公开(公告)号：JPH11312640A

公开(公告)日：1999-11-09

申请号：JP1510299

申请日：1999-01-25

Applicant: CANON KK

Inventor： HARA SHINICHI ,  TANAKA YUTAKA ,  TERAJIMA SHIGERU ,  MATSUI SHIN ,  HASEGAWA TAKAYUKI

IPC: H01L21/027 ,  G03F7/20 ,  G05D16/00 ,  G05D16/20

Abstract: PROBLEM TO BE SOLVED: To provide a processor, which generates intended air current in the atmospheric gas in a pressure reduced chamber, reduces local temperature variation and is able to maintain a stabilized atmospheric state. SOLUTION: A vacuum line 11, which controls the atmospheric pressure by evacuating the atmospheric gas in a pressure reduced chamber 1, containing a light exposing section by a vacuum pump 20, a circulating supply line 12, which returns the gas evacuated by the vacuum pump 20, and a branching supply line 12A which branches the gas from the circulating supply line 20 and returns the gas, are provided. By blowing out the gas to be returned into the chamber through blowing holes 15 and 17, the down-flow air current along the surrounding part of the processing part and the local blowing are generated. Heat and the like generated by the heating source in the chamber 1 are adequately discharged. The fluctuations in the gas generated by the local temperature difference is avoided and the stabilized atmospheric state is maintained.

公开(公告)号：JPH11297613A

公开(公告)日：1999-10-29

申请号：JP11411998

申请日：1998-04-09

Applicant: CANON KK

Inventor： MATSUI SHIN ,  OSANAI EIJI ,  OISHI SHINJI ,  KUBO TADAYUKI

IPC: B23B47/26 ,  B23Q1/00 ,  B23Q1/62 ,  B23Q1/72 ,  B23Q11/00 ,  G03F7/20 ,  G05D3/00 ,  H01L21/027 ,  H01L21/68 ,  B23Q1/25

Abstract: PROBLEM TO BE SOLVED: To improve dynamic characteristics a vertical stage. SOLUTION: A Y-stage 20 retaining an X-stage 30 holding a wafer or the like is driven in the Y axis direction (vertical direction) by a Y linear motor 40. The Y-stage 20 is linked with a counter mass 61 for self-weight compensation by using a belt 62. The Y-stage 20 is coupled with the belt 62 via an actuator 70 such as a bellofram and an air cylinder. On the basis of position information of the X-stage 30, the actuator 70 is controlled. Thereby angular moment is corrected, and a load applied to a Y-guide 11 is reduced. Vibration propagating from the belt 62 to the Y-stage 20 is eliminated by using vibration removing property of the actuator 70.

公开(公告)号：JPH09275063A

公开(公告)日：1997-10-21

申请号：JP10480696

申请日：1996-04-03

Applicant: CANON KK

Inventor： MATSUI SHIN ,  CHIBA YUJI ,  EBINUMA RYUICHI

IPC: G03F7/20 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide an exposure device which shows effect similar to a former device on the fluctuation of posture, which is inexpensive in terms of device cost and in terms of chip cost and in which run out errors do not occur even if an optical axis side is shifted. SOLUTION: In an X-ray aligner, a wafer 126 is exposed by radiation light 108 through a mask 123 for printing a pattern formed on a mask 123 on the wafer 126 to which photosensitive material is applied. A light emitting part 100 for emitting radiation light 108 and a stepper main body 109 having a wafer stage part 142 for holding and transporting the wafer 126 are supported by different supporting systems. A correction means 147 for supporting an alignment measuring part 139 which positions and measures the wafer 126 and the mask 123 by the supporting system different from the stepper main body 109 and correcting the posture of the alignment measurement part 139 for maintaining the posture of the alignment measuring part 139 as against the optical axis of exposure light 108 is provided.

公开(公告)号：JPH0786118A

公开(公告)日：1995-03-31

申请号：JP18666493

申请日：1993-06-30

Applicant: CANON KK

Inventor： MATSUI SHIN

IPC: G03F7/20 ,  G03F9/00 ,  G12B5/00 ,  G21K1/06 ,  H01L21/027 ,  H01L21/677 ,  H01L21/68

Abstract: PURPOSE:To automatically collect a wafer fallen down from a wafer chuck at the outside of an exposing chamber. CONSTITUTION:A wafer Wa held by a wafer chuck 14 is stepped in X and Y directions by means of an XY rough motion stage 12. A trough member 31 for receiving the wafer Wa falling down from the wafer chuck 14 is disposed below the moving path of the wafer chuck 14. The wafer fallen down to the trough member 31 is transferred to the outside of an exposing chamber 10 by means of a collection hand 32.

公开(公告)号：JPH0410452A

公开(公告)日：1992-01-14

申请号：JP10878490

申请日：1990-04-26

Applicant: CANON KK

Inventor： MATSUI SHIN

IPC: H01L21/677 ,  H01L21/68

Abstract: PURPOSE:To give sufficient suction force to a substrate holding means by installing a first suction chuck and a second suction chuck having a suction surface on the same plane as the first suction chuck and being movable in the normal direction of the surface of a substrate at the position of delivery to the substrate holding means and delivering the substrate between the second suction chuck and a carrying band. CONSTITUTION:When a wafer 11 is delivered from a substrate holding means to a carrying hand 12, vacuum suction by a first suction chuck 17 is released in the first suction chuck 17 and a second suction chuck 20 sucking the rear of the wafer 11 under a vacuum, and a Z driving shaft 19 is forward moved up to the position of noninterference by an actuator. The carrying hand 12 is advanced up to the location of delivery, and the rear of the wafer 11 is abutted against the suction surface of the carrying hand 12. Even when the surface of the wafer 11 is inclined to the suction surface of the carrying hand 12 at that time, the inclination is sucked by four leaf springs 221-224 supporting the second suction chuck 20, thus pushing the rear of the wafer 11 against the whole suction surface of the carrying hand 12.