Abstract:
A method for fabricating a microfluidic device where first and second substantially flat platens are provided. Multiple substantially planar, substantially metal-free, adhesiveless polymer device layers, including at least one stencil layer defining a microfluidic channel penetrating through the entire thickness of the stencil such that the channel is bounded laterally by a stencil layer, and bounded from above and below by surrounding device layers to define an upper channel surface and a lower channel surface are provided. The device layers are stacked between the first platen and the second platen and controllably heated according to a heating profile adapted to form a substantially sealed adhesiveless microfluidic device wherein each upper channel surface remains distinct from its corresponding lower channel surface. The resulting microfluidic device has high inter-layer bond strength while preserving the integrity of the channel(s) defined in the stencil layer(s).
Abstract:
A MEMS mirror and method for fabricating the mirror is provided. The mirror has a plurality of structures that operatively rotate around a support structure. The mirror is fabricated, such that the silicon components are separated from a glass structure having electrodes to prevent shorting the electrodes to the mirror. Additionally, the electrodes are positioned such that providing electrical contact is eased.
Abstract:
Microfluidic devices (140, 160, 170, 180, 230, 260, 280, 300, 320, 350, 400, 450) capable of combining discrete fluid volumes generally include channels (144, 147, 161A-D, 162A-D, 176, 177, 188, 189, 249, 250, 269, 270, 296, 297, 319A, 319B, 335, 336, 379A, 386A, 409, 415, 456) for supplying different fluids toward a sample chamber (146, 120, 122, 124, 126, 178, 191, 240, 271, 291, 314, 334, 375, 410, 459) and means for establishing fluid communication between the fluids within the chamber. Discrete fluid plugs are defined from larger fluid volumes before being combined. Certain embodiments utilize actuation chambers (240, 267, 289, 290, 292, 293, 313, 329, 330, 371, 372) or include subchambers (146A, 146B, 120A, 120B, 122A, 122B, 124A, 124B, 126A, 126B, 178A, 178B, 191A, 191B, 410A, 410B) divided by a rupture region (151, 165A, 165B, 179, 190) such as a frangible seal. Further embodiments utilize one or more deformable membranes (171, 185, 242, 268, 283, 323, 355, 420, 451) and/or porous regions (305, 303) to direct fluid flow. Certain devices may be pneumatically or magnetically actuated.
Abstract:
A cast-on-resist (COR) method of forming a ceramic layer (114) with a recessed pattern is provided according to a preferred exemplary embodiment of the present invention. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is further comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (110) having the negative image of the pattern, applying ceramic slurry (112) on the casting substrate (110), curing the ceramic slurry (112) on the casting substrate (110) and removing the ceramic layer (114) from the casting substrate (110) after the curing.
Abstract:
The present invention is directed to a process for forming one or more lateral nanostructures on a subtrate (20). The process comprises the steps of: providing a substrate (20); depositing a first layer (24) on the substrate; forming at least one edge (26) on the first layer; depositing at least one separation layer (28) on the first layer, depositing a third layer (30) on the separation layer; and removing a portion of the separation layer and the third layer from the substrate such that a substantially planar surface is formed exposing the first layer, the separation layer, and the third layer (30).
Abstract:
MEMS device (300) having an actuator (302, 306) with curved electrodes (308, 310). According to one embodiment of the present invention, an actuator is provided for moving an actuating device linearly. The actuator includes a substrate (304) having a planar surface and an actuating device movable in a linear direction relative to the substrate. The actuator includes at least one electrode beam (312, 314) attached to the actuating device and having an end attached to the substrate (304). The electrode beam is flexible (322, 324) between the actuating device and the end of the electrode beam attached to the substrate. Furthermore, the actuator includes at least one electrode (308, 310) attached to the substrate. The electrode (308, 310) has a curved surface aligned in a position adjacent the length of the electrode beam, whereby the actuating device is movable in its substantially linear direction as the electrode beam (312, 314) moves in a curved fashion corresponding substantially to the curved surface of the electrode.
Abstract:
The invention relates to a method for producing glass-silicon-glass sandwich structures which are connected irreversibly and in such a way that they are adjusted to correspond. Said structures consist of a bottom and a top glass substrate (2, 3) and a silicon substrate (1) in-between. At least one of the substrates (1; 2; 3) is provided with 3D depth structuring. The aim of the invention is to provide a low-cost production method, especially with a view to mass production of glass-silicon-glass sandwich structures. To this end, the silicon substrate (1) is irreversibly connected to one of the glass substrates (2; 3) before or after the 3D depth structuring. The bond is reduced to a predetermined end thickness from the glass and/or the silicon side by means of grinding, etching and polishing methods and the remaining silicon surface is then connected to a second glass substrate (3; 2) by anodic bonding.
Abstract:
This invention relates to a method of fabricating a bonded product comprising at least two components that are bonded together, the method comprising the steps of: a) bringing the components together; and b) heating the components; wherein at least one of the components comprises a nanomaterial and wherein steps (a) and (b) are performed in such a manner that the components are bonded together by heating at least part of the nanomaterial. The method allows the components to be welded together at lower temperatures than for prior art methods. The method also provides a more reliable form of bonding and improves the strength of the bond formed.
Abstract:
The invention relates to a lithographic method for producing microcomponents with component structures in the sub-millimeter range. According to the inventive method, a structured adhesive layer is applied to a metal layer and then a photostructured epoxy resin layer is applied to said adhesive layer. Said epoxide resin is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resin structures with metal by electroplating. The aim of the invention is to provide an adhesive layer that is suitable for photostructured epoxy resins, especially for SU-8 resist material and that prevents the resist material from being detached. To this end, the adhesive layer consists of polyimide or a polyimide mixture.
Abstract:
A method of fabricating an elastomeric structure, comprising : forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.