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公开(公告)号：KR100483619B1
公开(公告)日：2005-04-18
申请号：KR1020020077313
申请日：2002-12-06
Applicant: 삼성전기주식회사
IPC: G02B6/43
Abstract: 본 발명은 광 도파로 정렬 위치 검사방법에 관한 것으로, 보다 상세하게는 광 도파로(10)와 기판(20)에 각각 대응되는 마크(16)(22) 표시를 해 놓고, 대응되는 마크의 X축, Y축 거리 차를 이용하여 광 도파로의 정렬 위치를 검사하도록 한 것을 특징으로 하는 바, 본 발명은 광 도파로와 기판의 대응되는 마크 표시의 거리 차를 계산하여 초기 설계 값 대비 광 도파로의 틀어짐 또는 위치 변경을 용이하게 파악할 수 있으며, 따라서 변형된 광 도파로의 위치만큼 빅셀 및 구동 IC의 위치를 맞추어 빛의 도파 손실을 최소화할 수 있는 효과가 있다.
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公开(公告)号：KR1020040016327A
公开(公告)日：2004-02-21
申请号：KR1020020048601
申请日：2002-08-16
Applicant: 삼성전기주식회사
IPC: H05K3/32
CPC classification number: H05K1/0274 , G02B6/423 , G02B6/4236 , G02B6/43 , Y10T29/49126 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/109 , Y10T156/1304 , Y10T156/1309
Abstract: PURPOSE: A method for attaching an optical waveguide element onto a printed circuit board is provided to improve the flatness by attaching the optical waveguide element onto the printed circuit board using an adhesive tape. CONSTITUTION: A dry film(13) is applied onto a copper thin film layer(12) on an upper surface of a printed circuit board(10). The copper thin film layer(12) is exposed by exposing the dry film(13) to a light and dipping the printed circuit board(10) being exposed. Then, the printed circuit board(10) is etched to remove an unnecessary portion of the copper thin film layer(12), so that a groove(15) is formed on the copper thin film layer(12). An optical waveguide element is to be inserted into the groove(15). The optical waveguide element is attached onto the groove(15) by interposing an adhesive tape and applying a hot press.
Abstract translation: 目的：提供一种将光波导元件安装在印刷电路板上的方法，通过使用胶带将光波导元件安装到印刷电路板上来提高平坦度。 构成：将干膜（13）施加到印刷电路板（10）的上表面上的铜薄膜层（12）上。 通过将干膜（13）暴露于光并浸渍被暴露的印刷电路板（10）而使铜薄膜层（12）暴露。 然后，蚀刻印刷电路板（10）以去除铜薄膜层（12）的不需要部分，从而在铜薄膜层（12）上形成凹槽（15）。 将光波导元件插入槽（15）中。 光波导元件通过插入粘合带并施加热压而附接到凹槽（15）上。
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公开(公告)号：KR100320940B1
公开(公告)日：2002-08-24
申请号：KR1019960058781
申请日：1996-11-28
Applicant: 삼성전기주식회사
Inventor： 양덕진
IPC: H05K3/00
Abstract: PURPOSE: A basket for use in blackening a PCB(Printed Circuit Board) is provided to the receipt and fetch operations of a PCB supporting deck by constructing the basket in a drawer type, wherein the basket is used for drying a PCB that has been blacken. CONSTITUTION: A blacken PCB(5) is inserted into the inner of a body(2) of a basket(1). A plurality of sticks(6) of a PCB supporting deck(4) are provided on the inner of the body(2). A PCB supporting groove is formed on the PCB supporting deck(4). The blacken PCB(5) is inserted between the sticks(6) one-by-one. Each of the sticks(6) has a rod type that is a core(11) coated with a resin(12). The PCB supporting groove is provided with a solution exhaust hole therein. A supporting piece(10) is installed on the lower of the PCB supporting deck(4) to support the lower of the blacken PCB(5) to be inserted into the PCB supporting deck(4).
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公开(公告)号：KR100332871B1
公开(公告)日：2002-04-17
申请号：KR1019990045520
申请日：1999-10-20
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 본발명의인쇄회로기판은양면에동박이부착된양면동박접착층사이에동박이부착되지않은적층판과그 양면에적층된프리프레그로이루어진접착수단을위치시킨다. 접착수단의적층판과프리프레그는각각양면동박적층판과일반적인접착층보다얇게형성되어인쇄회로기판에동박을부착하기위해압력을인가하는경우접착층의두께편차를감소시켜임피던스불량이발생하는것을방지한다.
Abstract translation: 本发明的印刷电路板是定位粘合剂预浸料坯包括装置从而堆叠层压体和两侧的铜箔不附铜箔之间附着在双面粘合箔的两面。 减少偏差的粘接剂层的厚度时的粘合装置和预浸料层压板形成为比相应的双面覆铜层压板和用于将压力施加到铜箔附着到印刷电路板上，从而防止阻抗缺陷普通粘合剂层薄。
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Patent Agency Ranking
公开(公告)号：KR100320929B1
公开(公告)日：2002-03-13
申请号：KR1019990027789
申请日：1999-07-09
Applicant: 삼성전기주식회사
IPC: C23C22/00
Abstract: 본발명은인쇄회로기판 (Printed Circuit Board: PCB)의표면처리, 보다상세하게는인쇄회로기판제조공정중 내층기판의흑화처리공정에사용되는산을주재로한 화성피막조성물(Conversion Coating Composition)에관한것으로, 본발명에의하여, (1) 황산; (2) 과산화수소; (3) 황화합물; 및 (4) 피막형성보조제, 에칭속도조절제, 반응촉진제및 안정화제중 최소일성분이상을포함하여구성된인쇄회로기판용화성피막조성물이제공된다. 본발명에의한인쇄회로기판용화성피막조성물을사용함으로써종래의흑화처리에비하여단시간내에단축된처리공정으로낮은온도에서흑화처리할 수있으며, 또한본 발명에의한화성피막(Conversion Coating) 조성물로처리된인쇄회로기판은우수한내산성및 접착강도를나타낸다. 더욱이환원처리공정이생략됨으로써종래사용되던고가의환원처리약품의사용이배제되고폐수발생량이 50% 이상감소되어더욱경제적인것이다.
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公开(公告)号：KR1020010027722A
公开(公告)日：2001-04-06
申请号：KR1019990039605
申请日：1999-09-15
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4682 , H05K1/0298 , H05K3/4697
Abstract: PURPOSE: A method of lamination of a multi-layer printed circuit board(PCB) is provided to prevent from occurring operation delay caused by fixing and riveting, reduce operation time, and improve productivity thereby, enables a smooth operation of lamination, and improves impedance characteristics by balanced lamination. CONSTITUTION: In a method of lamination of a multi-layer printed circuit board, multi-layers of a board are laminated sequentially in order of a copper clad laminated(CCL) layer(10) and a prepreg layer(20). Fixing pins(50) hold a laminated board(1) primarily. Cylinders(60) push fixing plates(50) toward the laminated board(1) on both ways vertically. Heaters(70) attached to cylinders(60) operate in temperatures between 200°C and 400°C and frit prepreg layers on touched spots, holding tight the CCL layers(10) thereby.
Abstract translation: 目的：提供多层印刷电路板（PCB）层压方法，以防止由固定和铆接引起的操作延迟，减少操作时间，提高生产率，从而实现层压的平稳运行，并提高阻抗 特点通过平衡层压。 构成：在层叠多层印刷电路板的方法中，以覆铜层压（CCL）层（10）和预浸料层（20）的顺序层叠多层板。 固定销（50）主要固定层压板（1）。 气缸（60）在垂直方向上朝着层压板（1）推动固定板（50）。 连接到气缸（60）的加热器（70）在200℃和400℃之间的温度和接触点上的玻璃料预浸料层之间操作，从而保持紧密的CCL层（10）。
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公开(公告)号：KR1020000075058A
公开(公告)日：2000-12-15
申请号：KR1019990019406
申请日：1999-05-28
Applicant: 삼성전기주식회사
IPC: H05K3/00
CPC classification number: H05K1/0271 , H05K3/4652 , H05K2201/09136
Abstract: PURPOSE: A printed circuit board is provided to prevent the warping of the printed circuit board by cutting a part of a circuit formed in the printed circuit board. CONSTITUTION: A printed circuit board comprises insulation layers(205,209). The first circuit is formed at one side of the insulation films(205,209). The second circuit is formed at the other side of the insulation films(205,209). The second circuit has an area larger than the area of the first circuit. A plurality of cutting portions(211) are provided to prevent the warping of the printed circuit board when the heat-treatment process is carried out. The cutting portions(211) are fabricated by cutting a part of the second circuit. A signal transmitting passage(113) is provided at the cutting portions(211) so as to allow the signal applied to the circuit to pass therethrough.
Abstract translation: 目的：提供印刷电路板，以通过切割形成在印刷电路板中的电路的一部分来防止印刷电路板的翘曲。 构成：印刷电路板包括绝缘层（205,209）。 第一电路形成在绝缘膜（205,209）的一侧。 第二电路形成在绝缘膜（205,209）的另一侧上。 第二电路的面积大于第一电路的面积。 设置多个切割部（211），以防止在执行热处理过程时印刷电路板的翘曲。 通过切割第二电路的一部分来制造切割部分（211）。 信号传输通道（113）设置在切割部分（211）处，以允许施加到电路的信号通过。
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公开(公告)号：KR1020150088630A
公开(公告)日：2015-08-03
申请号：KR1020140009161
申请日：2014-01-24
Applicant: 삼성전기주식회사
IPC: G06F3/041
CPC classification number: G06F3/044 , G06F2203/04103 , G06F2203/04112 , G06F3/041
Abstract: 본발명에따른터치센서는윈도우기판, 상기윈도우기판의일면에접합되며, 베이스기판의일면에적어도둘 이상의전극층이적층되어형성되는제 1 금속세선으로이루어진제 1 전극패턴, 상기베이스기판의타면에적어도둘 이상의전극층이적층되어형성되는제 2 금속세선으로이루어진제 2 전극패턴을포함하고, 상기제 1 및 2 금속세선은상기적층되는전극층의갯수가상호상이할수 있다.
Abstract translation: 根据本发明，触摸传感器包括：窗基板; 第一电极图案，其结合到窗口基板的一个表面，并且由通过使至少两个或更多个电极层堆叠在基底基板的一个表面上而形成的第一细小金属线构成; 以及第二电极图案，其由通过使至少两个或更多个电极层堆叠在基底基板的另一个表面上而形成的第二细金属线构成。 第一和第二细金属线的堆叠电极层的数量可以彼此不同。
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公开(公告)号：KR1020150066216A
公开(公告)日：2015-06-16
申请号：KR1020130151504
申请日：2013-12-06
Applicant: 삼성전기주식회사
CPC classification number: G06F3/044 , G06F2203/04103 , G06F2203/04112
Abstract: 본발명은터치패널및 그의제조방법에관한것으로, 본발명의일 실시예에따른터치패널은기판; 및상기기판의일면또는양면에형성되는도전체세선; 을포함하고, 상기도전체세선은소정의패턴으로형성되는금속층및 상기금속층의상면및 측면에형성되는흑화층을포함할수 있다.
Abstract translation: 触摸面板及其制造方法技术领域本发明涉及触摸面板及其制造方法。 根据本发明的实施例的触摸面板包括在基板的一个表面和两个表面上形成的基板和导体细线，其中，导体细线包括形成有一定图案的金属层和形成的变暗层 在金属层的上表面和侧表面上。
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