公开(公告)号：US10575407B2

公开(公告)日：2020-02-25

申请号：US16018127

申请日：2018-06-26

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  B29C45/14 ,  B29L31/34

Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

公开(公告)号：US10248277B2

公开(公告)日：2019-04-02

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo Sääski ,  Jarkko Torvinen ,  Pasi Raappana ,  Mikko Heikkinen

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36 ,  B29L31/34

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US09724869B2

公开(公告)日：2017-08-08

申请号：US14583940

申请日：2014-12-29

Applicant: TactoTek Oy

Inventor： Paavo Niskala ,  Jarmo Saaski ,  Pasi Raappana ,  Mikko Heikkinen ,  Mikko Sippari ,  Jarkko Torvinen ,  Antti Keranen

IPC: H05K1/00 ,  B29C51/14 ,  H05K1/18 ,  G06F1/16 ,  H05K3/00 ,  B29L31/34 ,  B29C51/16

CPC classification number: B29C51/14 ,  B29C51/16 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3431 ,  B29L2031/3481 ,  G06F1/163 ,  G06F1/1652 ,  G06F1/1658 ,  H05K1/0266 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/10545 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

公开(公告)号：US20210243898A1

公开(公告)日：2021-08-05

申请号：US17215001

申请日：2021-03-29

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03

Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

公开(公告)号：US10986735B2

公开(公告)日：2021-04-20

申请号：US16168927

申请日：2018-10-24

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.

公开(公告)号：US10986734B2

公开(公告)日：2021-04-20

申请号：US16140633

申请日：2018-09-25

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

公开(公告)号：US20180302989A1

公开(公告)日：2018-10-18

申请号：US16018127

申请日：2018-06-26

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/0014 ,  B29C45/1418 ,  B29C45/14639 ,  B29C45/14811 ,  B29C45/14819 ,  B29C2045/14237 ,  B29L2031/3425 ,  B29L2031/3481 ,  H05K1/0284 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/1105

Abstract: An apparatus for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

公开(公告)号：US20180220534A1

公开(公告)日：2018-08-02

申请号：US15937172

申请日：2018-03-27

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko Torvinen

IPC: H05K1/18 ,  H01L33/52 ,  H01L23/498 ,  H05K1/02 ,  H01L51/00 ,  H01L23/538

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

公开(公告)号：US10986733B2

公开(公告)日：2021-04-20

申请号：US15813397

申请日：2017-11-15

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

公开(公告)号：US10813222B2

公开(公告)日：2020-10-20

申请号：US16747614

申请日：2020-01-21

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03 ,  B29L31/34

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.