Flexible Circuit Electrode Array with at Least one Tack Opening
    341.
    发明申请
    Flexible Circuit Electrode Array with at Least one Tack Opening 有权
    柔性电路电极阵列,至少一个开口

    公开(公告)号:US20080058875A1

    公开(公告)日:2008-03-06

    申请号:US11928698

    申请日:2007-10-30

    Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

    Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列,包括:聚合物基层; 沉积在所述聚合物基层上的金属痕迹,包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层,所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法,包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中,以在所述柔性电路电极阵列中形成三维形状。

    CAMERA MODULE
    346.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号:US20230199291A1

    公开(公告)日:2023-06-22

    申请号:US17752262

    申请日:2022-05-24

    Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

    MECHANICALLY STRENGTHENED PIEZOELECTRIC SENSOR FOR STRUCTURAL HEALTH MONITORING

    公开(公告)号:US20180190897A1

    公开(公告)日:2018-07-05

    申请号:US15859666

    申请日:2018-01-01

    Abstract: The present invention discloses a mechanically strengthened piezoelectric sensor for Structural Health Monitoring applications. The sensor includes a two-sided piezo ceramic component, a sensor encapsulation, and at least two wires. The sensor encapsulation has an indented side that forms a recessed area. The recessed area has a supporting structure. The two-sided piezo ceramic component is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the recessed area. The supporting structure of the encapsulation provides mechanical strength to the piezo ceramic component. The wires are attached to the electrodes of the piezo ceramic component and extend out of the encapsulation. Alternatively, the mechanically strengthened piezoelectric sensor may further include a Printed Circuit Board (PCB). The piezo ceramic component is mounted on the PCB. Then, the PCB is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the encapsulation.

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