公开(公告)号：JPH07130647A

公开(公告)日：1995-05-19

申请号：JP30087993

申请日：1993-11-05

Applicant: CANON KK

Inventor： HARA SHINICHI ,  MIYAJI GOJI ,  KORENAGA NOBUSHIGE ,  SAKAMOTO EIJI

IPC: G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To suppress generation of positional deviation of exposure absorber by making minute deformation due to thermal expansion of a mask holding base holding a mask. CONSTITUTION:This mask holding device is provided with a mask chuck for vacuum suction of a mask 20, a base 6 slight-movably supporting the mask chuck 5 through a plurality of leaf springs 7 and a piezoelectric element 8 for minute-moving the mask chuck 5 to a base 6. The mask chuck 5 consists of low thermal expansion glass; further, the leaf springs 7 are screwed by the screws 15. Accordingly, deformation due to thermal expansion of the mask chuck 5 becomes extremely minute, and as the result, positional deviation of an exposure absorber 1 of the mask 20 held by the mask chuck 5 can be also suppressed.

公开(公告)号：JPH0668673B2

公开(公告)日：1994-08-31

申请号：JP4127386

申请日：1986-02-26

Applicant: CANON KK

Inventor： INOE JUJI ,  SAKAMOTO EIJI ,  OSADA YOSHUKI

IPC: G02F1/136 ,  G02F1/133 ,  G02F1/1368 ,  G09G3/36

公开(公告)号：JPH0276212A

公开(公告)日：1990-03-15

申请号：JP22738788

申请日：1988-09-13

Applicant: CANON KK

Inventor： KOBAYASHI MAKIKO ,  OZAWA KUNITAKA ,  UDA KOJI ,  SAKAMOTO EIJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI

IPC: G03F1/76 ,  G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To improve accuracy of pattern printing to a wafer by providing exposure downtime in the middle of exposure so that a temperature of a mask or a wafer does not exceed a possible temperature range of exposure which is regulated based on a printing line width, etc., and by carrying out exposure again after heat dissipation. CONSTITUTION:A mask 1 and a wafer 2 are aligned, and exposure of one shot is made and a timer is started simultaneously. Temperature sensors 5, 6 are monitored which are provided on a mask stage 3 and a wafer stage 4, and exposure is continued. If a temperature is not in a good temperature range, a shutter 8 is shut to interrupt exposure and the timer is stopped. Heat which is stored in the mask 1 and the wafer 2 during exposure downtime is emitted. When a temperature lowers to some extent, exposure is started again. These procedures are repeated, and when accumulating totals of exposure time attains a time necessary for one shot, one shot exposure is finished. According to this constitution, long time X-ray exposure is possible while a temperature of a mask and a wafer are kept in an optimum temperature range, thus realizing fine and precision printing which enhances characteristics of short wavelength of X-ray.

公开(公告)号：JPS6263918A

公开(公告)日：1987-03-20

申请号：JP20399485

申请日：1985-09-14

Applicant: CANON KK

Inventor： SEKIMURA NOBUYUKI ,  KAMIO MASARU ,  SAKAMOTO EIJI ,  MOTOI YASUKO

IPC: G02B5/20 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1343

Abstract: PURPOSE:To form a liquid crystal element having color picture elements of high transmittance by providing a protective layer having a specific coefft. of linear expansion between a color filter layer and transparent electrodes. CONSTITUTION:The color filter layers 14 which are respectively one picture element of a BGR color filter are provided on a substrate 11a and the transparent electrode 12a is provided via the protective layer 15 on said color filter layer 14. The protective layer 15 is exemplifed by a material selected from materials having the coefft. alpha of linear expansion most adequately 0.05-5 times the coefft. of linear expansion of the transparent electrode 12a. More specifically, SiO2 (alpha; 6X10 / deg.C) is suitable.

公开(公告)号：JPS61143789A

公开(公告)日：1986-07-01

申请号：JP26438784

申请日：1984-12-17

Applicant: CANON KK

Inventor： SEKIMURA NOBUYUKI ,  SAKAMOTO EIJI ,  MOTOI YASUKO ,  KAMIO MASARU

IPC: G02F1/1335 ,  G02F1/133 ,  G09F9/35

公开(公告)号：JPS6186782A

公开(公告)日：1986-05-02

申请号：JP20798984

申请日：1984-10-05

Applicant: Canon Kk

Inventor： SEKIMURA NOBUYUKI ,  KAMIO MASARU ,  SAKAMOTO EIJI ,  MOTOI YASUKO

IPC: G09F9/35 ,  G02F1/133 ,  G02F1/1333

公开(公告)号：JP2000299370A

公开(公告)日：2000-10-24

申请号：JP10925599

申请日：1999-04-16

Applicant: CANON KK

Inventor： SAKAMOTO EIJI

IPC: H01L21/683 ,  G03F7/20 ,  H01L21/027 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To increase acceleration during scanning drive of a sample by holding the sample in a simple way at low cost, without enlarging a contact area between the flat sample and a sample stage. SOLUTION: In a sample-holding device, a reticle 1 as a flat sample is held on a moving stage 2 as a sample stage which is movable horizontally. In this case, the reticle 1 is directly vacuum chucked in a vacuum state on the moving stage 2. A plurality of independent holding members H1, separated physically from the recticle 1 and the moving stage 2, are provided at positions and the reticle 1 is held at a prescribed position of the moving stage 2.

公开(公告)号：JPH0521308A

公开(公告)日：1993-01-29

申请号：JP16829491

申请日：1991-07-09

Applicant: CANON KK

Inventor： HARA SHINICHI ,  SAKAMOTO EIJI

IPC: H01L21/683 ,  G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To realize a wafer supporting device wherein displacement is not generated in an attraction block even at a flow velocity of cooling water which allows to neglect influence of vibration, and whose control and constitution are simplified. CONSTITUTION:In a wafer supporting device which is provided with an attraction block 101 which holds a wafer and a Pertier element 104 which adjusts a temperature of the attraction block 101, a heat pipe 105 is provided to one side of the Pertier element 104 wherein the other side thereof is in contact with the attraction block 101.

公开(公告)号：JPH04168717A

公开(公告)日：1992-06-16

申请号：JP29355490

申请日：1990-11-01

Applicant: CANON KK

Inventor： TAKAYAMA HIDEMI ,  SAKAMOTO EIJI ,  YOSHII MINORU

IPC: G03F9/00 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To shorten a square and reduce the effect of disturbance, to improve the reliability of positional measurement and to facilitate the alignment of a wafer by installing a rotation-angle detecting mechanism onto the shaft of a theta stage while providing a movement detecting means. CONSTITUTION:A wafer 2 coarsely adjusted so that wafer coordinates and absolute coordinates coincide is loaded and fixed onto a theta stage 1, and the initial position of the stage 1 is conformed to absolute coordinates. The quantity of displacement of wafer coordinates and absolute coordinates is measured, the stage 1 is turned and wafer coordinates and absolute coordinates are made parallel, and the angle of rotation of the stage 1 is detected by a rotation-angle detector 7. An arbitrary position on the wafer 2 is moved to an absolute- coordinate origin from the quantity of parallel displacement detected and the angle of rotation and the wafer is exposed under the state in which coordinates are mated, the stage 1 is revolved, and a movement section by revolution generated from the deviation between the rotation axis and the absolute-coordinate origin is corrected. Accordingly, the length of a square shortened and manufacturing cost is reduced while the effect of disturbance is lowered, and alignment is enabled easily.

公开(公告)号：JPH033222A

公开(公告)日：1991-01-09

申请号：JP13880989

申请日：1989-05-30

Applicant: CANON KK

Inventor： MORI TETSUZO ,  SAKAMOTO EIJI ,  HARA SHINICHI ,  UDA KOJI ,  OZAWA KUNITAKA ,  UZAWA SHUNICHI

IPC: H01L21/30 ,  G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To enable flow to be controlled according to the exposure condition, and to keep the wafer temperature at the allowable temperature or less without lowering the throughput of exposure process by providing a flow rate control means for a temperature adjusting medium being let flow in a wafer chuck. CONSTITUTION:Exposure condition information is judged on the basis of the alignment completion signal at the time of alignment between the region on a substrate and the mask pattern. And flow control part 108 controls flow control valves 110a-110e according to the exposure position information and exposure condition information so as to adjust the flow of a temperature adjusting medium into three stages. Moreover, an exposure control part 107 can read in the temperature of a wafer chuck 105 by a temperature sensor 13, and presume the temperature of a wafer 104. The exposure control part 107 sends information on the temperature of the aforesaid wafer chuck 105 or the presumed temperature of the wafer 104 to the flow control part 108. The flow control part 108 can compensate the flow according to the temperature information received for the predetermined basic flow at three stages.