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公开(公告)号：US09388037B2
公开(公告)日：2016-07-12
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Jeffery F. Summers
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20160093530A1
公开(公告)日：2016-03-31
申请号：US14499287
申请日：2014-09-29
Applicant: Innovative Micro Technology
Inventor： John C. HARLEY
IPC: H01L21/768 , B81C1/00
CPC classification number: H01L21/76898 , B81B7/0006 , B81B2201/018 , B81B2201/0271 , B81B2207/012 , B81B2207/015 , B81C1/00301 , B81C2203/0792 , H01L2224/02372 , H01L2224/05548
Abstract: A method for forming through silicon vias (TSVs) in a silicon substrate is disclosed. The method involves forming a silicon post as an annulus in a first side of a silicon substrate, removing material from an opposite side to the level of the annulus, removing the silicon post and replacing it with a metal material to form a metal via extending through the thickness of the substrate.
Abstract translation: 公开了一种在硅衬底中形成硅通孔（TSV）的方法。 该方法包括在硅衬底的第一侧中形成硅柱作为环状空间，从与环空的水平面相反的一侧去除材料，去除硅柱并用金属材料代替它，以通过延伸通过 基板的厚度。
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公开(公告)号：US20150183630A1
公开(公告)日：2015-07-02
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN , Jeffery F. SUMMERS
IPC: B81B1/00
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20150069618A1
公开(公告)日：2015-03-12
申请号：US13987871
申请日：2013-09-11
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Prosenjit Sen
CPC classification number: H01L21/486 , B81B7/007 , B81B2207/095 , B81B2207/096 , B81C1/00095 , H01L21/76898 , H01L23/481 , H01L31/02167 , H01L31/03529 , H01L31/052 , H01L31/068 , H01L2924/0002 , Y02E10/547 , H01L2924/00
Abstract: A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.
Abstract translation: 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并使玻璃熔化，使其流入模板衬底中形成的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。
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公开(公告)号：US20150031120A1
公开(公告)日：2015-01-29
申请号：US13987464
申请日：2013-07-29
Applicant: Innovative Micro Technology
Inventor： John S. Foster , Daryl W. Grummitt , John C. Harley , Jaquelin K. Spong , Kimberly L. Turner
IPC: G01N33/50
CPC classification number: G01N33/5005 , B01L3/502738 , B01L3/502761 , B01L2200/0652 , B01L2400/043 , B01L2400/0633 , C12M47/04
Abstract: A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid.
Abstract translation: 描述了基于MEMS的系统和方法，用于将目标颗粒与流体流的其余部分分离。 该系统利用形成在基板上的独特的微加工可移动结构，其以旋转方式围绕一个或多个固定点移动，所述固定点都位于运动轴的一侧。 可移动结构由独立的力产生装置致动，该装置与其基板上形成的可移动结构完全分开。 这允许可移动结构完全浸没在样品流体中。
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Patent Agency Ranking
公开(公告)号：US11305982B2
公开(公告)日：2022-04-19
申请号：US16515943
申请日：2019-07-18
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Paul Rubel
Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.
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公开(公告)号：US10804850B2
公开(公告)日：2020-10-13
申请号：US16104146
申请日：2018-08-17
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Abbaspour Tamijani
Abstract: Systems and methods for forming a compact gas sensor include using a lithographically fabricated high Q resonator coupled to at least one of a Gunn diode and an IMPATT diode. The resonator may include a plurality of cavities filled with a sample gas. A detector coupled to the resonator may measure the amplitude of the emitted mm wave radiation.
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公开(公告)号：US20190304794A1
公开(公告)日：2019-10-03
申请号：US16369140
申请日：2019-03-29
Applicant: Innovative Micro Technology
Inventor： Tao Gilbert , Sangwoo Kim
IPC: H01L21/308 , H01L33/58 , H01L31/0232
Abstract: The method described here uses gray scale lithography to form curve surfaces in photoresist. These surfaces can be of arbitrary shape since the remaining resist following exposure and develop is dependent on the exposure dose, which is controlled precisely by the opacity of the photo-mask. The process may include a silicon etch step, followed by a photoresist etch step to form an etching cycle. Each etch cycle may form a pair of substantially orthogonal stepped surfaces, with a characteristic “rise” and “run.”
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公开(公告)号：US10291332B2
公开(公告)日：2019-05-14
申请号：US15934450
申请日：2018-03-23
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman
Abstract: A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.
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公开(公告)号：US20190137611A1
公开(公告)日：2019-05-09
申请号：US16164802
申请日：2018-10-19
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
Abstract: We describe here a scanning optical beam that is comprised of no moving parts The device includes a plurality of microfabricated beam shaping elements disposed in an array wherein each microfabricated beam shaping element is registered with a microfabricated light source but has an optical axis that is offset from the optical axis of the light source by a different amount, wherein the amount is a function of the distance from a center of the arrays. A method of operating the scanning optical beam is also described.
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