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公开(公告)号：WO2010014591A1
公开(公告)日：2010-02-04
申请号：PCT/US2009/051935
申请日：2009-07-28
Applicant: ADVANCED INTERCONNECTIONS CORP. , GOODMAN, Glenn
Inventor： GOODMAN, Glenn
IPC: H01R12/00
CPC classification number: H05K7/1061 , H01R13/2421
Abstract: Socket terminal assemblies and intercoupling components are configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate. The socket terminal assembly includes a socket shell, a pin, and a resilient member. The socket shell includes a portion defining an interior cavity and a protrusion extending inwardly relative to the portion, the protrusion defining an opening into the cavity within the socket shell. The pin includes a first portion having a first outer dimension and defining an interior cavity within the pin, and a second portion having a second outer dimension that is smaller than the first outer dimension. The first pin portion is received within the cavity of the socket shell with the second pin portion extending through the opening and out of the socket shell. In addition, the resilient member is interposed between the socket shell and the pin.
Abstract translation: 插座端子组件和互耦组件被配置为将集成电路的接触区域与衬底的相应连接区域电连接。 插座端子组件包括插座壳体，销和弹性构件。 插座外壳包括限定内部空腔的部分和相对于该部分向内延伸的突出部，突出部限定了插座壳体内的空腔的开口。 销包括具有第一外部尺寸并且在销内限定内部空腔的第一部分，以及具有小于第一外部尺寸的第二外部尺寸的第二部分。 第一销部分被容纳在插座壳体的空腔内，其中第二销部分延伸穿过开口并且从套筒壳体延伸出来。 此外，弹性构件介于插座壳和销之间。
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公开(公告)号：WO2009124121A2
公开(公告)日：2009-10-08
申请号：PCT/US2009039135
申请日：2009-04-01
Applicant: ADVANCED INTERCONNECTIONS , GOODMAN GLENN
Inventor： GOODMAN GLENN
CPC classification number: H05K1/141 , H05K3/3436 , H05K3/3452 , H05K2201/049 , H05K2201/0979 , H05K2201/099 , H05K2201/10689
Abstract: An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.
Abstract translation: 提供了将集成电路封装的器件引线电连接到衬底的互耦合部件。 该包装包括外部装置引线，每个装置引线具有靠近封装主体一侧的向下延伸的部分，并且相互联接部件包括绝缘支撑部件。 所述支撑构件包括第一表面，所述第一表面包括第一电连接位置，每个所述第一电连接位置被配置为与所述封装的相应的一个所述器件引线进行电连接。 支撑构件还包括相对的第二表面，其包括与第一电连接位置电接触的第二电附接位置，每个第二电附接位置包括与每个装置引线相关联的多个焊球。 多个焊球用于在基板上的每个表面安装焊盘和相互联结部件的对应导电焊盘之间形成电连接。
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公开(公告)号：WO2008067182A2
公开(公告)日：2008-06-05
申请号：PCT/US2007/084830
申请日：2007-11-15
Applicant: ADVANCED INTERCONNECTIONS CORPORATION , GOODMAN, Glenn
Inventor： GOODMAN, Glenn
CPC classification number: H01R13/2421 , H05K7/1061
Abstract: A male contact, a connector assembly of the type used to electrically connect electrical devices includes male contacts, and a method of manufacturing an electrical connector are disclosed.
Abstract translation: 公接头，用于电连接电气设备的类型的连接器组件包括阳触头，以及制造电连接器的方法。
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公开(公告)号：WO2008006045A2
公开(公告)日：2008-01-10
申请号：PCT/US2007/072901
申请日：2007-07-06
Applicant: ADVANCED INTERCONNECTIONS CORPORATION , GOODMAN, Glenn
Inventor： GOODMAN, Glenn
CPC classification number: H01R13/2421 , G01R1/0483 , H01L23/4338 , H01L2924/0002 , H05K7/1069 , H01L2924/00
Abstract: An intercoupling component used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component includes an insulative support member including an array of holes extending therethrough, the array of holes located in a pattern corresponding to the array of electrical connection regions on the first substrate; and a plurality of terminals. Each terminal includes a socket including a socket head and a socket body, the socket defining a socket cavity; a pin including a pin head and a pin body, the pin head positioned within one of the array of holes, the pin body extending from the pin head and received at least partially within the socket cavity; and a resilient member configured to bias the socket head is biased away from the pin head.
Abstract translation: 用于将布置在第一衬底上的电连接区域阵列耦合到布置在第二衬底上的电连接区域阵列的相互耦合组件。 所述相互连接部件包括绝缘支撑构件，所述绝缘支撑构件包括延伸穿过其中的孔阵列，所述孔阵列位于与所述第一基板上的所述电连接区域阵列对应的图案中; 和多个终端。 每个端子包括：包括插座头和插座本体的插座，该插座限定插座腔; 包括销头和销主体的销，所述销头定位在所述孔阵列中的一个内，所述销主体从所述销头延伸并且至少部分地接收在所述插座腔内; 并且配置成偏压内六角头的弹性构件偏离销头。
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公开(公告)号：WO2006028637A1
公开(公告)日：2006-03-16
申请号：PCT/US2005/028248
申请日：2005-08-09
Applicant: ADVANCED INTERCONNECTIONS CORPORATION , GOODMAM, Glenn , MURPHY, James, V.
Inventor： GOODMAM, Glenn , MURPHY, James, V.
IPC: H01R13/24
CPC classification number: H01R13/2421 , H01R12/714
Abstract: A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).
Abstract translation: 插座端子组件（18）包括具有第一端（41）的插座主体（40），第一端（41）具有第一开口以接收接触元件（200），第二开口在第二端处以接收销（54）。 位于第一开口中的接触元件（200）构造成接触印刷电路板（14）的对应的连接区域; 销具有适于接触集成电路封装（12）的电接触区域的端部（59）和被配置为插入插座主体（40）的开口内的相对端部（58）。 第二开口中的接触弹簧（46）接收销（54）并施加足以将销（54）的下端（56）保持在插座主体的开口内的摩擦力。 弹性构件（60）设置在接触元件（200）和接触弹簧（46）之间的开口内。 响应于施加到销（54）的向下的力或施加到接触元件（200）的向上的力，弹性构件（60）施加到销和接触元件（200），足以克服摩擦 接触弹簧（46）的力。 相互联接部件（16）包括具有孔（20）的插座支撑构件，每个孔（20）接收相应的插座端子组件（18）。
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Patent Agency Ranking
公开(公告)号：DE212012000153U1
公开(公告)日：2014-04-04
申请号：DE212012000153
申请日：2012-07-25
Applicant: ADVANCED INTERCONNECTIONS
Abstract: Elektrisch leitfähiger Anschluss zum Einfügen in eine Öffnung eines Substrats, wobei der Anschluss aufweist: einen Körper, der ein proximales Ende und ein distales Ende aufweist, wobei das distale Ende zum Einfügung in die Öffnung konfiguriert ist, und der Körper enthält: eine Wand, die eine Außenoberfläche hat, einen nachgiebigen Widerhaken, aufweisend: einen Basisabschnitt, der auf der Außenoberfläche der Wand und entlang des Körpers angeordnet ist, und einen Scheitelabschnitt, der sich vom Basisabschnitt weg in einer Richtung vom distalen Ende zum proximalen Ende und in einem Winkel von der Außenoberfläche der Wand erstreckt, so dass der Scheitel zwischen der Basis und dem proximalen Ende lokalisiert ist, eine Innenoberfläche des Widerhakens, die der Außenoberfläche der Wand zugewandt ist, eine Außenoberfläche des Widerhakens, wobei, wenn der Widerhaken im Querschnitt betrachtet wird, die Innenoberfläche des Widerhakens und die Außenoberfläche des Widerhakens zum Scheitel konvergieren, so dass die Breite im Querschnitt des Widerhakens uneinheitlich ist.
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公开(公告)号：CA2579155A1
公开(公告)日：2006-03-16
申请号：CA2579155
申请日：2005-08-09
Applicant: ADVANCED INTERCONNECTIONS
Inventor： GOODMAN GLENN , MURPHY JAMES V
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公开(公告)号：HK1078172A1
公开(公告)日：2006-03-03
申请号：HK05111562
申请日：2005-12-15
Applicant: ADVANCED INTERCONNECTIONS
Inventor： PERUGINI MICHAEL , SAYDAM EROL D , EASTMAN GARY D , LANGON ALFRED J , PREW RAYMOND A
IPC: H01R13/648 , H05K9/00
Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
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公开(公告)号：AU2003249355A1
公开(公告)日：2004-01-06
申请号：AU2003249355
申请日：2003-06-24
Applicant: ADVANCED INTERCONNECTIONS
Inventor： EASTMAN GARY D , LANGON ALFRED J , PREW RAYMOND A , PERUGINI MICHAEL , SAYDAM EROL D
IPC: H01R13/648 , H05K9/00
Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
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公开(公告)号：DE69818293D1
公开(公告)日：2003-10-23
申请号：DE69818293
申请日：1998-11-02
Applicant: ADVANCED INTERCONNECTIONS
Inventor： MURPHY V
IPC: G01R1/04 , H01L23/32 , H01R13/24 , H01R24/00 , H01R33/76 , H01R107/00 , H05K7/10 , H01R12/22 , H01R13/187
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