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    X-RAY EXPOSING METHOD
    1.
    发明公开
    X-RAY EXPOSING METHOD 审中-公开
    X射线曝光方法

    公开(公告)号：KR20070108677A

    公开(公告)日：2007-11-13

    申请号：KR20060041019

    申请日：2006-05-08

    Applicant: MITSUBISHI ELECTRIC CORP ,  CANON KK

    Inventor： ITOGA KENJI ,  KITAYAMA TOYOKI ,  WATANABE YUTAKA ,  UZAWA SHUNICHI

    IPC: H01L21/027

    CPC classification number: G03F7/2039 ,  G03F1/22

    Abstract: An X-ray exposing method is provided to transfer a circuit pattern of a higher resolution and to shorten an exposure process time by adjusting a peak wavelength of an X-ray. An X-ray irradiating process is performed to irradiate an X-ray by forming a material having an absorbing end formed in at least one of a wavelength region less than 0.45nm and a wavelength region more than 0.7nm on a surface of an X-ray mirror(3), and is performed by using X-ray mirror. An exposure process is performed to supply an X-ray of a wavelength region of 0.45nm to 0.7nm with an X-ray having a wavelength of 0.45nm to 0.7nm by setting an obliquely incident angle of the X-ray of the X-ray mirror under 1.5 degrees. An X-ray emission process is performed to emit the X-ray from a synchrotron radiation source(1).

    Abstract translation: 提供X射线曝光方法以传递更高分辨率的电路图案，并通过调整X射线的峰值波长来缩短曝光处理时间。 进行X射线照射处理，通过在X射线的表面上形成具有形成在小于0.45nm的波长区域和大于0.7nm的波长区域中的至少一个中的吸收端的材料来照射X射线， 射线镜（3），并使用X射线镜进行。 进行曝光处理，通过设定X射线的X射线的倾斜入射角，通过设定波长为0.45nm〜0.7nm的X射线，提供0.45nm〜0.7nm的波长区域的X射线， 射线镜低于1.5度。 执行X射线发射处理以从同步加速器辐射源（1）发射X射线。

    3.
    发明专利
    未知

    公开(公告)号：DE69033002D1

    公开(公告)日：1999-04-22

    申请号：DE69033002

    申请日：1990-10-01

    Applicant: CANON KK

    Inventor： SAKAMOTO EIJI ,  EBINUMA RYUICHI ,  AMEMIYA MITSUAKI ,  UZAWA SHUNICHI ,  UDA KOJI

    IPC: G03F7/20

    Abstract: An exposure apparatus includes a chamber (1) for placing the article in a predetermined ambience; holding device (5) for holding the article in the chamber; a fluid supplying device (3) for supplying a temperature adjusting fluid into the holding device through a flow passageway (4); a detecting device (2) for detecting leakage of the fluid from the flow passageway; and a flow rate controlling device (9) for controlling the flow rate of the fluid to be supplied to the holding device on the basis of detection by the detecting device.

    9.
    发明专利
    未知

    公开(公告)号：DE69115756D1

    公开(公告)日：1996-02-08

    申请号：DE69115756

    申请日：1991-05-17

    Applicant: CANON KK

    Inventor： HARA SHINICHI ,  AMEMIYA MITSUAKI ,  UZAWA SHUNICHI

    IPC: G03F1/22 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  G03F1/14

    Abstract: An X-ray exposure apparatus using radiation light as exposure light is disclosed, wherein the apparatus includes: a display device; a detecting device for detecting in each exposure the amount of exposure as absorbed by a mask during the exposure; a memory for memorizing an accumulated dose of the mask; and a controller for causing the display device to display a dose of the mask, wherein the does to be displayed corresponds to the sum of the accumulated dose as memorized in the memory and the amount of exposure as detected by the detecting device. Also disclosed is a mask structure suitably usable in such an exposure apparatus.

    10.
    发明专利
    未知

    公开(公告)号：DE68922798T2

    公开(公告)日：1995-11-16

    申请号：DE68922798

    申请日：1989-07-31

    Applicant: CANON KK

    Inventor： IWAMOTO KAZUNORI ,  UZAWA SHUNICHI ,  KARIYA TAKAO ,  EBINUMA RYUICHI ,  CHIBA HIROSHI ,  OHKAWA SHINKICHI

    IPC: G03F7/20 ,  G12B5/00

    Abstract: A method of supporting or mounting a precision instrument for supporting a mask and a wafer in a vacuum container. It is particularly applicable to a SOR-X ray exposure apparatus wherein the mask and the wafer are disposed in a desired level of the reduced pressure, and exposure energy such as X-rays contained in synchrotron radiation is projected onto the wafer through the mask to print the pattern of the mask onto the wafer. In x-y-z coordinates with the x direction being vertical, the precision instrument in hung at at least two points which are spaced in the x direction, to the inside wall of the vacuum container. At one of the supporting points, the precision instrument is given latitude of x, y and z direction movement, and at the other supporting point, the precision instrument is fixed or is given a latitude only in the x direction. By this, when the vacuum container deforms by the difference between the internal and external pressures, the precision instrument can be supported correctly.

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