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公开(公告)号：US20140291853A1
公开(公告)日：2014-10-02
申请号：US13853281
申请日：2013-03-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC: H01L23/498
CPC classification number: H01L23/49827 , H01L21/563 , H01L23/49861 , H01L23/49894 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/0002 , H01L2924/00
Abstract: A package structure includes a thin chip substrate, a stabilizing material layer, a chip and a filling material. A first circuit metal layer of the substrate is inlaid into a dielectric layer and a co-plane is defined by the first circuit metal layer and the dielectric layer and is exposed from the dielectric layer. The bonding pads of the substrate are on the co-plane, have a height higher than the co-plane and connected to the first circuit metal layer. The stabilizing material layer is provided on two sides of the co-plane to define a receiving space for accommodating the chip. The filling material is injected into the receiving space to fasten the pins of the chip securely with bonding pads. Since no plastic molding is required, a total thickness of the package structure and the cost is reduced. The stabilizing material layer prevents the substrate from warping and distortion.
Abstract translation: 封装结构包括薄片基板，稳定材料层，芯片和填充材料。 衬底的第一电路金属层嵌入电介质层中，并且由第一电路金属层和电介质层限定共面，并从电介质层露出。 衬底的接合焊盘在共面上，具有高于共面的高度并连接到第一电路金属层。 稳定材料层设置在共面的两侧，以限定用于容纳芯片的容纳空间。 将填充材料注入到接收空间中，用粘合垫牢固地固定芯片的销。 由于不需要塑料成型，所以包装结构的总厚度和成本降低。 稳定材料层防止基材翘曲和变形。
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公开(公告)号：US10720694B2
公开(公告)日：2020-07-21
申请号：US16175807
申请日：2018-10-30
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Yung-Lin Chia , Chiao-Cheng Chang
Abstract: An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.
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公开(公告)号：US10256030B2
公开(公告)日：2019-04-09
申请号：US15811317
申请日：2017-11-13
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US20190014695A1
公开(公告)日：2019-01-10
申请号：US16115119
申请日：2018-08-28
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yung-Lin Chia
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K9/003 , H05K9/0037 , H05K9/0088 , H05K9/0092
Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.
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35.发明申请公开(公告)号：US20180068777A1
公开(公告)日：2018-03-08
申请号：US15811317
申请日：2017-11-13
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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Patent Agency Ranking
公开(公告)号：US09847165B2
公开(公告)日：2017-12-19
申请号：US14877981
申请日：2015-10-08
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US09570227B1
公开(公告)日：2017-02-14
申请号：US14809295
申请日：2015-07-27
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804
Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.
Abstract translation: 公开了一种磁激励线圈结构，其包括由薄膜形成的作为具有中空孔的圆筒体并被卷绕的电磁线圈片，以及覆盖由用于保护的电磁线圈片形成的圆筒体的外表面的绝缘层。 磁性线圈片包括柔性衬底，附着到柔性衬底的电介质层和嵌入在柔性衬底中并与电介质层接触的多个图案化电路层。 每个图案化电路层是分离的，并且图案化电路层的上表面和柔性基板的上表面形成共面。 磁线圈结构提供线圈的电功能，由于其电路的高纵横比而由图案化电路层增强，从而大大增加了整个磁通量和电磁效应。
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公开(公告)号：US09439290B1
公开(公告)日：2016-09-06
申请号：US14817268
申请日：2015-08-04
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/028 , H01F17/0013 , H05K1/118 , H05K1/165 , H05K2201/09036 , H05K2201/09063
Abstract: A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one connection pad and at least one gold finger. The flexible board has a middle region having a middle hole, and two side regions thinner than the middle region. A groove used as a fold line is provided on the lower surface of each side region bordering on the middle region. The upper and lower magnetic coils are configured in the flexible board and separated by the dielectric layer. The gold fingers are provided on the two side regions and connected to the upper magnetic coils. The upper and lower magnetic coils are around the middle hole and connected by the connection pads. The fold lines help the two side regions to fold without damage to the upper and lower magnetic coils.
Abstract translation: 载体板结构包括至少一个上部磁线圈，至少一个下部磁线圈，柔性电路板，电介质层，至少一个连接焊盘和至少一个金手指。 柔性板具有中间区域，中间部分具有比中间区域薄的两个侧面区域。 用作折线的槽设置在与中间区域接壤的每个侧面的下表面上。 上下磁性线圈配置在柔性电路板中，由电介质层隔开。 金手指设置在两个侧面区域上并连接到上部磁性线圈。 上下磁性线圈围绕中间孔并通过连接垫连接。 折叠线帮助两个侧面区域折叠而不损坏上部和下部磁性线圈。
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39.发明授权公开(公告)号：US09198296B1
公开(公告)日：2015-11-24
申请号：US14590235
申请日：2015-01-06
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , Fu-Song Chen
CPC classification number: H05K1/187 , H05K1/0213 , H05K1/0298 , H05K1/115 , H05K1/183 , H05K1/185 , H05K2201/0376
Abstract: A double sided board with buried element and a method for manufacturing the same are disclosed. At least one buried element is fixed on a dielectric layer and embedded in an insulation layer. First and second electrical circuits are formed on upper and lower surfaces of the insulation layer, respectively. At least one through-hole is formed in the insulation layer and filled with a conductive layer to electrically connect the first and the second electrical circuits. The dielectric layer beneath the buried element and the insulation layer above the buried element are provided with at least one opening, respectively, which is filled with the conductive layer, thereby connecting the conductive layer and external circuits or electrical elements. Additionally, the first and second electrical circuits are covered with first and second solder masks, respectively, so as to avoid environmental effect and improve preciseness of the circuits.
Abstract translation: 公开了一种具有埋设元件的双面板及其制造方法。 至少一个埋入元件固定在电介质层上并嵌入绝缘层中。 第一和第二电路分别形成在绝缘层的上表面和下表面上。 在绝缘层中形成至少一个通孔，并填充有导电层以电连接第一和第二电路。 掩埋元件下面的绝缘层和掩埋元件上方的绝缘层分别设置有至少一个开口，其中填充有导电层，由此连接导电层和外部电路或电气元件。 此外，第一和第二电路分别被第一和第二焊接掩模覆盖，以避免环境影响并提高电路的精度。
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公开(公告)号：US09095085B2
公开(公告)日：2015-07-28
申请号：US13853325
申请日：2013-03-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
CPC classification number: H05K3/4647 , H05K3/4038 , H05K2203/025 , H05K2203/063 , Y10T29/49155
Abstract: Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield.
Abstract translation: 公开了一种制造堆叠多层结构的方法，包括以下步骤：在基板上形成具有凸块的第一电路层，冲压铝板以形成与凸块相对应的凹部，在包括玻璃纤维层的塑料膜中形成开口 对铝合金板，塑料薄膜和基板进行压制，去除铝板，进行抛光以使所得表面平坦化，形成连接到第一电路层的第二电路层，最后移除基板以形成叠层多层 结构体。 由于塑料膜中的玻璃纤维层在研磨后不露出，所以介电层的厚度均匀，电路层的可靠性得以提高，从而提高产率。
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