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公开(公告)号：KR1020130097473A
公开(公告)日：2013-09-03
申请号：KR1020120019149
申请日：2012-02-24
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
Abstract: PURPOSE: A rigid flexible printed circuit board manufacturing method is provided to include a step preparing an oxidation prevention protecting layer, thereby improving the reliability of a product by protecting a ductility film in a circuit layer removal process of a flexible region. CONSTITUTION: A rigid flexible printed circuit board manufacturing method is comprised of the following steps: a step of providing a ductility film (100) in which a metal layer (110) is formed at one side or both sides; a step of forming a circuit pattern by patterning the metal layer; a step of forming a stopper metal layer (120) on the metal layer of a flexible region (F); a step of preparing an oxidation prevention protecting layer (130) on the stopper metal layer, which enables welding a bonding sheet for fixing the stopper metal layer and the oxidation prevention protecting layer; a step of laminating at least one circuit layer (200) on an insulation film; and finally, a step of removing the circuit layer of the flexible region.
Abstract translation: 目的：提供一种刚性柔性印刷电路板制造方法，其包括制备防氧化保护层的步骤，从而通过在柔性区域的电路层去除工艺中保护延展性膜来提高产品的可靠性。 构成：刚性柔性印刷电路板制造方法包括以下步骤：提供在一侧或两侧形成金属层（110）的延展性膜（100）的步骤; 通过图案化金属层形成电路图案的步骤; 在柔性区域（F）的金属层上形成止动金属层（120）的步骤; 在止动金属层上制备氧化防止保护层（130）的步骤，其能够焊接用于固定止动金属层和氧化防止保护层的接合片; 在绝缘膜上层压至少一个电路层（200）的步骤; 最后，去除柔性区域的电路层的步骤。
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公开(公告)号：KR101051491B1
公开(公告)日：2011-07-22
申请号：KR1020090102783
申请日：2009-10-28
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/06 , H05K1/0218 , H05K1/0278 , H05K1/028 , H05K1/09 , H05K3/0035 , H05K3/281 , H05K3/386 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/0707 , H05K2203/0554 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
Abstract: 본 발명은 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법에 관한 것으로, 일면 또는 양면에 회로패턴이 형성된 연성 필름을 포함하며 상기 회로패턴 상에 형성된 레이저 차단층을 구비하는 플렉서블 영역, 및 상기 플렉서블 영역과 인접한 영역에 형성되며 상기 플렉서블 영역의 연성 필름 양측으로 연장된 연장부의 일면 또는 양면에 다수의 패턴층을 포함하는 리지드 영역을 포함한다.
다층 경연성 인쇄회로기판, 레이저 차단층, 전자파 차폐층, 플렉서블 영역, 리지드 영역, 비아홀, 관통홀, 프리프레그(Prepreg), 폴리 이미드Abstract translation: 一种多层刚性柔性印刷电路板，其包括柔性区域和刚性区域，所述柔性区域包括柔性膜，所述柔性膜具有形成在其一个或两个表面上的电路图案和形成在所述电路图案上的激光阻挡层，所述刚性区域形成为与所述柔性区域相邻， 在延伸至柔性区域的柔性膜的两侧的延伸部分的一个或两个表面上的图案层以及用于制造该柔性膜的柔性膜的方法。
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3.发明公开
公开(公告)号：KR1020110060521A
公开(公告)日：2011-06-08
申请号：KR1020090117124
申请日：2009-11-30
Applicant: 삼성전기주식회사
IPC: H01M8/02
CPC classification number: Y02P70/56 , H01M8/0204 , H01M8/0228 , H01M8/0247 , H01M8/0258 , H01M8/1011 , H01M2008/1095 , Y02E60/521 , Y02E60/523
Abstract: PURPOSE: A current collector plate for a fuel cell is provided to enable production with low costs using a copper clad laminate capable of easy processing by a general substrate fabrication process. CONSTITUTION: A current collector plate(100) for a fuel cell includes: a copper clad laminate(110) equipped with an insulating layer(111) and a copper foil(112) formed on the insulating layer; a channel for supplying the fluid to a membrane-electrode assembly; and a first insulating substrate(120) which is laminated on the insulating layer and includes a fluid inlet(124) to connect the channel. The copper foil comprises a plurality of current collecting patterns(113). The channel comprises a plurality of unit channels.
Abstract translation: 目的：提供一种用于燃料电池的集流板，以便能够通过通常的基板制造工艺容易地处理的覆铜层压板以低成本生产。 一种用于燃料电池的集电板（100）包括：在绝缘层上形成有绝缘层（111）和铜箔（112）的覆铜层压板（110） 用于将流体供应到膜 - 电极组件的通道; 以及层叠在所述绝缘层上并且包括用于连接所述通道的流体入口（124）的第一绝缘基板（120）。 铜箔包括多个集电图案（113）。 信道包括多个单元信道。
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公开(公告)号：KR101009072B1
公开(公告)日：2011-01-18
申请号：KR1020090000429
申请日：2009-01-05
Applicant: 삼성전기주식회사
Abstract: 본 발명은 리지드-플렉시블 기판의 제조방법에 관한 것으로, (A) 리지드 영역과 플렉시블 영역으로 구획되며, 폴리이미드층에 내층 회로층이 형성된 플렉시블 기판을 제조하는 단계, (B) 상기 리지드 영역의 폴리이미드층에 제1 절연층 및 제1 금속층을 적층한 후 층간 연결을 위한 제1 비아홀을 가공하고, 1차 디스미어 공정을 수행하는 단계, (C) 상기 플렉시블 영역 및 상기 제1 비아홀을 포함하여 상기 리지드 영역의 상기 제1 금속층에 제1 도금층을 형성하고, 상기 제1 금속층 및 상기 제1 도금층을 패터닝하여 제1 회로층을 형성하는 단계, (D) 상기 제1 회로층이 형성된 제1 절연층에 제2 절연층 및 제2 금속층을 적층한 후, 층간 연결을 위한 제2 비아홀을 가공하고, 2차 디스미어 공정을 수행하는 단계, 및 (E) 상기 플렉시블 영역 및 상기 제2 비아홀을 포함하여 상기 리지드 영역의 상기 제2 금속층에 제2 도금층을 형성한 후, 제2 금속층 및 제2 도금층을 패터닝하여 제2 회로층을 형성하고, 상기 플렉시블 영역의 상기 제1 도금층 및 상기 제2 도금층을 제거하는 단계를 포함하며, 종래 개시된 공정의 재설계를 통해 별도의 추가공정 없이 액침투 현상 및 디스미어 어택을 최소화할 수 있는 제조방법을 제공한다.
커버레이, 디스미어, 리지드, 플렉시블, 액침투-
公开(公告)号：KR1020100071623A
公开(公告)日：2010-06-29
申请号：KR1020080130409
申请日：2008-12-19
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4691 , H05K5/0017 , H05K2201/0154 , H05K2201/10136
Abstract: PURPOSE: A rigid-flexible substrate and a fabricating method the same are provided to increase spatial utilization by connecting a flexible part to the inside of a first lead unit. CONSTITUTION: A first rigid part(R1) comprises an opening. A flexible portion(F) is connected to the inside of the first rigid part. The inside of the first rigid part is exposed through the opening(122). A second rigid part(R2) is connected to the other end of the flexible portion.
Abstract translation: 目的：提供一种刚性柔性基板及其制造方法，以通过将柔性部件连接到第一引线单元的内部来增加空间利用率。 构成：第一刚性部分（R1）包括开口。 柔性部分（F）连接到第一刚性部分的内部。 第一刚性部分的内部通过开口（122）露出。 第二刚性部分（R2）连接到柔性部分的另一端。
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Patent Agency Ranking
公开(公告)号：KR100905574B1
公开(公告)日：2009-07-02
申请号：KR1020070075187
申请日：2007-07-26
Applicant: 삼성전기주식회사
IPC: H05K3/42
Abstract: 본 발명은 회로패턴의 두께를 줄여 미세회로를 구현하고, 인쇄회로기판의 두께를 줄이며, 인쇄회로기판의 제조 비용을 줄일 수 있는 인쇄회로기판의 제조방법에 관한 것이다.
플렉서블, 리지드, 미세 회로, 커버레이Abstract translation: 本发明减小了电路图案的厚度实现微电路，降低了印刷电路板的厚度，制造印刷电路板，其可以减少印刷电路板的制造成本的方法。
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公开(公告)号：KR1020090011528A
公开(公告)日：2009-02-02
申请号：KR1020070075187
申请日：2007-07-26
Applicant: 삼성전기주식회사
IPC: H05K3/42
CPC classification number: H05K3/429 , H05K1/115 , H05K3/4038
Abstract: A fabricating method of a printed circuit board is provided to improve the flexibility and flexibility of the printed circuit board by reducing the thickness of the circuit pattern. In a fabricating method of a printed circuit board, a copper foil(4) is laminated on the single-side of the insulating layer(2). The insulating layer is one of the flexible insulating material or the rigid insulating material. The via hole(6) is formed on the disk by a drilling process. The seed layer(8) is formed on the via hole inner wall and insulating layer by electroless plating or the sputtering process. The electrolysis copper plating layer is formed on the seed layer, and at this time, the electrolysis copper plating layer is not formed on the copper foil. Rest seed layer, copper plating layer and copper foil excepting a via hole are etched. Therefore, the circuit pattern is formed at both sides of the insulating layer.
Abstract translation: 提供印刷电路板的制造方法，通过减小电路图案的厚度来提高印刷电路板的柔性和柔性。 在印刷电路板的制造方法中，在绝缘层（2）的单面层叠有铜箔（4）。 绝缘层是柔性绝缘材料或刚性绝缘材料之一。 通孔（6）通过钻孔工艺形成在盘上。 种子层（8）通过无电镀或溅射法形成在通孔内壁和绝缘层上。 在种子层上形成电解铜镀层，此时在铜箔上不形成电解铜镀层。 蚀刻剩余种子层，铜镀层和除了通孔以外的铜箔。 因此，电路图案形成在绝缘层的两侧。
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公开(公告)号：KR1020080017153A
公开(公告)日：2008-02-26
申请号：KR1020060078816
申请日：2006-08-21
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4691 , H05K3/022 , H05K3/281
Abstract: A method for fabricating a rigid flexible printed circuit board is provided to reduce a process cost and a process time, by forming a cover lay on an inner circuit pattern using a quick press. In a method for fabricating a rigid flexible printed circuit board, an inner circuit pattern is formed by using a copper film layer(112a) on a flexible copper stacked plate composed of a polyimide layer(111) and the copper film layer. A cover lay(114) is formed on the inner circuit pattern using a quick press. The flexible copper stacked plate with the cover lay is divided into a rigid region(118a) and a flexible region(118b), and a prepreg(116) is stacked on the cover lay of the rigid region, and a base copper plate(112b) is stacked on the prepreg and is pressed. The formed substrate is hardened by using a press.
Abstract translation: 提供一种用于制造刚性柔性印刷电路板的方法，通过使用快速压机形成覆盖在内部电路图案上的盖子来减少工艺成本和处理时间。 在制造刚性柔性印刷电路板的方法中，通过在由聚酰亚胺层（111）和铜膜层构成的柔性铜叠层板上使用铜膜层（112a）形成内部电路图案。 使用快速压机在内部电路图案上形成盖板（114）。 具有盖板的柔性铜层压板被分成刚性区域（118a）和柔性区域（118b），并且在刚性区域的盖板上堆叠预浸料坯（116），并且将基底铜板（112b） ）堆叠在预浸料上并被按压。 通过使用压力机将形成的基板硬化。
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公开(公告)号：KR100754073B1
公开(公告)日：2007-08-31
申请号：KR1020070049783
申请日：2007-05-22
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: A method of manufacturing a multi-layer printed circuit board is provided to improve conformity between an inner layer and an outer layer by forming a circuit pattern in a first outer layer before laminating and forming a circuit pattern in a second outer layer after laminating. A first outer layer(10), inner layers(20,30), and a second outer layer(40) are provided. The inner and outer layers contain respective circuit patterns thereon. Coverlays(17,27,37,47) are formed on at least one of the first outer layer and the second outer layer. The first outer layer, the inner layers, and the second outer layer are laminated in one lump and connected to one another. A through-hole(60) is formed on the first outer layer, inner layers, and the second outer layer. A copper plating layer(70) is formed on the through-hole region.
Abstract translation: 提供一种制造多层印刷电路板的方法，通过在层压之前在第一外层中形成电路图案并在层压之后在第二外层中形成电路图案来改善内层和外层之间的一致性。 提供第一外层（10），内层（20,30）和第二外层（40）。 内层和外层在其上包含相应的电路图案。 覆盖层（17,27,37,47）形成在第一外层和第二外层中的至少一个上。 第一外层，内层和第二外层一次层压并相互连接。 通孔（60）形成在第一外层，内层和第二外层上。 在通孔区域上形成镀铜层（70）。
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公开(公告)号：KR100674301B1
公开(公告)日：2007-01-24
申请号：KR1020050094456
申请日：2005-10-07
Applicant: 삼성전기주식회사
CPC classification number: H05K3/1275 , H05K3/1216 , H05K2201/05
Abstract: A method for printing characters of a rigid-flexible printed circuit board is provided to implement a high density by forming all desired characters on a flexible region although the characters are not printed on the flexible region by increasing a density of a rigid region. A method for printing characters of a rigid-flexible printed circuit board includes the steps of: printing at least one character on a flexible region by using a stamp with a character printing surface(S200); and drying the characters printed on the flexible region(S300), wherein the character printing surface of the stamp is equal or larger than the flexible region in size.
Abstract translation: 提供了一种用于打印刚性柔性印刷电路板的字符的方法，以通过在柔性区域上形成所有期望的字符来实现高密度，尽管通过增加刚性区域的密度，字符不会印刷在柔性区域上。 一种用于打印刚挠柔性印刷电路板的字符的方法包括以下步骤：通过使用具有字符印刷表面的印模来在柔性区域上印刷至少一个字符（S200）; 以及干燥打印在柔性区域上的字符（S300），其中印模的字符印刷表面的尺寸等于或大于柔性区域。
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