SEMICONDUCTOR COMPOUND DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:JP2007000961A

    公开(公告)日:2007-01-11

    申请号:JP2005183181

    申请日:2005-06-23

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To load the same substrate with a semiconductor element and a micro-electromechanical device by manufacturing the semiconductor element and the micro-mechanical device on the same substrate, and then forming wiring for connecting the semiconductor element and the micro-mechanical device to each other. SOLUTION: This semiconductor compound device 1 includes: a semiconductor element 21 formed on the substrate 11; an insulating film 41 formed on the substrate 11 to cover the semiconductor element 21; the micro-electromechanical device 31 formed on the insulating film 41; and a wiring layer 50 for connecting the semiconductor element 21 and the micro-electromechanical device 31 to each other. The device solves the above problem. COPYRIGHT: (C)2007,JPO&INPIT

    Microoscillator, semiconductor device and communication apparatus
    32.
    发明专利
    Microoscillator, semiconductor device and communication apparatus 有权
    微晶器件,半导体器件和通信设备

    公开(公告)号:JP2006203577A

    公开(公告)日:2006-08-03

    申请号:JP2005013302

    申请日:2005-01-20

    CPC classification number: H03J3/00 H03J2200/19

    Abstract: PROBLEM TO BE SOLVED: To provide a microoscillator exhibiting excellent resonance characteristics by suppressing variation in central frequency, interference between adjacent oscillator elements, and the like, and to provide a semiconductor device equipped with the microoscillator, and a band filter by that microoscillator.
    SOLUTION: In the microoscillator, a plurality of beam type first oscillator elements 33 are connected in parallel and a non-resonating beam type second oscillator elements 34 is arranged between adjacent first oscillator elements 33.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题:通过抑制中心频率的变化,相邻的振荡元件之间的干扰等来提供表现出优异谐振特性的微振荡器,并提供配有微振荡器的半导体器件,以及通过该滤波器提供带滤波器 microoscillator。 解决方案:在微振荡器中,多个光束型第一振荡器元件33并联连接,非谐振波束型第二振荡器元件34布置在相邻的第一振荡器元件33之间。(C) 2006年,JPO&NCIPI

    Personal identification medium and personal identification system

    公开(公告)号:JP2004310322A

    公开(公告)日:2004-11-04

    申请号:JP2003101325

    申请日:2003-04-04

    Inventor: IKEDA KOICHI

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that it is impossible to surely prevent the rewriting of personal identification information in a personal identification medium using a conventionally well-known magnetic card or IC card. SOLUTION: This personal identification medium is shaped like a card by embedding an IC chip 3 in the card main body, and the IC chip includes a movable structure part 32 constituted of the aggregate of a plurality of movable parts K1 to K8 configured to operate irreversibly according to a write-in signal inputted from the outside so that the status can be detected as personal identification information after operation. COPYRIGHT: (C)2005,JPO&NCIPI

    OPTICAL MODULATING ELEMENT AND OPTICAL DEVICE USING THE SAME, AND MANUFACTURING METHOD FOR OPTICAL MODULATING ELEMENT

    公开(公告)号:JP2002341269A

    公开(公告)日:2002-11-27

    申请号:JP2001142309

    申请日:2001-05-11

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To provide an optical modulating element which has high light efficiency and reliability and an optical device which uses the same, and to provide a manufacturing method for the optical modulating element which can manufacture the optical modulating element at high yield. SOLUTION: The optical modulating element 10 is constituted by arraying ribbon-shaped diffraction parts 20 equipped with reflecting surfaces 16a in parallel along the length. Each diffraction part 20 itself has a reflecting layer 16, a 1st dielectric layer 17, and a 2nd dielectric layer 18 formed on a structure 15 and this part is displaced at right angles to the substrate 11 and functions as a diffracting surface to modulate the angle, intensity, and phase of incident light. The numbers of layers, materials, and thickness of the dielectric layers 17 and 18 are specified in designing while the incidence wavelength and the total stress of the diffraction parts 20 are taken into consideration. Consequently, the reflection factor of the diffraction parts 20 is enhanced to suppress the light absorption and heat generation by the reflecting layers 16 of Al, and the reflecting layers 16 are protected during washing and resist removal.

    MULTI-CHIP SEMICONDUCTOR DEVICE
    36.
    发明专利

    公开(公告)号:JP2002076244A

    公开(公告)日:2002-03-15

    申请号:JP2000258341

    申请日:2000-08-29

    Applicant: SONY CORP

    Inventor: IKEDA KOICHI

    Abstract: PROBLEM TO BE SOLVED: To provide a multifunction semiconductor device in which inter-chip alignment is facilitated, effective wiring length between functional chips is shortened, working frequency range is widened, and a plurality of semiconductor chips constitute a single semiconductor device. SOLUTION: A plurality of semiconductor chips, each having a circuit formed therein, are assembled three-dimensionally where a second semiconductor chip 21 is disposed substantially perpendicular to a first semiconductor chip 11, and the first and second semiconductor chips 11 and 21 are connected electrically at a plurality of contacts.

    SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

    公开(公告)号:JP2001085522A

    公开(公告)日:2001-03-30

    申请号:JP26401699

    申请日:1999-09-17

    Applicant: SONY CORP

    Inventor: IKEDA KOICHI

    Abstract: PROBLEM TO BE SOLVED: To suppress transfer of humidity or the like through voids by bonding atomic groups that are more bulky than hydroxyl group to the constituent atoms of a porous inorganic material exposed on the inner wall surface of voids on the surface layer of an insulator film composed of porous inorganic material formed on a substrate. SOLUTION: An opening 13 for forming a plug is formed on an insulator film 11 by plasma etching. By making the insulator film 11 contact a compound that can supply atomic groups that are more bulky than hydroxyl group in a gas form, the atomic groups more bulky than hydroxyl group are bonded to the constituent atoms of a porous inorganic material exposed on the inner wall surface of voids 20 located on a surface layer of the insulator film 11 on the side wall of the opening 13. As a result, the surface layer of the insulator film 11 is transmuted to become close, and incoming and outgoing of gas through voids 20 is suppressed. As a consequence, the defect of poisoned via or the like can be prevented.

    Terminal structure of electric contact, and contact switch equipped with the same
    39.
    发明专利
    Terminal structure of electric contact, and contact switch equipped with the same 审中-公开
    电触点的端子结构和与其相连的触点开关

    公开(公告)号:JP2011204651A

    公开(公告)日:2011-10-13

    申请号:JP2010073638

    申请日:2010-03-26

    Abstract: PROBLEM TO BE SOLVED: To provide a terminal structure of an electric contact capable of stabilizing a contact surface of a contact section and improving reliability of a device, and a contact switch equipped with the terminal structure of an electric contact.SOLUTION: The contact switch 1 has two terminals (movable section 10A and fixed section 10B). An insulating film 12, a base layer 13, an adhesion layer 14, and an electrode 15 are respectively formed in sequence on a substrate 11 (support substrate 17) concerning the movable section 10A and the fixed section 10B. The electrode 15 is provided with a composite material layer 15A wherein a reinforced material such as CNT is distributed into a metal basic material such as an Au, and a metal film 15B for covering at least a part of the composite material layer 15A. Hardness on the surface of the electrode 15 is equalized by covering the composite material layer 15A with the metal film 15B, and a contact surface between the movable section 10A and the fixed section 10B can be stabilized.

    Abstract translation: 要解决的问题:提供能够稳定接触部分的接触表面并提高设备可靠性的电接点的端子结构,以及配备有电触点的端子结构的接触开关。解决方案:接触开关 1具有两个端子(可动部10A和固定部10B)。 依次在与可移动部10A和固定部10B相关的基板11(支撑基板17)上分别形成绝缘膜12,基底层13,粘附层14和电极15。 电极15设置有复合材料层15A,其中诸如CNT的增强材料分布到诸如Au的金属基体材料中,以及用于覆盖复合材料层15A的至少一部分的金属膜15B。 通过用金属膜15B覆盖复合材料层15A,电极15的表面上的硬度相等,可动部10A和固定部10B之间的接触面能够稳定。

    Contact switch
    40.
    发明专利
    Contact switch 有权
    接触开关

    公开(公告)号:JP2011159504A

    公开(公告)日:2011-08-18

    申请号:JP2010020372

    申请日:2010-02-01

    CPC classification number: H01H57/00

    Abstract: PROBLEM TO BE SOLVED: To provide a contact switch which reduces contact resistance and suppresses insertion loss. SOLUTION: The contact switch 1 includes a plurality of fixed contact electrodes 14 arranged in parallel on a substrate 11, a push rod 12 which faces to the plurality of fixed contact electrodes 14, has a plurality of contact beams 12a, and can slide within a face of the substrate 11 along an arrangement direction of the fixed contact electrodes 14, and movable contact electrodes 13 arranged on the contact beams 12a. In accordance with sliding movement of the push rod 12, the fixed contact electrode 14 and the movable contact electrode 13 are switched between in a contact state and in a non-contact state, and a transmission line 15 is mechanically connected and disconnected. A contact structure, in which groups of the fixed contact electrodes 14 and movable contact electrodes 13 (contact pairs 10) are arrayed in parallel, is achieved. While contact of all the contact pairs 10 are simultaneously and collectively conducted, the contact of the respective contact pairs 10 are independent from each other. It becomes easy to make the respective contacts contact approximately evenly at a sufficient contact pressure. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种降低接触电阻并抑制插入损耗的接触开关。 解决方案:接触开关1包括平行布置在基板11上的多个固定接触电极14,面对多个固定接触电极14的推杆12具有多个接触梁12a,并且可以 沿着固定接触电极14的排列方向在基板11的表面内滑动,以及布置在接触梁12a上的可动接触电极13。 根据推杆12的滑动运动,固定接触电极14和可动接触电极13在接触状态和非接触状态之间切换,传输线15被机械地连接和断开。 实现了其中固定接触电极14和可动接触电极13(接触对10)的组并联排列的接触结构。 虽然所有接触对10的接触同时并且集体地进行,但是各个接触对10的接触彼此独立。 容易使相应的触点在足够的接触压力下大致均匀地接触。 版权所有(C)2011,JPO&INPIT

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