公开(公告)号：CA2367983C

公开(公告)日：2008-11-25

申请号：CA2367983

申请日：2000-03-15

Applicant: INPUT OUTPUT INC

Inventor： STALNAKER W MARC ,  GOLDBERG HOWARD D ,  YU DULI ,  SELVAKUMAR ARJUN ,  MARSH JAMES L

IPC: G01P21/00 ,  H05K5/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  G02B7/00 ,  H01L21/60 ,  H01L29/84

Abstract: A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to t he housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

公开(公告)号：DE60226262D1

公开(公告)日：2008-06-05

申请号：DE60226262

申请日：2002-10-18

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  SELVAKUMAR ARJUN ,  GOLDBERG HOWARD ,  YI TAECHUNG

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  G02B6/12 ,  G02B6/35

Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

公开(公告)号：DE60034451T2

公开(公告)日：2007-08-30

申请号：DE60034451

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01D11/24 ,  G01P21/00 ,  G01D18/00 ,  G01D21/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：AT360191T

公开(公告)日：2007-05-15

申请号：AT00915012

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01P15/00 ,  G01D21/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20025744L

公开(公告)日：2003-01-28

申请号：NO20025744

申请日：2002-11-29

Applicant: INPUT OUTPUT INC

Inventor： RIED ROBERT P ,  SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  SCHMIDT MARTIN A ,  YU LIANZHONG

IPC: G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  A61B15/125

公开(公告)号：NO20025744A

公开(公告)日：2003-01-28

申请号：NO20025744

申请日：2002-11-29

Applicant: INPUT OUTPUT INC

Inventor： RIED ROBERT P ,  SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  SCHMIDT MARTIN A ,  YU LIANZHONG

IPC: G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  A61B15/125

CPC classification number: G01V1/181 ,  G01P15/0802 ,  G01P15/125

公开(公告)号：NO20014464L

公开(公告)日：2001-11-16

申请号：NO20014464

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01P

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20014460L

公开(公告)日：2001-11-16

申请号：NO20014460

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01D21/00 ,  B65D85/38

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20014469D0

公开(公告)日：2001-09-14

申请号：NO20014469

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  MARSH JAMES L ,  GOLDBERG HOWARD D ,  YU DULI ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：EP1444543A4

公开(公告)日：2005-12-14

申请号：EP02799161

申请日：2002-10-18

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  SELVAKUMAR ARJUN ,  GOLDBERG HOWARD ,  YI TAECHUNG

IPC: B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  G02B6/12 ,  G02B6/35 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81B2201/047 ,  B81C1/00182 ,  B81C2201/019 ,  G02B6/3518 ,  G02B6/3548 ,  G02B6/357 ,  G02B2006/12104 ,  Y10S359/904

Abstract: A digital optical switch apparatus and method for manufacture. The apparatus includes a mirror assembly (112) coupled to a top cap (110) and to a bottom cap (114).