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    반도체 모듈
    31.
    发明授权
    반도체 모듈 有权
    半导体模块

    公开(公告)号：KR101474641B1

    公开(公告)日：2014-12-17

    申请号：KR1020130056471

    申请日：2013-05-20

    Applicant: 삼성전기주식회사

    Inventor： 김종만 ,  임재현

    IPC: H01L23/02 ,  H01L23/36

    Abstract: 본발명은반도체모듈에관한것이다. 본발명의실시예에따른반도체모듈은반도체소자가실장된기판, 기판의타측에형성된방열부재및 기판의일측에형성되어기판과체결되는하우징을포함하며, 하우징은몸체가기판과대향되는내벽으로부터연장되도록형성되며, 몸체의타단에탄성부재가형성되고, 탄성부재가기판의일측을압박하는압박부재를포함할수 있다.

    Abstract translation: 本发明涉及一种半导体模块。 根据本发明实施例的半导体模块包括其上安装有半导体器件的衬底，形成在衬底的另一侧上的热辐射构件以及形成在衬底的一侧上并紧固到衬底的壳体。 弹性构件可以形成在主体的另一端处，并且弹性构件可以包括用于按压基板的一侧的按压构件。

    반도체 모듈
    33.
    发明公开
    반도체 모듈 无效
    半导体模块

    公开(公告)号：KR1020140064068A

    公开(公告)日：2014-05-28

    申请号：KR1020120130980

    申请日：2012-11-19

    Applicant: 삼성전기주식회사

    Inventor： 임재현 ,  정인화 ,  허창재 ,  서범석 ,  김광수

    IPC: H02M1/42 ,  H02M7/48

    CPC classification number: Y02B70/126 ,  H02M7/48 ,  H02M1/42

    Abstract: The present invention relates to a semiconductor module comprising: a power factor correction unit including a main switch unit having a first main switch and a second main switch which perform the switching operations with a certain phase difference, an auxiliary switch unit having a first auxiliary switch and a second auxiliary switch which respectively form delivery routes of existing surplus power before switch-on operation of the first main switch and the second main switch, an inductor unit which is located between an input power end to receive input power and the main switch unit and accumulates or emits energy according to the switching operations of the main switch unit, and an auxiliary inductor unit to adjust an amount of a current supplying to the auxiliary switch unit when the switching operation is performed by the auxiliary switch; an inverter unit; a control unit to control the power factor correction unit and the inverter unit; and a frame unit having the power factor correction unit, the inverter unit and the control unit mounted therein.

    Abstract translation: 半导体模块技术领域本发明涉及一种半导体模块，包括：功率因数校正单元，包括具有执行具有一定相位差的切换操作的第一主开关和第二主开关的主开关单元，辅助开关单元，具有第一辅助开关 以及第二辅助开关，其分别在所述第一主开关和所述第二主开关的接通操作之前形成现有剩余电力的输送路线;电感器单元，位于输入电力端以接收输入电力与所述主开关单元 并且根据主开关单元的切换动作累积或发出能量;以及辅助电感单元，用于当辅助开关进行切换操作时，调整向辅助开关单元供电的电流量; 逆变器单元; 控制单元，用于控制功率因数校正单元和逆变器单元; 以及具有功率因数校正单元，逆变器单元和控制单元的框架单元。

    전력 모듈 패키지
    35.
    发明授权
    전력 모듈 패키지 有权
    电源模块封装

    公开(公告)号：KR101367065B1

    公开(公告)日：2014-02-24

    申请号：KR1020120121188

    申请日：2012-10-30

    Applicant: 삼성전기주식회사

    Inventor： 조은정 ,  임재현 ,  김태현 ,  손영호

    IPC: H01L23/495 ,  H01L23/48

    CPC classification number: H01L2224/34 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

    Abstract: The present invention relates to a power module package comprising a base substrate having one surface and the other surface; a first pattern formed at one surface of the base substrate; a second pattern formed at the other surface of the base substrate; a circuit layer including via electrically connecting the first and second patterns; a first semiconductor chip and a second semiconductor chip having first surface and second surface, respectively and mounted at the base substrate for the first surface to contact the first pattern; and a lead frame having one side and the other side wherein the one side contacts the second surface of the first and second semiconductor chips, the other side has first lead protruding to outside, one side and the other side, the other side contacts the second pattern, and the other side comprises a second lead protruding to outside.

    Abstract translation: 本发明涉及功率模块封装，其包括具有一个表面和另一个表面的基底基板; 形成在所述基底基板的一个表面上的第一图案; 形成在所述基底基板的另一个表面上的第二图案; 电路层，包括通过电连接第一和第二图案; 第一半导体芯片和第二半导体芯片，分别具有第一表面和第二表面，并且安装在用于第一表面的基底基板上以接触第一图案; 以及具有一侧和另一侧的引线框架，其一侧接触第一和第二半导体芯片的第二表面，另一侧具有突出到外侧，一侧和另一侧的第一引线，另一侧接触第二 图案，另一侧包括突出到外部的第二引线。

    중첩 모듈 패키지 및 그 제조 방법
    36.
    发明公开
    중첩 모듈 패키지 및 그 제조 방법 无效
    超级模块封装及其制造方法

    公开(公告)号：KR1020140002330A

    公开(公告)日：2014-01-08

    申请号：KR1020120070668

    申请日：2012-06-29

    Applicant: 삼성전기주식회사

    Inventor： 조은정 ,  손영호 ,  임재현

    IPC: H01L23/12

    CPC classification number: H05K1/18 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2924/0002 ,  H05K3/306 ,  H05K3/3415 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10689 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: According to the present invention, a superimposed module package includes a printed circuit board, a first module electrically connected onto the printed circuit board, and a second module electrically connected onto the printed circuit board and the first module and overlapped with the printed circuit board and the first module. According to the present invention, the superimposed module package is used in various categories for product lineup by applying various combinations such as a power module, a control module, a light emitting module, a storage module, etc. to each module.

    Abstract translation: 根据本发明，叠加的模块封装包括印刷电路板，电连接到印刷电路板上的第一模块和电连接到印刷电路板和第一模块上并与印刷电路板重叠的第二模块，以及 第一个模块。 根据本发明，通过将各种组合（例如电源模块，控制模块，发光模块，存储模块等）应用于每个模块，叠加的模块封装以各种类别用于产品阵容。

    전력 모듈 패키지 및 그 제조방법
    37.
    发明公开
    전력 모듈 패키지 및 그 제조방법 无效
    功率模块封装及其制造方法

    公开(公告)号：KR1020130055358A

    公开(公告)日：2013-05-28

    申请号：KR1020110121063

    申请日：2011-11-18

    Applicant: 삼성전기주식회사

    Inventor： 조은정 ,  임재현 ,  김태현 ,  손영호

    IPC: H01L23/495 ,  H01L21/60

    CPC classification number: H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: PURPOSE: A power module package and a manufacturing method thereof are provided to reduce the size of a product by thinning a lead frame bonded to a control device than the lead frame bonded to a power device. CONSTITUTION: A first semiconductor chip(130) is bonded to one side(110a) of a first lead frame(110). A second semiconductor chip(140) is bonded to one side(120a) of a second lead frame(120). The thickness of the first lead frame is different from the thickness of the second lead frame. A molding material(160) surrounds one side of the first lead frame, one side of the second lead frame, the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are electrically connected to each lead frame through a wire bonding using a wire(150).

    Abstract translation: 目的：提供一种功率模块封装及其制造方法，通过将与键合到功率器件的引线框架相比，结合到控制装置的引线框架变薄来减小产品的尺寸。 构成：将第一半导体芯片（130）接合到第一引线框架（110）的一侧（110a）。 第二半导体芯片（140）接合到第二引线框架（120）的一侧（120a）。 第一引线框架的厚度与第二引线框架的厚度不同。 模制材料（160）围绕第一引线框架的一侧，第二引线框架的一侧，第一半导体芯片和第二半导体芯片。 第一半导体芯片和第二半导体芯片通过使用导线（150）的引线接合电连接到每个引线框架。

    패키지 모듈 검사 장치
    38.
    发明公开
    패키지 모듈 검사 장치 审中-实审
    封装模块测试装置

    公开(公告)号：KR1020160070463A

    公开(公告)日：2016-06-20

    申请号：KR1020140177446

    申请日：2014-12-10

    Applicant: 삼성전기주식회사

    Inventor： 이기주 ,  류종인 ,  김진수 ,  임재현

    IPC: G01R1/02 ,  G01R1/073

    CPC classification number: G01R1/02 ,  G01R1/025 ,  G01R1/073

    Abstract: 본발명의패키지모듈검사장치는검사핀이형성되는검사유닛; 패키지모듈의입출력단자가수용되는관통구멍이형성되는받침유닛 ; 및상기검사유닛과상기받침유닛간의거리를조정할수 있도록구성되는액추에이터유닛;을포함한다.

    Abstract translation: 本发明的目的是提供一种用于检查包装模块的装置，其可以提高包装模块的检查可靠性。 根据本发明，用于检查包装模块的装置包括：具有形成在其中的检查销的检查单元; 支撑单元，其具有容纳封装模块的输入/输出端子的穿透孔; 以及构造成调整检查单元和支撑单元之间的距离的致动器单元。

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