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公开(公告)号：AU9730501A
公开(公告)日：2002-06-27
申请号：AU9730501
申请日：2001-12-18
Applicant: DEGUSSA
Inventor： HIMMELMANN MARTIN , RICHTER RALF , HAEGER HARALD , OENBRINK GEORG , SCHMITZ GUIDO , BAUMANN FRANS-ERICH , BARTZ WILFRIED
IPC: C08J5/00 , C08G69/00 , C08G73/02 , C08L77/02 , C08L77/06 , C08L79/02 , C08G73/00 , C08G69/14 , C08G69/10 , C08G69/26
Abstract: A molding composition of at least 50% by weight of a polyamine-polyamide copolymer obtained from 0.05 to 2.5% by weight of a polyamine having at least 4 nitrogen atoms and having a viscosity of at least 5 000 Pa.s at 250° C. and at a shear rate of 0.1 l/s, and having a viscosity ratio of at least 7 at 250° C., when the melt viscosities at shear rates of 0.1 l/s and 100 l/s are compared with one another, has high melt stiffness and is easy to cut, and performs well in blow molding.
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公开(公告)号：CA2477487C
公开(公告)日：2012-10-02
申请号：CA2477487
申请日：2004-08-16
Applicant: DEGUSSA
Inventor： WURSCHE ROLAND , DOWE ANDREAS , BAUMANN FRANZ-ERICH , BARTZ WILFRIED , HIMMELMANN MARTIN , GOERING RAINER
IPC: C08G69/48 , C08J7/14 , C08G69/02 , C08G69/04 , C08G69/16 , C08G69/18 , C08G69/28 , C08G73/02 , C08J3/20 , C08K5/098 , C08K5/109 , C08K5/49 , C08L77/00 , C08L77/02
Abstract: Disclosed is a process for increasing a molecular weight of polyamide, which comprises: (A) providing polyamide or a molding composition containing the polyamide and at least one other ingredient, wherein the polyamide contains from 5 to 500 ppm of phosphorous in the form of an acidic compound resulting from a catalyst employed in preparation of the polyamide; and (B) heating the polyamide or the molding composition in the presence of (i) a compound having at least two carbonate units and (ii) a salt of a weak acid in an amount of from 0.001 to 10% by weight based on the polyamide, under conditions effective to increase the molecular weight of the polyamide. By this process, the molecular weight of a wide variety of polyamides may be increased.
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公开(公告)号：DE102005007034A1
公开(公告)日：2006-08-17
申请号：DE102005007034
申请日：2005-02-15
Applicant: DEGUSSA
Inventor： DOWE ANDREAS , GOERING RAINER , HIMMELMANN MARTIN , BOLLMANN SONJA , BAUMANN FRANZ-ERICH , WURSCHE ROLAND
Abstract: Preparation of molded articles under condensation of a polyamide molded mass (A), where the polyamide portion contains at least 5 ppm of phosphorus in the form of acid compound, with a compound (I) having at least two carbonate units, comprises adding 0.001-10 wt.% of a salt of a weak acid to (A) before/during compounding, preparing a mixture of finished compounds and (I), transporting the mixture, which is optionally stored, and processing the mixture to molded articles, where the condensation is carried out first. An independent claim is included for a molded mass obtained by the process.
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公开(公告)号：DE10337707A1
公开(公告)日：2005-04-07
申请号：DE10337707
申请日：2003-08-16
Applicant: DEGUSSA
Inventor： WURSCHE ROLAND , DOWE ANDREAS , BAUMANN FRANZ-ERICH , BARTZ WILFRIED , HIMMELMANN MARTIN , GOERING RAINER
IPC: C08J7/14 , C08G69/04 , C08G69/16 , C08G69/18 , C08G69/28 , C08G69/48 , C08G73/02 , C08J3/20 , C08K5/098 , C08K5/109 , C08L77/00 , C08L77/02 , C08G69/46 , C08J5/18 , B32B27/34
Abstract: Condensation (M1) of polyamide or polyamide molding composition involves adding a compound (a) having at least two carbonate units (0.005 - 10 wt.%), and a salt of a weak acid (0.001 - 10 wt.%) to the polyamide or polyamide composition comprising phosphorus (5 - 500 parts per million (ppm)) in the form of an acidic compound. An independent claim is included for preparation (M2) of a polyamide molding or film involving: producing polyamide or polyamide composition by (M1); and injection molding, extruding, co-extruding, blow molding, suction blow molding, 3D blow molding or thermoforming the polyamide or polyamide composition to produce a molding or a film.
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公开(公告)号：CA2477487A1
公开(公告)日：2005-02-16
申请号：CA2477487
申请日：2004-08-16
Applicant: DEGUSSA
Inventor： DOWE ANDREAS , WURSCHE ROLAND , BARTZ WILFRIED , BAUMANN FRANZ-ERICH , GOERING RAINER , HIMMELMANN MARTIN
IPC: C08J7/14 , C08G69/04 , C08G69/16 , C08G69/18 , C08G69/28 , C08G69/48 , C08G73/02 , C08J3/20 , C08K5/098 , C08K5/109 , C08L77/00 , C08L77/02 , C08G69/02 , C08K5/49
Abstract: Disclosed is a process for increasing a molecular weight of polyamide, which comprises: (A) providing polyamide or a molding composition containing the polyamide and at least one other ingredient, wherein the polyamide contains from 5 to 500 ppm of phosphorous in the form of an acidic compound resulting from a catalyst employed in preparation of the polyamide; and (B) heating the polyamide or the molding composition in the presence of (i) a compound having at least two carbonate units and (ii) a salt of a weak acid in an amount of from 0.001 to 10% by weight based on the polyamide, under conditions effective to increase the molecular weight of the polyamide. By this process, the molecular weight of a wide variety of polyamides may be increased.
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Patent Agency Ranking
公开(公告)号：CA2474992A1
公开(公告)日：2005-01-18
申请号：CA2474992
申请日：2004-07-16
Applicant: DEGUSSA
Inventor： BAUMANN FRANZ-ERICH , BARTZ WILFRIED , HIMMELMANN MARTIN , FARGES OLIVIER
IPC: C08L77/06 , B29C45/00 , B29C47/00 , B29C49/04 , C08L23/08 , C08L33/14 , C08L53/00 , C08L77/12 , C08L79/00 , C08L77/00 , B29C49/00 , C08L71/00
Abstract: A molding composition, comprising: I. from 97 to 80 parts by weight of a polyetheramide based on a linear aliphatic diamine having from 6 to 14 carbon atoms, a linear aliphatic or aromatic dicarboxylic acid having from 6 to 14 carbon atoms, and a polyetherdiamine which has at least 3 carbon atoms per ether oxygen and has primary amino groups at the chain ends, and II. from 3 to 20 parts by weight of a rubber containing functional groups, each per 100 parts by weight of a total of components I. and II., is suitable for extrusion of moldings such as flexible pipes. The molding composition is resistant to hydrolysis and heat and has high melt viscosity and the resulting moldings, without an external plasticizer, have long-lasting flexibility and good low-temperature impact strength.
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公开(公告)号：CZ2003167A3
公开(公告)日：2003-09-17
申请号：CZ2003167
申请日：2003-01-17
Applicant: DEGUSSA
Inventor： HIMMELMANN MARTIN , BARTZ WILFRIED DR , BAUMANN FRANZ-ERICH DR , FARGES OLIVIER
Abstract: A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing acid anhydride or epoxide units (0.8-20). A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing: (i) acrylate units of formula (I) (0-85); (ii) imide units of formula (II) (0-80); (iii) acrylic acid units of formula (III) (0-15); (iv) acid anhydride or epoxide units of formula (IVA) or (IVB) respectively (0.8-20); and (v) 0-95% hydrocarbon units of formula (V) (0-95). Alkyl = 1-6C alkyl; R1 - R7 = H, CnH2n+1 or phenyl; m = 0 or 1; and n = 1-6.
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公开(公告)号：DE10201903A1
公开(公告)日：2003-07-31
申请号：DE10201903
申请日：2002-01-19
Applicant: DEGUSSA
Inventor： BAUMANN FRANZ-ERICH , HIMMELMANN MARTIN , BARTZ WILFRIED , FARGES OLIVIER
IPC: C08G69/40 , C08L23/08 , C08L33/06 , C08L33/24 , C08L77/00 , C08L77/06 , C08L77/12 , C08J5/02 , B60T17/04 , B60R16/00 , B60K11/00 , B60K15/01 , B60S1/48 , B60H1/00 , B62D5/06
Abstract: A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing acid anhydride or epoxide units (0.8-20). A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing: (i) acrylate units of formula (I) (0-85); (ii) imide units of formula (II) (0-80); (iii) acrylic acid units of formula (III) (0-15); (iv) acid anhydride or epoxide units of formula (IVA) or (IVB) respectively (0.8-20); and (v) 0-95% hydrocarbon units of formula (V) (0-95). Alkyl = 1-6C alkyl; R1 - R7 = H, CnH2n+1 or phenyl; m = 0 or 1; and n = 1-6.
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公开(公告)号：NO20030255A
公开(公告)日：2003-07-21
申请号：NO20030255
申请日：2003-01-17
Applicant: DEGUSSA
Inventor： HIMMELMANN MARTIN , BARTZ WILFRIED , BAUMANN FRANZ-ERICH , FARGES OLIVIER
CPC classification number: C08L77/00 , C08G69/40 , C08L23/08 , C08L33/06 , C08L33/064 , C08L33/068 , C08L33/24 , C08L77/06 , Y10T428/13 , Y10T428/1352 , Y10T428/139 , Y10T428/1397 , C08L2666/06 , C08L33/00 , C08L23/00
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公开(公告)号：DE10064338A1
公开(公告)日：2002-06-27
申请号：DE10064338
申请日：2000-12-21
Applicant: DEGUSSA
Inventor： HAEGER HARALD , SCHMITZ GUIDO , RICHTER RALF , BARTZ WILFRIED , BAUMANN FRANZ-ERICH , HIMMELMANN MARTIN , OENBRINK GEORG
IPC: C08J5/00 , C08G69/00 , C08G73/02 , C08L77/02 , C08L77/06 , C08L79/02 , C08G69/36 , C08J5/02 , B32B1/08 , B29C49/00
Abstract: A molding composition of at least 50% by weight of a polyamine-polyamide copolymer obtained from 0.05 to 2.5% by weight of a polyamine having at least 4 nitrogen atoms and having a viscosity of at least 5 000 Pa.s at 250° C. and at a shear rate of 0.1 l/s, and having a viscosity ratio of at least 7 at 250° C., when the melt viscosities at shear rates of 0.1 l/s and 100 l/s are compared with one another, has high melt stiffness and is easy to cut, and performs well in blow molding.
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