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公开(公告)号：KR101922878B1
公开(公告)日：2018-11-29
申请号：KR1020170046259
申请日：2017-04-10
Applicant: 삼성전기주식회사
Abstract: 기판과, 상기기판상부에배치되는하부전극과, 상기하부전극의적어도일부를덮도록형성되는압전체층과, 상기압전체층상에형성되는상부전극및 상기기판과상기하부전극사이에배치되는에어갭의가장자리를덮도록형성되는형상제어층을포함하며, 상기형상제어층의형성시 상기형상제어층에인장응력이가해지도록하여상기형상제어층이형성되는탄성파공진기장치가개시된다.
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公开(公告)号：KR20180032027A
公开(公告)日：2018-03-29
申请号：KR20160120664
申请日：2016-09-21
Applicant: 삼성전기주식회사
CPC classification number: H03H9/17 , H03H9/02118 , H03H9/02157 , H03H9/173 , H03H9/547
Abstract: 본발명은공진기의가장자리에서발생하는수평공진에의한노이즈를감소시킬수 있도록구성된음향공진기에관한것이다. 이를위한본 발명의음향공진기는공동에배치되고제1평균두께를갖는제1압전부; 및상기제1압전부의가장자리에배치되고제2평균두께를갖는제2압전부;를포함한다.
Abstract translation: 声波谐振器包括：压电层的第一压电部分，设置在空腔上并具有第一平均厚度; 以及所述压电层的第二压电部分，与所述第一压电部分的边缘相邻设置，并且具有不同于所述第一平均厚度的第二平均厚度。
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公开(公告)号：KR1020160040014A
公开(公告)日：2016-04-12
申请号：KR1020140133459
申请日：2014-10-02
Applicant: 삼성전기주식회사
IPC: G06F3/041
CPC classification number: G06F3/041
Abstract: 본발명의일실시예에따른터치센서모듈은일방향으로접히도록폴딩(Folding)영역이형성되는베이스기판및 베이스기판상에형성되는전극패턴을포함하며, 폴딩영역상에형성된전극패턴은유연한재질의전도성부재로형성됨으로써접힙시발생하는응력으로인한전극패턴의파괴를방지한다.
Abstract translation: 根据本发明的实施例，触摸传感器模块包括：形成折叠区域的基底基板，其被配置为沿第一方向折叠; 以及形成在基底基板上的电极图案。 由于形成在折叠区域中的电极图案形成为由柔性材料制成的导电构件，因此可以防止可能由折叠过程产生的应力引起的电极图案的破坏。
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公开(公告)号：KR1020150066217A
公开(公告)日：2015-06-16
申请号：KR1020130151505
申请日：2013-12-06
Applicant: 삼성전기주식회사
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112
Abstract: 본발명은터치패널및 그의제조방법에관한것으로본 발명의일 실시예에따른터치패널은기판; 상기기판의일면에형성되는도전체세선; 및상기도전체세선에있어서상기기판과의대향면및 상기기판과의반대면중 일면에형성되는흑화층; 을포함할수 있다.
Abstract translation: 触摸面板及其制造方法技术领域本发明涉及触摸面板及其制造方法。 根据本发明的实施例的触摸面板包括基板，形成在基板的一个表面上的导体细线，以及形成在与基板相对的表面的一个表面上并且与基板相对的表面的变暗层， 导线细线。
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公开(公告)号：KR1020150050066A
公开(公告)日：2015-05-08
申请号：KR1020130131427
申请日：2013-10-31
IPC: H05H1/24 , H05H1/46 , H01L21/3065
CPC classification number: H05H1/46 , H01J37/3211 , H01J37/32798 , H05H2001/4652 , H05H2001/4667
Abstract: 본발명에따른플라즈마발생장치는, 유동가스가수용및 통과되는수용부가형성된돔형태의다수의유전체및 다수의상기유전체의외측면을따라나선형태로각각형성되는다수의코일을포함하고, 상기코일에전원이공급되면상기유전체에플라즈마가발생된다.
Abstract translation: 根据本发明的等离子体产生装置包括：多个具有宿主形式的电介质，其具有接收和通过流动气体的接收部分; 并且多个线圈沿着电介质的外表面分别形成为螺旋形状。 当电源被提供给线圈时，在电介质上产生等离子体。
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Patent Agency Ranking
公开(公告)号：KR101482429B1
公开(公告)日：2015-01-13
申请号：KR1020130095477
申请日：2013-08-12
Applicant: 삼성전기주식회사
CPC classification number: H05K3/108 , H05K2201/098 , H05K2203/087 , H05K2203/092 , H05K2203/095 , H05K2203/1105 , H05K2203/111 , H05K2203/1184 , H05K2203/1383 , Y10T29/49155
Abstract: 본 발명은 인쇄회로기판 및 그 제조방법을 제공한다. 구체적으로는, 본 발명의 대표적인 구현 예에 따른 인쇄회로기판에 있어서, 회로패턴의 시드층의 양쪽 측면에 식각홈이 형성된 상기 인쇄회로기판은 상기 회로패턴의 선폭을 보호하고, 언더컷을 억제하는 효과를 나타낼 수 있다.
Abstract translation: 本发明提供一种印刷电路板及其制造方法。 根据本发明的实施例，其电路图案中的种子层包括两侧的蚀刻槽的印刷电路板保护电路图案的线宽并防止底切。
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公开(公告)号：KR1020140081232A
公开(公告)日：2014-07-01
申请号：KR1020120150778
申请日：2012-12-21
Applicant: 삼성전기주식회사
IPC: H01L21/673
CPC classification number: H01L21/673 , H01L21/67017
Abstract: Disclosed are a vacuum degas chamber and a cassette having uniform temperature distribution. The cassette includes a top frame and a bottom frame which are separately arranged in a vertical direction; guide frames which are arranged to face each other between both end parts of the top frame and the bottom frame and in which multiple guide slots guiding the outer circumference of a substrate are separately arranged corresponding to each other; and a docking pipe installed on the bottom center of the bottom frame to be docked on a cassette holder and receiving heat from the cassette holder. Therefore, the cassette has an effect of improving the uniformity of the inner temperature of the cassette by conducting the heat to the cassette itself as a heat block is installed on the cassette holder.
Abstract translation: 公开了一种真空脱气室和具有均匀温度分布的盒。 盒子包括在垂直方向上分开设置的顶部框架和底部框架; 在顶框架的两端部和底框架的两端部彼此相对配置的引导框架，其中引导基板的外周的多个引导槽彼此分开布置; 以及安装在底架的底部中心上以对接在盒座上并从盒座承受热量的对接管。 因此，盒式磁带具有通过在盒式磁带架上安装加热块而将热传导到磁带盒本身来提高磁带盒内部温度的均匀性的效果。
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公开(公告)号：KR1020140038126A
公开(公告)日：2014-03-28
申请号：KR1020120104449
申请日：2012-09-20
Applicant: 삼성전기주식회사
CPC classification number: H05K3/06 , H05K1/02 , H05K3/027 , H05K3/108 , H05K2203/087 , H05K2203/107 , Y10T29/49156 , H05K3/0023 , H05K3/0026 , H05K3/064
Abstract: The present invention relates to a method of removing a seed layer in a printed circuit board manufacturing process. The method of removing a seed layer in a printed circuit board manufacturing process according to the present invention includes the steps of: forming a photoresist layer on a printed circuit board in which a seed layer is formed on a surface thereof; removing the photoresist layer in a predetermined shape; forming a plating layer for a circuit in the predetermined pattern in which the photoresist layer is formed; forming corrosion layers on surfaces of the seed layer and the plating layer by bringing the board from which the seed layer is exposed in a reactor filled with a gas into a chemical reaction; and removing the seed layer by projecting a laser beam to the corrosion layers to remove the corrosion layers. According to the present invention, laser ablation as a dry etching method instead of a conventional wet etching method is employed when a copper seed layer is removed, a precise wire pattern can be obtained even with low energy by causing a chemical reaction by gas to produce a chloride corrosion layer on a seed layer and performing laser ablation, and damage to a copper plating layer can be prevented. [Reference numerals] (AA) Start; (BB) End; (S101) Form a photoresist on a printed circuit board in which a seed layer is formed on a surface thereof; (S102) Remove the photoresist layer in a predetermined pattern; (S103) Form a circuit plating layer in the predetermined pattern from which the photoresist layer is removed; (S104) Expose the seed layer by removing the photoresist layer around the plating layer; (S105) Form Chloride corrosion layers on surfaces of the seed layer and the plating layer by bringing the board from which the seed layer is exposed into a chemical reaction in a reactor filled with a chloride (Cl2) gas; (S106) Remove the seed layer by projecting a laser beam to the chloride corrosion layer and removing the chloride corrosion layer
Abstract translation: 本发明涉及一种在印刷电路板制造工艺中去除种子层的方法。 在根据本发明的印刷电路板制造方法中去除种子层的方法包括以下步骤：在其表面上形成种子层的印刷电路板上形成光致抗蚀剂层; 以预定形状去除光致抗蚀剂层; 在其中形成光致抗蚀剂层的预定图案中形成用于电路的镀层; 通过使填充有气体的反应器中暴露于种子层的基板进入化学反应，在种子层和镀层的表面上形成腐蚀层; 并通过将激光束投射到腐蚀层去除腐蚀层来去除种子层。 根据本发明，当去除铜籽晶层时，采用干法蚀刻法代替传统的湿式蚀刻方法的激光烧蚀法，即使通过气体产生化学反应也能以低能量获得精确的线图 可以防止种子层上的氯化物腐蚀层进行激光烧蚀，并且可以防止铜镀层的损伤。 （附图标记）（AA）开始; （BB）结束; （S101）在其表面上形成种子层的印刷电路板上形成光致抗蚀剂; （S102）以预定图案去除光致抗蚀剂层; （S103）形成除去光致抗蚀剂层的预定图案的电路镀层; （S104）通过除去镀层周围的光致抗蚀剂层来曝光种子层; （S105）通过将填充有氯化物（Cl2）气体的反应器中的种子层暴露于化学反应的基板，使晶种层和镀层的表面上的氯化物腐蚀层成形; （S106）通过将激光束投射到氯化物腐蚀层并除去氯化物腐蚀层来去除种子层
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公开(公告)号：KR102176280B1
公开(公告)日：2020-11-09
申请号：KR20150181490
申请日：2015-12-18
Applicant: 삼성전기주식회사
Abstract: 본발명은음향공진기및 그제조방법에관한것으로, 음향공진기는제1 전극, 제2 전극및 압전층을포함하는공진부; 및이 공진부의일측에배치되는복수의시드층을포함하여서, 압전층의고결정성확보가가능함에따라음향파의손실을최소화하고음향공진기의 kt2값및 성능을향상시킬수 있는효과가있게된다.
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公开(公告)号：KR1020160038608A
公开(公告)日：2016-04-07
申请号：KR1020140131912
申请日：2014-09-30
Applicant: 삼성전기주식회사
CPC classification number: C09J7/22 , C09J2201/128 , C09J2203/318 , G06F3/041
Abstract: 본발명의일실시예에따른투명접착필름은제 1 투명접착층, 제 1 투명접착층상에형성되는배리어층및 배리어층상에형성되는제 2 투명접착층을포함하며배리어층은금속층및 적어도하나이상의층을포함하여수분및 가스의확산을차단하여투명접착필름(10)이사용된전자기기의내구성을향상시킬수 있다.
Abstract translation: 根据本发明实施方案的透明粘合剂膜包括第一透明粘合剂层; 形成在所述第一透明粘合剂层上的阻挡层; 以及形成在所述阻挡层上的第二透明粘合剂层，其中所述阻挡层包括金属层和至少一层以阻挡水分和气体的扩散，从而提高使用所述透明粘合膜（10）的电子设备的耐久性。
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