公开(公告)号：WO2004051706A3

公开(公告)日：2004-09-02

申请号：PCT/US0338363

申请日：2003-12-02

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  LAMB JAMES E ,  FLAIM TONY D

IPC: H01L21/312 ,  B05D3/02 ,  B32B17/10 ,  C08F20/26 ,  C08F20/32 ,  C08F220/28 ,  C08G59/32 ,  C08J7/04 ,  C09D163/00 ,  G03F7/09 ,  G03F7/11 ,  H01L20060101 ,  H01L21/027 ,  H01L21/311

CPC classification number: G03F7/091 ,  C08F220/28 ,  C08G59/3218 ,  C08J7/047 ,  C08J2425/00 ,  C08J2433/00 ,  C08J2471/00 ,  C09D163/00 ,  H01L21/0276 ,  H01L21/31144 ,  C08L2666/16

Abstract: Anti-reflective or fill composition which inhibits or blocks via or photoresist poisoning, a method of coating a substrate and curing it, and a cured protective layer derived therefrom comprises a polymer prepared from a first set of recurring monomers containing a ring member reacted with a light attenuating compound, and a second set of recurring monomers having an unreacted ring member.

Abstract translation: 抑制或阻断通路或光致抗蚀剂中毒的抗反射或填充组合物，涂覆基底并固化的方法以及由其衍生的固化保护层包括由第一组含有环成员的重复单体制备的聚合物， 光减弱化合物和具有未反应的环成员的第二组重复单体。

公开(公告)号：EP2471090A4

公开(公告)日：2014-09-24

申请号：EP10817743

申请日：2010-09-15

Applicant: BREWER SCIENCE INC

Inventor： YESS KIMBERLY A ,  DAILY MADISON M JR ,  FLAIM TONY D

IPC: H01L21/48 ,  C08J5/18 ,  C09D125/12 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

公开(公告)号：WO2010051212A2

公开(公告)日：2010-05-06

申请号：PCT/US2009061633

申请日：2009-10-22

Applicant: BREWER SCIENCE INC ,  HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  H01L21/304

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了使用这些组合物作为粘合组合物的新组合物和方法。 所述组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或衬底上，以辅助在后续处理和处理期间保护活性晶片及其活性部位。 该组合物形成化学和耐热的粘合层，但也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

公开(公告)号：WO2009097436A3

公开(公告)日：2009-10-15

申请号：PCT/US2009032446

申请日：2009-01-29

Applicant: BREWER SCIENCE INC ,  SUN SAM X ,  XU HAO ,  FLAIM TONY D

Inventor： SUN SAM X ,  XU HAO ,  FLAIM TONY D

IPC: G03F7/26 ,  H01L21/027

CPC classification number: H01L21/0337 ,  G03F7/0752 ,  G03F7/094 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/0332 ,  H01L21/0338 ,  H01L21/312

Abstract: This invention provides methods of creating via or trench structures on a developer- soluble hardmask layer using a multiple exposure-development process. The hardmask layer is patterned while the imaging layer is developed. After the imaging layer is stripped using organic solvents, the same hardmask can be further patterned using subsequent exposure-development processes. Eventually, the pattern can be transferred to the substrate using an etching process.

Abstract translation: 本发明提供了使用多重曝光显影工艺在显影剂可溶性硬掩模层上产生通孔或沟槽结构的方法。 当成像层被显影时，硬掩模层被图案化。 在使用有机溶剂剥离成像层之后，可以使用随后的曝光显影工艺来进一步图案化相同的硬掩模。 最终，可以使用蚀刻工艺将图案转移到衬底。

公开(公告)号：WO2009094558A3

公开(公告)日：2009-09-24

申请号：PCT/US2009031862

申请日：2009-01-23

Applicant: BREWER SCIENCE INC ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

Inventor： FLAIM TONY D ,  MCCUTCHEON JEREMY

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T428/31678 ,  H01L2924/00

Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

Abstract translation: 提供了由这些方法形成的新的临时粘合方法和制品。 该方法包括仅在其外周界将器件晶片接合到载体晶片或衬底，以便在后续处理和处理期间帮助保护器件晶片及其器件位置。 通过该方法形成的边缘结合在化学上和耐热性上，但也可以被软化，溶解或机械破碎，以便在制造过程中的适当阶段，以非常低的力和在室温或接近室温容易地分离晶片 。

公开(公告)号：WO2004065428A2

公开(公告)日：2004-08-05

申请号：PCT/US2004001480

申请日：2004-01-16

Applicant: BREWER SCIENCE INC ,  FLAIM TONY D ,  WANG YUBAO ,  MERCADO RAMIL-MARCELO L

Inventor： FLAIM TONY D ,  WANG YUBAO ,  MERCADO RAMIL-MARCELO L

IPC: B05D3/02 ,  C04B35/00 ,  C08F20060101 ,  C08F2/00 ,  C08G79/00 ,  C08K3/00 ,  C08K3/10 ,  C08K5/00 ,  C08K5/56 ,  C08L85/00 ,  C08F

CPC classification number: C08G79/00 ,  C08K5/0091 ,  C08K5/56 ,  C08L85/00 ,  Y10T428/25 ,  C08L2666/02

Abstract: Novel compositions and methods of using those compositions to form metal oxide films or coatings are provided. The compositions comprise an organometallic oligomer and an organic polymer dispersed or dissolved in a solvent system. The compositions have long shelf lives and can be prepared by easy and reliable preparation procedures. The compositions can be cured to cause conversion of the compositions into films of metal oxide interdispersed with organic polymer or oligomer. The cured films have high refractive indices, high optical clarities, and good mechanical stabilities at film thickness of greater than about 1 µm.

Abstract translation: 提供了使用这些组合物形成金属氧化物膜或涂层的新型组合物和方法。 组合物包含分散或溶解在溶剂体系中的有机金属低聚物和有机聚合物。 组合物具有长的保质期，并且可以通过简单和可靠的制备方法制备。 组合物可以固化以使组合物转化成与有机聚合物或低聚物分散的金属氧化物的膜。 固化膜的折射率高，光学透明度高，膜厚大于约1μm时的机械稳定性好。

公开(公告)号：WO2013006865A2

公开(公告)日：2013-01-10

申请号：PCT/US2012045980

申请日：2012-07-09

Applicant: BREWER SCIENCE INC ,  MCCUTCHEON JEREMY ,  FLAIM TONY D ,  BAILEY SUSAN

Inventor： MCCUTCHEON JEREMY ,  FLAIM TONY D ,  BAILEY SUSAN

CPC classification number: B32B38/10 ,  B32B7/06 ,  B32B7/12 ,  B32B7/14 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T428/24331 ,  Y10T428/24851 ,  Y10T428/30 ,  Y10T428/31598 ,  Y10T428/31667

Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Abstract translation: 提供了从这些方法形成的新的临时粘合方法和制品。 在一个实施方案中，所述方法包括用刚性支撑层在生长衬底上涂覆器件或其它超薄层，然后将该堆叠结合到载体衬底。 然后可以除去生长衬底，并将超薄层安装在最终的载体上。 在另一个实施例中，本发明提供了在处理期间处理装置层的方法，该方法必须在脆性层的两侧出现而不会损坏脆性层。 这是通过连续使用两个载体来实现的，一个在器件层的每一侧上，用不同的粘合组合物键合，用于选择性脱粘。

公开(公告)号：WO2012057893A3

公开(公告)日：2012-07-12

申请号：PCT/US2011046751

申请日：2011-08-05

Applicant: BREWER SCIENCE INC ,  PULIGADDA RAMA ,  ZHONG XING-FU ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

Inventor： PULIGADDA RAMA ,  ZHONG XING-FU ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

IPC: H01L21/20

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract translation: 提供了临时连接半导体衬底的多个键合层方案。 在本发明的键合方案中，至少一个层直接与半导体衬底接触，并且该方案内的至少两个层彼此直接接触。 当多层结构内的不同层执行特定功能时，本发明提供了多种处理选项。 更重要的是，它将通过提供更高的热稳定性，与苛刻的背面处理步骤的更大兼容性，通过封装在晶片的正面上保护凸块，在剥离步骤中的更低的应力以及更少的数量来提高薄晶片处理解决方案的性能 正面缺陷。

公开(公告)号：WO2006137884A3

公开(公告)日：2007-06-28

申请号：PCT/US2005034270

申请日：2005-09-26

Applicant: BREWER SCIENCE INC ,  MERCADO RAMIL-MARCELO L ,  MORFORD ROBERT V ,  PLANJE CURTIS ,  PEREZ WILLIE ,  FLAIM TONY D ,  BASS TAYLOR R

Inventor： MERCADO RAMIL-MARCELO L ,  MORFORD ROBERT V ,  PLANJE CURTIS ,  PEREZ WILLIE ,  FLAIM TONY D ,  BASS TAYLOR R

IPC: G02B1/00 ,  G02B1/10

CPC classification number: C08G59/245 ,  C08F283/10 ,  C08G59/226 ,  C08G59/38 ,  C08G65/18 ,  C08L63/00 ,  C08L63/04 ,  H01L51/5262 ,  Y10T428/31511

Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions preferably comprise both a reactive solvent and a high refractive index compound. Preferred reactive solvents include aromatic resins that are functionalized with one or more reactive groups (e.g., epoxides, vinyl ethers, oxetane), while preferred high refractive index compounds include aromatic epoxides, vinyl ethers, oxetanes, phenols, and thiols. An acid or crosslinking catalyst is preferably also included. The inventive compositions are stable under ambient conditions and can be applied to a substrate to form a layer and cured via light and/or heat application. The cured layers have high refractive indices and light transmissions.

Abstract translation: 提供了使用这些组合物形成高折射率涂层的新型组合物和方法。 组合物优选包含反应性溶剂和高折射率化合物。 优选的反应性溶剂包括用一个或多个反应性基团（例如环氧化物，乙烯基醚，氧杂环丁烷）官能化的芳族树脂，而优选的高折射率化合物包括芳族环氧化物，乙烯基醚，氧杂环丁烷，酚和硫醇。 优选还包括酸或交联催化剂。 本发明的组合物在环境条件下是稳定的，并且可以施加到基底以形成层并通过光和/或热应用固化。 固化层具有高折射率和光透射。

公开(公告)号：WO2005072489A3

公开(公告)日：2006-07-20

申请号：PCT/US2005000786

申请日：2005-01-07

Applicant: BREWER SCIENCE INC ,  LI CHENGHONG ,  RUBEN KIMBERLY A ,  FLAIM TONY D

Inventor： LI CHENGHONG ,  RUBEN KIMBERLY A ,  FLAIM TONY D

IPC: B05D1/36 ,  B05D1/38 ,  B32B9/04 ,  B32B15/04 ,  B32B15/08 ,  B32B17/10 ,  C09D125/12 ,  H01L21/308 ,  H01L21/311

CPC classification number: B81C1/00539 ,  C03C15/00 ,  C03C2218/355 ,  C09D125/12 ,  H01L21/3081 ,  H01L21/31144 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

Abstract translation: 提供了在制造半导体和MEMS器件期间用于湿蚀刻工艺的新的保护涂层。 这些层包括底漆层，第一保护层和任选的第二保护层。 底漆层优选在溶剂体系中包含有机硅烷化合物。 第一保护层包括由苯乙烯，丙烯腈和任选的其它加成聚合单体如（甲基）丙烯酸酯单体，乙烯基苄基氯和马来酸或富马酸的二酯制备的热塑性共聚物。 第二保护层包括高度卤化的聚合物，例如氯化聚合物，其在加热时可以或不会交联。