Abstract:
The present invention relates to an electrode for a supercapacitor and a manufacturing method thereof. A metal oxide layer which is electrodeposited with a metal oxide solution which includes metal oxide and auxiliary electrolyte is formed in a conductive electrode substrate and at least one surface of a conductive electrode, thereby reducing process steps compared to an existing process, improving the non-capacitance of the electrode, and reducing the electrodeposition time of the metal oxide as well.
Abstract:
The present invention relates to a method for manufacturing a metal oxide/graphite electrode for a super capacitor, including a step for electrochemically electrodepositing a metal oxide layer on graphite. According to the present invention, the manufacturing method has a simple manufacturing process and reduces process costs at the same time because the method manufactures a metal oxide/graphite composite electrode and uses the manufactured result as an electrode by electrodepositing a metal oxide directly on graphite unlike an electrode manufacturing method using an existing conductive agent and binder. Moreover, the method can be used in various fields including a super capacitor and a secondary battery by enabling the manufacture of an electrode having more improved function by variously adjusting the kind, size, and thickness of the metal oxide electrodeposited on the graphite electrode. [Reference numerals] (AA) Working electrode;(BB) Reference electrode;(CC) Macroelectrode
Abstract:
서지흡수장치의제조방법이개시된다. 서지흡수장치를제조하기위해, 세라믹튜브의내부관통공간이노출되는단부면에도금층을형성한후 브레이징링을이용하여도금층에밀봉전극을부착할수 있다. 이때, 도금층은세라믹튜브의단부면을식각한후 무전해도금촉매층을형성하고, 이어서세라믹튜브의단부면에무전해도금의방법으로금속층을형성한후 이를열처리함으로써형성될수 있다.
Abstract:
PURPOSE: A method for forming a contact hole in a semiconductor device is provided to control deposition time and easily control the diameter of a contact hole. CONSTITUTION: An amorphous carbon layer mask pattern is formed on a semiconductor substrate(S1). A first protection film is deposited on the wall and the upper part of the mask by using plasma including carbon fluoride(S2). An insulating layer is etched using the plasma to form a contact hole(S3). A second protection film is deposited on the first protection film and the wall of the contact hole(S4) by using the plasma. [Reference numerals] (S1) Forming an ACL mask; (S2,S4) Depositing a plasma protective film; (S3) Etching plasma