-
公开(公告)号：KR1020110133157A
公开(公告)日：2011-12-12
申请号：KR1020100052732
申请日：2010-06-04
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0269 , H05K3/225 , H05K2201/09781 , H05K2201/09936
Abstract: PURPOSE: A circuit board and a failure processing apparatus thereof are provided to improve detection accuracy of a bad cell by printing a short wiring on a major wiring of the bad cell using an ink-jet printer method. CONSTITUTION: A bad cell detection unit(210) detects a bad cell among a plurality of cells. The bad cell detection unit creates coordinate data of the bad cell. A bad cell display unit(230) shorts one and more bad cells at a wiring pattern of the bad cell by printing ink with an ink-jet printer method based on the coordinate data of the bad cell. The ink uses different ink with the wiring pattern of the bad cell. A bad cell determination unit(250) classifies a final bad cell about the bad cell in which ink is printed.
Abstract translation: 目的：提供一种电路板及其故障处理装置，以通过使用喷墨打印机方法在坏电池的主要布线上印刷短路布线来提高坏电池的检测精度。 构成：坏小区检测单元（210）检测多个小区中的坏小区。 坏小区检测单元创建坏小区的坐标数据。 不良单元显示单元（230）基于不良单元的坐标数据通过使用喷墨打印机方法通过打印墨水来将坏单元的布线图案中的一个或多个坏单元短路。 墨水使用不同的墨水与坏细胞的布线图案。 坏细胞确定单元（250）对关于印刷墨水的坏细胞的最终坏细胞进行分类。
-
公开(公告)号：KR1020100029431A
公开(公告)日：2010-03-17
申请号：KR1020080088221
申请日：2008-09-08
Applicant: 삼성전기주식회사
CPC classification number: H05K3/125 , H05K1/092 , H05K1/115 , H05K3/429 , H05K2203/013
Abstract: PURPOSE: A manufacturing method for a printed circuit board is provided to shorten manufacturing time and reduce manufacturing costs by forming a via hole together with a circuit patter through an ink-jet method. CONSTITUTION: A via hole(12) is punched in an insulating substrate(10). A first circuit pattern(14) is formed in one side of the insulating substrate by discharging a metallic ink(22) on the side of the insulating substrate through an ink-jet method. The metallic ink is spread on the inner wall of the via hole. A second circuit pattern is formed in the other side of the insulating substrate by discharging a metallic ink on the other side of the insulating substrate through the ink-jet method. The metallic ink is spread on the inner wall of the via hole.
Abstract translation: 目的：提供一种用于印刷电路板的制造方法，以通过喷墨方法与电路图案一起形成通孔来缩短制造时间并降低制造成本。 构成：在绝缘基板（10）上冲孔通孔（12）。 通过喷墨法在绝缘基板侧排出金属墨（22），在绝缘基板的一侧形成第一电路图案（14）。 金属墨水扩散在通孔的内壁上。 通过喷墨法在绝缘基板的另一侧排出金属墨，在绝缘基板的另一侧形成第二电路图案。 金属墨水扩散在通孔的内壁上。
-
公开(公告)号：KR1020090120334A
公开(公告)日：2009-11-24
申请号：KR1020080046314
申请日：2008-05-19
Applicant: 삼성전기주식회사
IPC: H05K3/10
CPC classification number: H05K3/1258 , H05K3/125 , H05K2201/09909 , H05K2203/013 , H05K2203/1173
Abstract: PURPOSE: A method for forming a printed circuit pattern, a method for forming a guide, and an ink for forming the guide are provided to improve an aspect ratio by using an ink for forming a guide having a slip property. CONSTITUTION: A method for forming a printed circuit pattern comprises the following steps: a step for forming a guide through an ink for forming the guide having a slip property(102); a step for performing an in-situ ultraviolet hardening about the formed guide; and a step for forming a printed circuit pattern through a metal ink inside the hardened guide(103).
Abstract translation: 目的：提供一种用于形成印刷电路图案的方法，用于形成引导件的方法和用于形成引导件的墨水，以通过使用用于形成具有滑动性质的引导件的墨水来改善纵横比。 构成：用于形成印刷电路图案的方法包括以下步骤：用于通过用于形成具有滑动特性（102）的引导件的油墨形成引导件的步骤; 对形成的引导件进行原位紫外线硬化的步骤; 以及通过硬化导向件（103）内部的金属墨形成印刷电路图案的步骤。
-
Patent Agency Ranking
公开(公告)号：KR1020090022605A
公开(公告)日：2009-03-04
申请号：KR1020070088118
申请日：2007-08-31
Applicant: 삼성전기주식회사
IPC: H05K3/10
CPC classification number: H05K3/125 , H05K1/092 , H05K3/1208 , H05K3/1283 , H05K2203/013 , H05K2203/095
Abstract: A manufacturing method of PCB capable of reducing width of circuit pattern is provided to prevent spread of an ink by discharging an ink droplet after maintaining a surface temperature of a substrate under a melting point of the ink. A manufacturing method of PCB capable of reducing width of circuit pattern comprises the following steps: a step for treating a surface of a substrate by using hydrophilic material in order to increase adhesive force with an ink(S11); a step for maintaining a surface temperature of the substrate under a melting point of a conductive ink(S12); a step for forming a pattern on the surface of the substrate(S13); a step for performing a water repellent treatment on the surface of the substrate(S14); and a step for sintering the pattern in high temperature(S15).
Abstract translation: 提供了能够减小电路图案宽度的PCB的制造方法，以便在将基板的表面温度保持在墨水的熔点之下时，通过将墨滴排出来防止墨水的扩散。 能够减小电路图案宽度的PCB的制造方法包括以下步骤：通过使用亲水材料处理基板的表面以增加与墨的粘合力的步骤（S11）; 维持基板在导电性油墨的熔点下的表面温度的步骤（S12）。 在所述基板的表面上形成图案的工序（S13）; 在基材表面进行防水处理的工序（S14）。 以及在高温下烧结图案的步骤（S15）。
-
公开(公告)号：KR100866575B1
公开(公告)日：2008-11-03
申请号：KR1020060100948
申请日：2006-10-17
Applicant: 삼성전기주식회사
IPC: H05K3/22
Abstract: 본 발명은 실리콘 화합물을 이용한 인쇄회로기판의 커버레이 성형방법에 관한 것으로, 더욱 상세하게는 본 발명은 실리콘 화합물을 포함하는 용액을 준비하는 단계; 상기 용액으로 인쇄회로기판의 표면을 코팅하는 단계; 및 상기 코팅된 인쇄회로기판을 열처리하는 단계;를 포함하는 인쇄회로기판의 커버레이 형성방법에 관한 것이다. 본 발명에 의하면 실리콘 화합물을 커버레이로 사용하여 원가를 절감할 수 있고, 공정이 간단한 롤코팅 방식 또는 스크린 프린팅 방법에 의하여 커버레이 형성의 공정시간을 단축하고 불량률을 낮출 수 있다.
실리콘 화합물, 커버레이, 인쇄회로기판, 표면코팅, 롤코팅, 스크린 프린팅, 열처리-
公开(公告)号：KR100856100B1
公开(公告)日：2008-09-03
申请号：KR1020070041527
申请日：2007-04-27
Applicant: 삼성전기주식회사
CPC classification number: H05K3/002 , B82Y30/00 , H05K1/097 , H05K3/125 , H05K2201/0257 , H05K2203/013
Abstract: A surface processing method of a substrate and a method for forming a wire distribution pattern using the same are provided to form a micro pattern of a high quality by improving an adhesive strength of a wiring. A surface processing method of a substrate includes the steps of: preparing a substrate; processing a surface of the substrate with an KOH water solution; processing a surface of the substrate with an AgNO3 water solution; forming an Ag thin film layer by performing a heat-processing for the substrate; and coating the surface of the substrate with a coating solution having a fluoroacrylate compound. The substrate is selected from a group of a polyimide substrate, a polyester substrate, and an epoxy substrate. In the KOH water solution step, the substrate is digested under the KOH water solution for 30 minutes to 120 minutes.
Abstract translation: 提供基板的表面处理方法和使用其形成布线图案的方法，以通过提高布线的粘合强度来形成高质量的微图形。 衬底的表面处理方法包括以下步骤：制备衬底; 用KOH水溶液处理基材的表面; 用AgNO 3水溶液处理基材的表面; 通过对基板进行热处理而形成Ag薄膜层; 并用具有氟代丙烯酸酯化合物的涂布溶液涂覆基材的表面。 基板选自聚酰亚胺基板，聚酯基板和环氧树脂基板。 在KOH水溶液步骤中，将基材在KOH水溶液下消化30分钟至120分钟。
-
公开(公告)号：KR100550858B1
公开(公告)日：2006-02-10
申请号：KR1020030067413
申请日：2003-09-29
Applicant: 삼성전기주식회사
IPC: H03H3/02
Abstract: 본 발명은 동일 웨이퍼상에서 제조되는 FBAR 소자의 주파수 특성을 개별적으로 튜닝할 수 있는 FBAR 소자의 제조 방법에 관한 것으로서, 기판웨이퍼상에 제1전극, 압전층, 제2전극을 순차적으로 형성시, 상부에 위치하는 제2전극의 두께를 목표두께보다 두껍게 형성하고, 상기 기판웨이퍼를 다수의 FBAR 소자별로 절단한 후, 각 FBAR 소자의 주파수 특성을 검사하여 소자별 튜닝주파수를 측정하여, 동일 튜닝주파수별로 FBAR 소자를 분류한 후, 동일 그룹별로 해당하는 FBAR 소자를 대응하는 지그에 각각 그룹별로 탑재하여 튜닝주파수에 대응하는 시간동안 건식식각하여, 제2전극의 두께조절을 통해 공진주파수를 조정한다.
FBAR, 공진주파수, 주파수 튜닝, 건식식각, 상부전극, 전극두께-
公开(公告)号：KR1020050031192A
公开(公告)日：2005-04-06
申请号：KR1020030067413
申请日：2003-09-29
Applicant: 삼성전기주식회사
IPC: H03H3/02
CPC classification number: H03H3/02 , H03H3/04 , H03H9/173 , H03H2003/021
Abstract: A method for manufacturing the film bulk acoustic resonator(FBAR) is provided to tune the frequency by changing the overall thickness of the resonance region with controlling the second electrode thickness. A method for manufacturing the film bulk acoustic resonator(FBAR) includes the steps of: progressing(201) the film formation process to deposit the top electrode with the thickness which is thicker than the error range; fabricating(202) out the FBAR wafer; performing(203) the dicing process; setting(204) the dry etching process values such as a power, a pressure or an amount of gas for tuning; measuring(205) the tuning frequency for the diced FBAR devices; discriminating(206) the FBAR devices according to each tuning frequency; and performing(207) the dry etching by a converted time corresponding to the discriminated devices.
Abstract translation: 提供了一种用于制造薄膜体声波谐振器（FBAR）的方法，以通过控制第二电极厚度来改变共振区域的总体厚度来调谐频率。 制造薄膜体声波谐振器（FBAR）的方法包括以下步骤：进行（201）成膜工艺以沉积具有比误差范围厚的厚度的顶部电极; 制造（202）出FBAR晶圆; 执行（203）切割过程; 设置（204）干蚀刻处理值，例如用于调谐的功率，压力或气体量; 测量（205）切割FBAR器件的调谐频率; 根据每个调谐频率识别（206）FBAR设备; 并且对与所识别的装置相对应的转换时间执行（207）干蚀刻。
-
-
-
-
-
-
-
Search Results
38
records
(took 0.024 seconds)
