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    CURRENT GEBERATINBG AND ABSORBING APPARATUS WITH BIDIRECTIONAL TRANSMISSION LINE
    31.
    发明专利
    CURRENT GEBERATINBG AND ABSORBING APPARATUS WITH BIDIRECTIONAL TRANSMISSION LINE 未知

    公开(公告)号：PL323192A1

    公开(公告)日：1998-03-16

    申请号：PL32319296

    申请日：1996-02-23

    Applicant: IBM

    Inventor： BEERS GREGORY EDWARD ,  FRANKENY RICHARD FRANCIS ,  SMADI MITHKAL MOH D

    IPC: G06F3/00 ,  H03K19/00 ,  H04B1/40 ,  H04B3/02 ,  H04L5/14 ,  H04L25/02

    Abstract: A method and apparatus are disclosed for sending and receiving logic signals responsive to external digital data input and control signals. A reference circuit providing a first and second reference signal is common to the signal generating and receiving circuitry. The signal generating circuitry includes a signal source connected to the transmission line for generating a variable level digital signal, and a reference level adjusting and switching circuit ("RLA/S circuit") which is responsive to the digital data input and the first reference signal. The RLA/S circuit is connected to the signal source for selecting the level of the variable level digital signal and providing a switching signal. The signal source output is thus adjusted and switched so that the signal source generates a digital signal to the transmission line which follows the digital data input at the selected output signal level. The signal receiving circuitry includes a variable input impedance circuit connected to the transmission line which is responsive to the second reference signal for receiving variable level digital signals from the transmission line. It also includes a detecting circuit connected to receive the variable level digital signals from the variable input impedance circuit. The detecting circuit is responsive to the first reference signal and detects logic states of the variable level digital signals as determined by the first reference signal. The detecting circuit also converts the detected logic states into corresponding logic signals of predetermined output levels.

    32.
    发明专利
    未知

    公开(公告)号：BR9504582A

    公开(公告)日：1997-10-07

    申请号：BR9504582

    申请日：1995-10-27

    Applicant: IBM

    Inventor： FRANKENY JEROME ALBERT ,  FRANKENY RICHARD FRANCIS ,  HAYDEN TERRY FREDERICK ,  IMKEN RONALD LANN ,  RICE JANET LOUISE

    IPC: H05K1/16 ,  H05K3/46

    Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.

    34.
    发明专利
    未知

    公开(公告)号：DE69112134T2

    公开(公告)日：1996-05-02

    申请号：DE69112134

    申请日：1991-05-01

    Applicant: IBM

    Inventor： HAJ-ALI-AHMADE JAVAD ,  FRANKENY RICHARD FRANCIS ,  HERMANN KARL

    IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01L23/433 ,  H01L25/00 ,  H01L25/065 ,  H05K5/00 ,  H05K7/02 ,  H01L25/10

    Abstract: An electronic circuit packaging module (12) includes a lower substrate, (16), an upper cooling unit (18) and a frame (12) disposed therebetween. The substrate (16) carries a plurality of integrated circuit chips (26) with lead-outs to a plurality of downwardly protruding dimpled contact points (50) disposed about the substrate periphery. The frame (12) includes a plurality of insulative inserts (14) about its periphery having conductive pins (34) each with a lower extension (38) extending below the insert and an upper contact point (36) recessed within the insert. The cooling unit (18) includes a plurality of fluid bags (22) each in contact with a respective chip (26) on the substrate (16) for thermal management. A plurality of such modules (10) are stacked in vertical registry whereby each downwardly protruding dimple (50) of a module (10) extends into a respective insert recess (36) of an adjacent module (10) therebelow. Electrical contactis thus effected between the respective dimples (50) on the lower surface of the upper module (10) and respective upper contact points of the recessed pins (36) on the upper surface of the cover module. (10).

    36.
    发明专利
    未知

    公开(公告)号：DE69112134D1

    公开(公告)日：1995-09-21

    申请号：DE69112134

    申请日：1991-05-01

    Applicant: IBM

    Inventor： HAJ-ALI-AHMADE JAVAD ,  FRANKENY RICHARD FRANCIS ,  HERMANN KARL

    IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01L23/433 ,  H01L25/00 ,  H01L25/065 ,  H05K5/00 ,  H05K7/02 ,  H01L25/10

    Abstract: An electronic circuit packaging module (12) includes a lower substrate, (16), an upper cooling unit (18) and a frame (12) disposed therebetween. The substrate (16) carries a plurality of integrated circuit chips (26) with lead-outs to a plurality of downwardly protruding dimpled contact points (50) disposed about the substrate periphery. The frame (12) includes a plurality of insulative inserts (14) about its periphery having conductive pins (34) each with a lower extension (38) extending below the insert and an upper contact point (36) recessed within the insert. The cooling unit (18) includes a plurality of fluid bags (22) each in contact with a respective chip (26) on the substrate (16) for thermal management. A plurality of such modules (10) are stacked in vertical registry whereby each downwardly protruding dimple (50) of a module (10) extends into a respective insert recess (36) of an adjacent module (10) therebelow. Electrical contactis thus effected between the respective dimples (50) on the lower surface of the upper module (10) and respective upper contact points of the recessed pins (36) on the upper surface of the cover module. (10).

    38.
    发明专利
    未知

    公开(公告)号：DE69010397T2

    公开(公告)日：1995-01-26

    申请号：DE69010397

    申请日：1990-04-23

    Applicant: IBM

    Inventor： ARLDT BRIAN DUDLEY ,  FRANKENY RICHARD FRANCIS ,  HAJ-ALI-AHMADI JAVAD ,  IMKEN RONALD LANN ,  WUSTRAU ROLF

    IPC: H01R13/193 ,  H01R12/88 ,  H01R24/00 ,  H05K7/14 ,  H01R23/72

    Abstract: A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulating strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.

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