received a supersonic bonding with a supersonic bonding device. After the insulating coil 5 supplied by the reel 12 is wound on the bobbin 3, an end of the insulating coil 5 is supersonically bonded to other conductive route 2. After this process is repeated, plural inductance elements are formed. The plural inductance elements form optional valued inductance elements by controlling number of revolutions of a table of the supersonic bonding device.
Abstract translation: 目的：通过在超声波接合装置的绝缘基板上直接在电感元件中形成绝缘线圈，将线圈，绝缘线圈和最小部件形成电感元件。 构成：在绝缘基板1上形成导电路径2并配置绕线管3之后，在基板1的导电路径2上内置卷轴12的线圈5的端部，以超音速接合 设备。 在由卷轴12供给的绝缘线圈5卷绕在线轴3上之后，绝缘线圈5的一端被超声波接合到其他导电路径2.在重复该过程之后，形成多个电感元件。 多个电感元件通过控制超声波接合装置的工作台的转数来形成可选的电感元件。
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公开(公告)号：JPS6197808A
公开(公告)日：1986-05-16
申请号：JP21994384
申请日：1984-10-18
Applicant: Sanyo Electric Co Ltd , Tokyo Sanyo Electric Co Ltd
Inventor： MIURA YOSHIO
CPC classification number: H01F41/10 , H01F27/292 , H05K3/328 , H05K2201/10287 , H05K2201/10628 , H05K2203/0285
Abstract: PURPOSE:To obtain the inductance elements of extremely small size and low price and to obtain the elements of wide value easily by forming the elements on the insulating substrate directly by use of a supersonic bonding device of insulating wires. CONSTITUTION:After a copper foil is stuck to the overall surface of one of the main planes of an insulating substrate 1, the copper foil is etched selectively to form the conductive paths of desired pattern. A winding frame body 3 is placed and fixed on the insulating substrate 1 with being close to the conductive paths by an adhesive 4. The winding frame body 3 has a function of winding the wire for forming an inductance element. One end of a wire 5 is supersonic- bonded on one of the conductive paths 2 by use of a supersonic bonding device. The insulating wire 5 is wound on the winding frame body 3 by rotating the insulating substrate 1. During this process, the insulating wire 5 is wound on the body 3 only by the predetermined number of turns to form the inductance element of desired value. lastly another end of the insulating wire 5 is supersonically-bonded to another conductive path 2.
Abstract translation: 目的：为了获得极小尺寸和低价格的电感元件，通过使用绝缘导线的超音速键合装置直接形成绝缘基板上的元件，可以容易地获得宽值。 构成：在将铜箔粘贴在绝缘基板1的主面的整个表面之后，铜箔被选择性地蚀刻以形成所需图案的导电路径。 卷绕框架体3通过粘合剂4靠近导电路径放置并固定在绝缘基板1上。卷绕框架体3具有卷绕用于形成电感元件的导线的功能。 电线5的一端通过使用超音速键合装置超声波结合在一个导电路径2上。 绝缘线5通过旋转绝缘基板1而缠绕在绕线架体3上。在该过程中，绝缘线5仅以预定匝数缠绕在主体3上，以形成所需值的电感元件。 最后，绝缘线5的另一端与另一个导电路径2超声联结。
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公开(公告)号：CN201097407Y
公开(公告)日：2008-08-06
申请号：CN200720174728.1
申请日：2007-08-21
Applicant: 富士康(昆山)电脑接插件有限公司鸿海精密工业股份有限公司
Inventor： 伊果波尼
IPC: H01R12/36
CPC classification number: H05K3/325 , H05K2201/0969 , H05K2201/10628 , H05K2201/10795 , H05K2203/167
Abstract: 本实用新型公开了一种电连接器组件，用以电性连接电子元件至电路板，其包括绝缘本体、容设于绝缘本体中的若干导电端子，以及置于绝缘本体下端的电路板，导电端子设有与电路板电性连接的尾部，其中，导电端子尾部大致呈碟状，电路板相应设有收容该碟状尾部的收容槽以使导电端子有至少一个部位与电路板电性连接。这种形状的导电端子尾部能方便地插入或脱离电路板，而且至少有一个部位与电路板连接以实现电子元件与电路板稳固地电性连接。
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公开(公告)号：CN205282469U
公开(公告)日：2016-06-01
申请号：CN201520719544.3
申请日：2015-09-16
Applicant: 意法半导体公司
IPC: H01L23/48 , H01L23/495
CPC classification number: H01L21/4842 , H01L21/4825 , H01L21/54 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48105 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83439 , H01L2224/83444 , H01L2224/8385 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/181 , H05K1/111 , H05K1/181 , H05K2201/10628 , H05K2201/10992 , H01L2224/85 , H01L2224/83 , H01L2224/45099 , H01L2924/01047 , H01L2924/0665 , H01L2924/00 , H01L2924/00012
Abstract: 本申请涉及电子器件和半导体封装体。本公开的实施例涉及一种在引线外表面中形成有凹进的引线框封装体。该凹进被填充以诸如焊料的填充材料。该凹进中的填充材料为诸如焊料的填充材料提供在将该封装体安装至诸如印刷电路板(PCB)的另一设备期间用以粘合的可润湿表面。这使得能够在该封装体的引线和PCB之间形成强的焊料接合。这还使得能够在该封装体已经被安装之后对该焊料接合进行有所改善的视觉检查。
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公开(公告)号：CN207303085U
公开(公告)日：2018-05-01
申请号：CN201720708442.0
申请日：2017-06-16
Applicant: 瑞萨电子株式会社
IPC: H01L23/522 , H01L23/528 , H01L25/07
CPC classification number: H02K11/33 , H02H9/02 , H02K7/145 , H05K1/0206 , H05K1/0263 , H05K1/115 , H05K1/181 , H05K3/3447 , H05K3/429 , H05K7/1432 , H05K2201/10015 , H05K2201/10166 , H05K2201/10356 , H05K2201/10522 , H05K2201/10545 , H05K2201/10628 , H05K2201/10636
Abstract: 本实用新型涉及一种电子装置，抑制电子装置的性能降低，并且实现电子装置的小型化。电子装置(EA)在具有尺寸不同的多个贯通导孔的贯通基板(WB)的背面的第1区域配置包括功率晶体管的功率模块(PM2A)，另一方面，在贯通基板(WB)的表面的第2区域配置包括控制电路的预驱动器(PD2)。此时，在俯视视角下，第1区域和第2区域具有重叠的区域。并且，功率模块(PM2A)与预驱动器(PD2)经由贯通导孔(TV1)而电连接。进而，多个贯通导孔具有第1尺寸的贯通导孔(TV1)、比第1尺寸大且能够插入线缆(CAL(V))的贯通导孔(TV2)以及在内部埋入有导电性部件(CM)的贯通导孔(TV3)。
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