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公开(公告)号：US09388037B2
公开(公告)日：2016-07-12
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Jeffery F. Summers
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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Patent Agency Ranking
公开(公告)号：US09330874B2
公开(公告)日：2016-05-03
申请号：US14456972
申请日：2014-08-11
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Vikram Patil
CPC classification number: H01H59/0009 , B81C1/00333 , H01H49/00 , H03H9/1057
Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.
Abstract translation: 用于在微细结构中形成空腔的方法包括用低温焊料密封该空腔。 该方法可以包括在衬底上形成牺牲层，在牺牲层上形成柔性膜，形成通过柔性膜到牺牲层的释放孔，通过释放孔引入蚀刻剂以去除牺牲层，然后密封 该释放孔与低温焊料。
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公开(公告)号：US09533877B2
公开(公告)日：2017-01-03
申请号：US15098353
申请日：2016-04-14
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen
CPC classification number: B81B7/0067 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00317 , B81C3/001 , B81C2201/013 , B81C2201/0197 , B81C2203/031 , H01L24/00 , H04R19/02
Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.
Abstract translation: 具有图案化电介质阻挡层和可氧化金属层的第一富离子电介质基片阳极结合到第二富离子电介质基片上。 为了结合基板，可氧化的金属层被氧化。 电介质阻挡层可以抑制这些离子迁移到粘结线，否则可能会损害粘结强度。 因此，当接合两个基板时，在晶片之间保持牢固的结合。
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4.发明授权公开(公告)号：US09156679B1
公开(公告)日：2015-10-13
申请号：US14326406
申请日：2014-07-08
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Jeffery F. Summers
CPC classification number: H01L31/18 , B81B2201/047 , B81B2207/093 , B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/031 , H01L31/0203 , H01L33/0079 , H02S40/44
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有第二键，例如金属合金，焊料，共晶和聚合物键。 两个键可以用于相同或不同的目的，并且可以选择以下属性：气密性，导电性，低RF损耗，高粘合强度，耐漏电性，导热性。 每种粘合技术的属性可能相同，或者它们可能不同。
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公开(公告)号：US10017381B2
公开(公告)日：2018-07-10
申请号：US15477593
申请日：2017-04-03
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen
CPC classification number: B81C1/00182 , B81B3/0018 , B81B2201/0264 , B81C2201/01 , G01L7/022 , G01L7/024 , G01L7/026 , G01L7/163 , G01L9/0001 , G01L9/0042 , G01L9/0054 , G01L9/0089
Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.
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公开(公告)号：US09315375B2
公开(公告)日：2016-04-19
申请号：US14142712
申请日：2013-12-27
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Jeffery F. Summers
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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