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    방열기판 및 그 제조방법
    31.
    发明公开
    방열기판 및 그 제조방법 无效
    加热基板及其制造方法

    公开(公告)号：KR1020120055307A

    公开(公告)日：2012-05-31

    申请号：KR1020100116981

    申请日：2010-11-23

    Applicant: 삼성전기주식회사

    Inventor： 박지현 ,  최석문 ,  이영기

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/053 ,  H05K2201/09745

    Abstract: PURPOSE: A heat radiation substrate and a manufacturing method thereof are provided to rapidly transmit heat from a device to the outside by making a heat sink integrated substrate made of metal materials. CONSTITUTION: A base substrate(110) has a groove and is integrated with a heat sink. An insulation layer(130) is formed on the base substrate with an anode oxidation process. A circuit layer(150) is formed on the insulation layer. A printed circuit board is arranged on the upper side of the groove. The device is formed on the printed circuit board. The base substrate includes a heat sink base unit with a planar shape and a heat sink fin.

    Abstract translation: 目的：提供一种散热基板及其制造方法，通过制造由金属材料制成的散热器一体化基板，将热量从设备向外部传递。 构成：基底（110）具有凹槽并与散热器集成。 在阳极氧化工艺的基底上形成绝缘层（130）。 在绝缘层上形成电路层（150）。 印刷电路板布置在凹槽的上侧。 该装置形成在印刷电路板上。 基底基板包括具有平面形状的散热器基座单元和散热片。

    하이브리드형 방열기판 및 그 제조방법
    33.
    发明公开
    하이브리드형 방열기판 및 그 제조방법 有权
    混合放热基板及其制造方法

    公开(公告)号：KR1020110082895A

    公开(公告)日：2011-07-20

    申请号：KR1020100002828

    申请日：2010-01-12

    Applicant: 삼성전기주식회사

    Inventor： 김태훈 ,  최석문 ,  박지현

    IPC: H01L23/34

    CPC classification number: H01L2924/0002 ,  H01L2924/00

    Abstract: PURPOSE: A hybrid heat radiating substrate and a manufacturing method thereof are provided to easily emit heat generated in a heating device by using a metal core layer, thereby optimizing the performance of the heating device. CONSTITUTION: A metal core layer(110) includes a cavity(115). A resin core layer(130) is formed in the cavity. An insulating layer(120) is formed on the outside of the metal core layer. A circuit layer(140) includes a first circuit pattern and a second circuit pattern. The first circuit pattern is formed on the insulating layer. The second circuit pattern is formed on the resin core layer. A thermally weak device is mounted on the second circuit pattern formed on the resin core layer.

    Abstract translation: 目的：提供一种混合散热基板及其制造方法，通过使用金属芯层容易地发出在加热装置中产生的热量，从而优化加热装置的性能。 构成：金属芯层（110）包括空腔（115）。 在空腔中形成树脂芯层（130）。 绝缘层（120）形成在金属芯层的外侧。 电路层（140）包括第一电路图案和第二电路图案。 第一电路图案形成在绝缘层上。 第二电路图案形成在树脂芯层上。 热脆弱装置安装在形成在树脂核心层上的第二电路图案上。

    방열기판 및 그 제조방법
    34.
    发明公开
    방열기판 및 그 제조방법 失效
    加热基板及其制造方法

    公开(公告)号：KR1020110082354A

    公开(公告)日：2011-07-19

    申请号：KR1020100002301

    申请日：2010-01-11

    Applicant: 삼성전기주식회사

    Inventor： 김태훈 ,  신상현 ,  박지현

    IPC: H05K1/02 ,  H05K7/20

    Abstract: PURPOSE: A radiation substrate and manufacturing method thereof form the wiring of multi-layered by using the method of growth of the porosity oxide isolation layer. CONSTITUTION: A radiation substrate(100) comprises a metal core layer(10), two insulating layer formed the metal core layer, two circuit layer, and a via interlinking the circuit layer. The metal core layer is composed of the metal. A first insulation layer(20) comprises an oxide isolation layer barrier layer(22), a first porous layer(24), and an insulating material(I). The barrier layer and the first porous layer are the oxide isolation layer which is formed by oxidizing the metal core layer. The barrier layer is having the mutually different thickness the part which is not formed of the formation part of a first circuit layer(30) and the first circuit layer.

    Abstract translation: 目的：辐射基板及其制造方法通过使用孔隙氧化物隔离层的生长方法形成多层布线。 构成：辐射基板（100）包括金属芯层（10），形成金属芯层的两个绝缘层，两个电路层和互连电路层的通孔。 金属芯层由金属构成。 第一绝缘层（20）包括氧化物隔离层阻挡层（22），第一多孔层（24）和绝缘材料（I）。 阻挡层和第一多孔层是通过氧化金属芯层而形成的氧化物隔离层。 阻挡层的厚度不同于第一电路层（30）的形成部分和第一电路层不形成的部分。

    방열기판 및 그 제조방법
    36.
    发明公开
    방열기판 및 그 제조방법 无效
    散热基板及其制造方法

    公开(公告)号：KR1020100125805A

    公开(公告)日：2010-12-01

    申请号：KR1020090044687

    申请日：2009-05-21

    Applicant: 삼성전기주식회사

    Inventor： 손영호 ,  최석문 ,  박성근 ,  이영기 ,  장범식 ,  박지현

    IPC: H05K1/02 ,  H05K7/20

    CPC classification number: H05K3/4623 ,  H05K1/056 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

    Abstract: PURPOSE: A heat dissipating substrate and a manufacturing method thereof are provided to form a circuit layer by forming an anode oxidation insulating layer in a metal core. CONSTITUTION: A first core substrate(112a) is formed by laminating a first circuit layer(110a) on a first metal core(102a) which has a first anode oxidation insulating layer(108a). A second core substrate(112b) is electrically connected to the first core substrate. The second core substrate is formed by laminating a second circuit layer(110b) on a second metal core(102b) which has a second anode oxidation insulating layer(108b). A front layer penetration hole is formed by eliminating an insulating member(114) between a first penetration hole and a second penetration hole. A conductive material(120) is inserted into the front layer penetration hole.

    Abstract translation: 目的：提供散热基板及其制造方法，通过在金属芯中形成阳极氧化绝缘层来形成电路层。 构成：通过在具有第一阳极氧化绝缘层（108a）的第一金属芯（102a）上层压第一电路层（110a）来形成第一芯基板（112a）。 第二芯基板（112b）电连接到第一芯基板。 第二芯基板通过在具有第二阳极氧化绝缘层（108b）的第二金属芯（102b）上层叠第二电路层（110b）而形成。 通过消除第一贯通孔和第二贯通孔之间的绝缘构件（114）形成前层贯通孔。 导电材料（120）插入到前层穿透孔中。

    정전기 방전(ＥＳＤ)을 강화한 엘이디 패키지 및 그제조방법
    37.
    发明公开
    정전기 방전(ＥＳＤ)을 강화한 엘이디 패키지 및 그제조방법 有权
    정전기방전（ESD）을강화디이트패키지및그제조방

    公开(公告)号：KR1020070004189A

    公开(公告)日：2007-01-09

    申请号：KR1020050059577

    申请日：2005-07-04

    Applicant: 삼성전기주식회사

    Inventor： 김현호 ,  최석문 ,  최상현 ,  김용식 ,  박지현

    IPC: H01L33/48

    CPC classification number: H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113

    Abstract: A light emitting diode package with improved electrostatic discharge and a method for manufacturing the same are provided to protect a light emitting chip from overvoltage of electrostatic discharge by connecting a varistor with the light emitting chip in parallel. A light emitting diode package includes a terminal(10) with an electrode, a varistor(20) electrically connected to the terminal and forming an electrode on its surface, a light emitting diode chip(30) connected in parallel with the electrode of the varistor in a flip chip manner, and a molding portion(40) covering the varistor and the light emitting diode chip, The terminal is made of a board with a cathode conductive pattern and an anode conductive pattern.

    Abstract translation: 提供了一种具有改进的静电放电的发光二极管封装及其制造方法，以通过并联连接变阻器和发光芯片来保护发光芯片免于静电放电的过电压。 发光二极管封装包括具有电极的端子（10），电连接到端子并在其表面上形成电极的变阻器（20），与变阻器的电极并联连接的发光二极管芯片（30） 以覆盖所述变阻器和所述发光二极管芯片的模制部分（40），所述端子由具有阴极导电图案和阳极导电图案的板制成。

    시험대상 발광 다이오드 칩 고정장치
    38.
    发明授权
    시험대상 발광 다이오드 칩 고정장치 有权
    시험대상발광다이오드칩고정장치

    公开(公告)号：KR100638817B1

    公开(公告)日：2006-10-27

    申请号：KR1020050041783

    申请日：2005-05-18

    Applicant: 삼성전기주식회사

    Inventor： 최상현 ,  최석문 ,  박지현 ,  김현호

    IPC: H01L33/00

    Abstract: An apparatus for fixing a tested LED chip is provided to simply fabricate a process for supplying package environments to an LED chip by supplying package environments to a tested LED chip without an encapsulation process using resin and so forth. A tested LED chip(102) is supported by the upper part of a pillar-type main body(110) wherein a base part(116) extending in the outer circumferential direction is formed on the lower part of the main body. An airtight transparent cover(170) is detachably coupled to the base part of the pillar-type main body to supply a predetermined space to the circumference of the main body. An electrical connection unit(130) is so disposed to supply power to the LED chip. The power supplied through the electrical connection unit is supplied to the LED chip by a chip fixing unit(150). The pillar-type main body can be made of metal. The cover can have an edge detachably coupled to the base part of the main body.

    Abstract translation: 提供一种用于固定被测试的LED芯片的设备，以简单地制造用于通过将封装环境供应到测试的LED芯片而无需使用树脂等进行封装处理来将封装环境提供给LED芯片的过程。 测试的LED芯片（102）由支柱型主体（110）的上部支撑，其中在主体的下部形成沿外圆周方向延伸的基部（116）。 气密透明盖（170）可拆卸地连接到支柱型主体的基部以向主体的周边提供预定空间。 电连接单元（130）被设置为向LED芯片供电。 通过电连接单元供应的电力由芯片固定单元（150）供应到LED芯片。 支柱型主体可以由金属制成。 盖可以具有可拆卸地连接到主体的基部的边缘。

    금속 기판을 이용한 ＬＥＤ 패키지 및 그 제조 방법
    39.
    发明授权
    금속 기판을 이용한 ＬＥＤ 패키지 및 그 제조 방법 有权
    采用金属基板的LED封装及其制造方法

    公开(公告)号：KR100616692B1

    公开(公告)日：2006-08-28

    申请号：KR1020050070318

    申请日：2005-08-01

    Applicant: 삼성전기주식회사

    Inventor： 김현호 ,  최석문 ,  최상현 ,  김용식 ,  박지현

    IPC: H01L33/64 ,  H01L23/36

    Abstract: 금속 기판을 이용한 LED 패키지가 개시된다. 본 발명에 따른 LED 패키지는, 제1 영역 및 절연물질에 의해 상기 제1 영역과 분리되어 전기적으로 고립된 복수의 제2 영역을 갖는 금속 기판; 및 상기 복수개의 제2 영역 중 하나의 상면에 장착되는 LED를 포함하며, 상기 복수개의 제2 영역 중 두 개의 제2 영역이, 상기 LED의 n측 전극과 p측 전극에 각각 전기적으로 연결되는 입출력 단자로 이용되는 것을 특징으로 한다.
    금속 기판, 열전도도, LED, 패키지, 방열, Cu, Al, Si

    Abstract translation: 公开了一种使用金属基板的LED封装。 根据本发明的LED封装包括：金属基板，具有第一区域和与第一区域通过绝缘材料电隔离的多个第二区域; 以及安装在所述多个第二区域中的一个上的LED，其中所述多个第二区域中的两个区域电连接到所述LED的所述n侧电极和所述p侧电极， 终端被用作终端。

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