POLYPHENYLENE SULFIDE RESIN COMPOSITION

    公开(公告)号:JPS63312353A

    公开(公告)日:1988-12-20

    申请号:JP14686987

    申请日:1987-06-15

    Abstract: PURPOSE:To obtain the titled composition outstanding in heat resistance, chemical resistance, mechanical strength and molding processability, improved in esp. tensile strength, tensile elongation and impact resistance, by incorporating a polyphenylene sulfide with a specific polyetherimide. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of a polyphenylene sulfide constituted of recurring unit of formula III with (B) 1-100pts.wt. of a polyetherimide having recurring unit of formula I [X is of formula II; R is tetravalent group selected from >=2C aliphatic groups, alicyclic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups and noncondensed polycyclic aromatic groups with aromatic group(s) mutually linked directly or through crosslinking member].

    AROMATIC POLYSULFONE POLYMER COMPOSITION

    公开(公告)号:JPS63304057A

    公开(公告)日:1988-12-12

    申请号:JP13897487

    申请日:1987-06-04

    Abstract: PURPOSE:To obtain an aromatic polysulfone polymer composition having excellent chemical resistance, mechanical strength, heat-resistance and moldability, by compounding an aromatic polysulfone polymer with a specific amount of a specific polyether imide. CONSTITUTION:The objective polymer composition is produced by (1) compounding (A) 100pts.wt. of an aromatic polysulfone polymer, e.g. composed of recurring unit of formula I or formula II with (B) >=1pt.wt. and =5pts.wt. and =2C aliphatic group, cycloaliphatic group, etc.) and produced by the dehydrative cyclization of a polyamic acid produced by the reaction of an ether diamine of formula III (X is carbonyl or sulfonyl group) with one or more kinds of tetracarboxylic acid dianhydrides, (2) preliminarily kneading the mixture e.g. with Henschel mixer and (3) pulverizing the kneaded mixture.

    POLYIMIDE RESIN COMPOSITION
    33.
    发明专利

    公开(公告)号:JPS63301256A

    公开(公告)日:1988-12-08

    申请号:JP13775687

    申请日:1987-06-02

    Abstract: PURPOSE:To obtain a polyimide resin composition excellent in melt flow, good in moldability and excellent in heat resistance, strength, etc., by mixing a polyimide having specified repeating units with a specified amount of polyphenylene sulfide. CONSTITUTION:The title resin composition is obtained by mixing 99.9-50wt.% polyimide (A) having repeating units of formula I (wherein X is carbonyl or sulfonyl, and R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic group, a condensed polycyclic aromatic group and a noncondensed polycyclic aromatic group composed of aromatic groups bonded to each other directly or through bridging members) is mixed with 0.1-50wt.% polyphenylene sulfide (B). The resin composition can be used for electronic devices, etc. Component A can be obtained by reacting an ether-diamine of formula II with a tetracarboxylic acid dianhydride and imidating the formed polyamic acid.

    POLYIMIDE YARN
    34.
    发明专利

    公开(公告)号:JPS63211319A

    公开(公告)日:1988-09-02

    申请号:JP4001387

    申请日:1987-02-25

    Abstract: PURPOSE:To obtain the titled yarn having high strength and high modulus of elasticity, obtainable by dry spinning and wet spinning method, comprising a polyimide having a specific pyromellitic imide unit as a repeating unit. CONSTITUTION:Yarn having a repeating unit shown by formula I. For example, first 4,4'-bis(3-aminophenoxy)biphenyl is reacted with pyromellitic anhydride in a solvent, preferably DMF, etc., preferably at

    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME

    公开(公告)号:JPS62185714A

    公开(公告)日:1987-08-14

    申请号:JP2693686

    申请日:1986-02-12

    Abstract: PURPOSE:To obtain a polyimide excellent in heat resistance, processability and high-temperature adhesiveness, having specified repeating units and pyridine rings in the main chain skeleton. CONSTITUTION:A polyimide having repeating units of formula I and having a logarithmic viscosity of 0.1-3.0dl/g as measured in the form of a polyamic acid, as a precursor thereof, having repeating units of formula II. In the formulas, R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a mononuclear aromatic group, a condensed polynuclear aromatic group and a noncondensed polycuclear aromatic group composed of aromatic groups connected with each other directly or through a bridging member. Said relative viscosity is a value as determined in N,N- dimethylacetamide solvent at a concentration of 0.5g/100ml of the solvent and 35 deg.C. This polyimide can be used in a wide variety of fields such as a base material for use in aerospace and aircraft, a base material for electrical and electronic products, a heat-resistant adhesive as well as a polymeric material for medical use and a material for separatory membranes.

    PRODUCTION OF FLEXIBLE PRINTED CIRCUIT BOARD

    公开(公告)号:JPS62104840A

    公开(公告)日:1987-05-15

    申请号:JP24293685

    申请日:1985-10-31

    Abstract: PURPOSE:To obtain a circuit board having all good heat resistance, electrical characteristic, adhesive property, mechanical characteristic, e.g. flexibility, and dimensional stability, by laminating a metal foil to a thermosetting polyimide film with a specific polyimide film as an adhesive. CONSTITUTION:A polyimide film produced by reacting a symmetric aromatic primary amine group containing a symmetric aromatic meta-substituted primary amine at 100-20% equivalent ratio with an aromatic tetracarboxylic acid anhydride is used as an adhesive in laminating a metal foil to a thermosetting polyimide film. The formed polyimide film is inserted between a film without adhesive property and a metal foil to laminate both film and foil while heating under pressure. The above-mentioned formed film is used as both an adhesive and an insulating layer for lamination.

    POLYIMIDE POLYMER AND THERMOSETTING POLYIMIDE

    公开(公告)号:JPH09104755A

    公开(公告)日:1997-04-22

    申请号:JP26402995

    申请日:1995-10-12

    Abstract: PROBLEM TO BE SOLVED: To obtain a thermosetting polyimide superior in heat resistance, processability, and mechanical characteristics to a thermoplastic polyimide by selecting a polyimide having a specific backbone and maleimide structures at the molecular ends. SOLUTION: This thermosetting polyimide has repeating structural units represented by formula I (wherein P1 is a divalent group represented by formula II or III; S1 is at least one kind of a monovalent group represented by formula IV or V; m is an integer of 100-1; n is an integer of 0-99, provided m+n

    POLYIMIDE RESIN COMPOSITION
    39.
    发明专利

    公开(公告)号:JPH0987516A

    公开(公告)日:1997-03-31

    申请号:JP34007895

    申请日:1995-12-27

    Abstract: PROBLEM TO BE SOLVED: To provide a polyimide resin compsn. which has a high rate of crystallization by comprising a polyimide having a repeating unit represented by a particular formula and a crystallization accelerator of a bismaleimide compd., an imide oligomer, or a bismaleimide mixture. SOLUTION: 4,4'-Bis(3-aminophenoxy)biphenyl is reacted with pyromellitic acid dianhydride to prepare a crystalline polyimide comprising a repeating unit represented by formula I. A crystalline polyimide in an amt. of 100 pts.wt. (hereinafter referred to as 'pts.') is mixed with at least one crystallization accelerator, in an amt. of l to 50 pts.wt., selected from among a bisimide compd. and the like represented by formula II (wherein X represents formula III; and Y1 represents formula IV), an imide oligomer represented by formula V (wherein (n) is 1 to 3), and a mixture of bisimide compds. represented by formulae VI and VII (wherein Z2 represents H, CH3 , C2 H5 or the like). This mixture is melt- kneaded by means of a melt mixer or the like at about 390 to 420 deg.C to prepare a polyimide resin compsn. for molding which can markedly shorten the cooling time for melt molding.

    POLYIMIDE RESIN COMPOSITION AND ADHESIVE PREPARED USING THE SAME

    公开(公告)号:JPH0977975A

    公开(公告)日:1997-03-25

    申请号:JP23711695

    申请日:1995-09-14

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide resin compsn. excellent in adhesive and mechanical properties by adding a fibrous reinforcement to a polyimide obtd. by reacting a specific diamine mixture with a tetracarboxylic dianhydride. SOLUTION: This resin compsn. is prepd. by incorporating 5-100 pts.wt. at least one fibrous reinforcement selected from among carbon fibers, glass fibers, arom. polyamide fibers, and potassium titanate fibers into 100 pts.wt. polyimide obtd. by reacting a diamine mixture comprising 1mol of an arom. diamine represented by formula I (wherein R is a group represented by formula II or III) and 0.10-0.005mol of a diaminosiloxane compd. represented by formula IV (wherein (n) is 0-7) with at least one tetracarboxylic dianhydride selected from among pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, and benzophenonetetrcarboxylic dianhydride. The incorporation of the reinforcement imparts excellent adhesive and mechanical properties to the compsn., from which a polyimide film and an adhesive are obtd.

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