Abstract:
PURPOSE: A composition for an anisotropic conductive film is provided to impart phase stability between materials by comprising a stearic acid-based compound and to improve process stability such as coating stability, appearance, resistance, and reliability. CONSTITUTION: A composition for an anisotropic conductive film comprises 30~60 weight% of a thermoplastic polymer binder resin, 20~55 weight% of a radical polymerizable material, 1~10 weight% radical initiator, 0.5~20 weight% of stearic acid-based compound and 1~10 weight% of conductive particles. The stearic acid-based is included in the amount of 0.5~20 weight% of the whole composition.
Abstract:
PURPOSE: An anisotropic conductive film composition is provided to obtain excellent mobility and initial adhesive force on various substrates, to prevent a peel-off phenomenon in high temperature/high humidity and a thermal shock condition, and to improve the reliability of various display devices. CONSTITUTION: An anisotropic conductive film comprises: 15-40 parts by weight of a thermoplastic resin binder; 1-10 parts by weight of a radical initiator; 1-10 parts by weight of a silane coupling agent; and 1-20 parts by weight of a conductive particle based on 100.0 parts by weight of a radial curable material. A (poly)silsesquioxane derivative of a chemical formula 1 has obtain by giving reactivity to polyhedral oligomeric silsesquioxane or (poly)silsesquioxane. The (poly)silsesquioxane derivative is used with an amount of 0.5-30 parts by weight based on 100.0 parts by weight of the radial curable material.
Abstract:
PURPOSE: An anisotropic conductive film composition is provided to obtain excellent mobility and initial adhesive force to various substrates, to maintain an initial exterior by preventing the composition from being lifted in high temperature/high humidity and a thermal impact condition, and to have high reliability to other contact resistances. CONSTITUTION: An anisotropic conductive film comprises: 100-300 parts by weight of a radical curable material; 5-15 parts by weight of a radical initiator; 10-40 parts by weight of a conductive particles; and 3-8 parts by weight of a coupling agent based on 100.0 parts by weight of a thermoplastic polymer binder resin. The thermoplastic polymer binder resin includes 5-75 parts by weight of a polyester-polysiloxane copolymer which is marked as a chemical formula 1 based on 100.0 parts by weight of a binder resin. The chemical formula 1 is (A)_aB. In the chemical formula 1, a is integer more than 1 and (A) shows a polyester unit having a structure of H-[O-(CR^1_2)n-CO-]m-X-R^2-.
Abstract:
A 2-step thermosetting anisotropic conductive adhesive composition is provided to maintain stability at a wide temperature, low contact resistance and excellent adhesive force by using two kinds of thermosetting radical initiators with different 10 hours half life. A 2-step thermosetting anisotropic conductive adhesive composition comprises (A) thermosetting resin 5-70 parts by weight, (B) (meth)acrylate oligomer 1-50 parts by weight, (C) (meth)acrylate monomer 1-50 parts by weight, (D) thermosetting radical initiators with different 10 hours half life 0.1-15 parts by weight, (E) conductive particles 0.01-20 parts by weight, and (G) solvent 5-70 parts by weight. The thermosetting radical initiators comprise a low-temperature thermosetting radical initiator with 10 hours half life lower than a drying condition within 15 °C range and a high-temperature with 10 hours half life higher than the drying condition.
Abstract:
An anisotropic conductive film including hydrophobic nano-silica particles with high rheology properties and hydrophobicity is provided to show excellent initial adhesive force and low contact resistance due to a hydrophobic surface. An anisotropic conductive film comprises: the 1-50wt% of polymer resin; the 1-50wt% of one or more resins selected from the group consisting of novolak type, glycidyl type, aliphatic type and fluorene-based epoxy resin; the 1-80wt% of one or more resins selected from the group consisting of bisphenol F type epoxy and phenoxy resin; the 1-20wt% of hydrophobic nano silica filler; the 0.1-15wt% of hardener for epoxy resin; the 0.01-20wt% of conductive particles; and the 0.01-5wt% of one or more additives selected from the group consisting of polymerization inhibitor, antioxidant, thermal stabilizer, curing accelerator and coupling agent.
Abstract:
An anisotropic conductive film composition is provided to ensure thermocompression at a low temperature and reduce a curing time of an anisotropic conductive film by improving reactivity. An anisotropic conductive film composition comprises 0.1-15wt% of cationic thermopolymerization stabilizer, 0.1-15wt% of cationic thermopolymerization initiator, 5-90wt% of cationic polymerizable epoxy compound, 5-90wt% of thermoplastic resin, and 0.01-20wt% of conductive particles. The cationic thermopolymerization stabilizers are one or more stabilizers among organic phosphorus stabilizer and nitroxyl-based stabilizer. The cationic thermopolymerization initiator indicates one or more initiators selected from the group consisting of triarylsulfonium hexafluoroantimonate salts, triarylsulfonium hexafluoroantimonate, (tolycumyl) iodonium tetrakis(pentafluorophenyl)borate, bis(dodecylphenyl)iodonium hexafluoroantimonate, (iodonium,(4,-methylphenyl)(4-(2-methylpropyl)phenyl),hexafluorophophate), octyl diphenyliodonium hexafluoroantimonate, diaryliodonium salts, benzylsulfonium salts, etc.
Abstract:
A composition for an anisotropic conductive film, and an anisotropic conductive film prepared from the composition are provided to improve initial adhesive strength, to reduce contact resistance and to enhance reliance even under the condition of high temperature and high humidity. A composition for an anisotropic conductive film comprises 5-50 wt% of at least one kind of resin selected from polyurethane and its modified resin; 5-50 wt% of at least one kind of resin selected from an indene resin and its copolymer; 1-50 wt% of a (meth)acrylate oligomer or polymer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Preferably the polyurethane and its modified resin have an average molecular weight (Mw) of about 10,000-1,000,000.
Abstract:
A composition for an anisotropic conductive film is provided to inhibit flow of polymer particles during hot pressing, to allow maintenance of a low electric contact resistance even under severe conditions including high temperature and high humidity, and to realize excellent reliability. A composition for an anisotropic conductive film comprises: (i) 5-50 wt% of a thermoplastic resin; (ii) 0.1-30 wt% of polymer microparticles; (iii) 1-50 wt% of a (met)acrylate oligomer; (iv) 0.1-15 wt% of a radical initiator; and (v) 0.1-15 wt% of a radical initiator; and (vi) 0.01-20 wt% of conductive particles, wherein the polymer microparticles have a size equal to or smaller than the conductive particles and a softening point of 140-180 deg.C. The polymer microparticle is at least one selected from the group consisting of tetrafluoroethylene-perfluoro(alkylvinylether) copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-hexafluoropropylene-perfluoro(alkylvinylether) copolymer, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, chlorotrifluoroethylene-ethylene copolymer.
Abstract:
An anisotropic conductive film composition, and an anisotropic conductive film formed from the composition are provided to improve initial adhesive strength, to increase the reliance even under high temperature and high humidity and under thermal impact, to enhance productivity and to lower contact resistance. An anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 1-50 wt% of an acrylic copolymer resin having a glass transition temperature of 5-120 deg.C; 1-30 wt% of a (meth)acrylate oligomer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Also an anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 1-50 wt% of an acrylic copolymer resin having a glass transition temperature of 5-120 deg.C; 1-80 wt% of at least one of epoxy monomer, oligomer or resin selected from the group consisting of bisphenolic, novolac, glycidyl, aliphatic and alicyclic epoxy compounds; 0.1-15 wt% of a thermal curing agent for epoxy; and 0.01-20 wt% of a conductive particle.
Abstract:
An anisotropic conductive film composition, and an anisotropic conductive film formed from the composition are provided to improve initial adhesive strength, to reduce contact resistance and to prevent the generation of short between circuits, thereby enhancing productivity. An anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-50 wt% of a (meth)acrylate oligomer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Also an anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-80 wt% of at least one of epoxy monomer, oligomer or resin selected from the group consisting of bisphenolic, novolac, glycidyl, aliphatic and alicyclic epoxy compounds; 0.1-15 wt% of a thermal curing agent for epoxy; and 0.01-20 wt% of a conductive particle.