公开(公告)号：EP3984944A1

公开(公告)日：2022-04-20

申请号：EP21202712.2

申请日：2021-10-14

Applicant: STMicroelectronics S.r.l.

Inventor： BONI, Nicolò ,  VINCIGUERRA, Lorenzo ,  CARMINATI, Roberto ,  MERLI, Massimiliano

IPC: B81B3/00 ,  G02B26/08

Abstract: The MEMS device (1) is formed by a body (5) of semiconductor material, which defines a support structure (10); by a pass-through cavity (15) in the body, which is surrounded by the support structure; by a movable structure (20) suspended in the pass-through cavity; by an elastic structure (25), which extends in the pass-through cavity between the support structure (10) and the movable structure (20). The elastic structure has a first portion (25A) and a second portion (25B) and is subject, in use, to mechanical stress. The MEMS device is further formed by a metal region (45), which extends on the first portion (25A) of the elastic structure (25), and by a buried cavity (30) in the elastic structure, wherein the buried cavity extends between the first and the second portions of the elastic structure.

公开(公告)号：EP3854751A1

公开(公告)日：2021-07-28

申请号：EP21152454.1

申请日：2021-01-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BONI, Nicolò ,  BALDO, Lorenzo ,  MERLI, Massimiliano ,  CARMINATI, Roberto

IPC: B81C1/00 ,  G02B26/08

Abstract: A method of processing a wafer (100) for manufacturing an oscillating structure (30), comprising the steps of: forming torsional elastic elements (56, 58); forming a mobile element (54, 60) connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure (112); and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

公开(公告)号：EP3839602A1

公开(公告)日：2021-06-23

申请号：EP20212233.9

申请日：2020-12-07

Applicant: STMicroelectronics S.r.l.

Inventor： BONI, Nicolò ,  CARMINATI, Roberto ,  MERLI, Massimiliano

IPC: G02B26/08 ,  B81B3/00

Abstract: A microelectromechanical mirror device (200) has: a fixed structure (24) defining a cavity (23); a tiltable structure (22) carrying a reflecting surface (22'), elastically suspended above the cavity (23) and having a main extension in a horizontal plane (xy); elastic elements (26a-26b, 34a-34d) coupled to the tiltable structure (22); at least one first pair of driving arms (32a, 32b), which carry respective regions of piezoelectric material (33), that can be biased to cause rotation of the tiltable structure (22) about at least one first axis of rotation (X) parallel to a first horizontal axis (x) of the horizontal plane (xy), are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation (X) and are interposed between the tiltable structure (22) and the fixed structure (24). The driving arms (32a, 32b) have, along an orthogonal axis (z) transverse to the horizontal plane (xy), a thickness smaller than that of at least some of the elastic elements (26a-26b, 34a-34d) coupled to the tiltable structure (22).

公开(公告)号：EP3834952A1

公开(公告)日：2021-06-16

申请号：EP20210384.2

申请日：2020-11-27

Applicant: STMicroelectronics S.r.l.

Inventor： ADORNO, Silvia ,  CARMINATI, Roberto

IPC: B06B1/02 ,  B06B1/06 ,  G10K9/122 ,  G10K9/18

Abstract: A micromachined ultrasonic transducer ( 100 ) is proposed. The micromachined ultrasonic transducer ( 100 ) comprises a membrane element ( 115 ) for transmitting / receiving ultrasonic waves, during the transmission/reception of ultrasonic waves the membrane element ( 115 ) oscillating, about an equilibrium position, at a respective resonance frequency. The equilibrium position of the membrane element ( 115 ) is variable according to a biasing electric signal applied to the membrane element ( 115 ). The micromachined ultrasonic transducer ( 100 ) further comprises a cap structure ( 125 ) extending above the membrane element ( 115 ); said cap structure ( 125 ) identifies, between it and said membrane element ( 115 ), a cavity ( 130 ) whose volume is variable according to the equilibrium position of the membrane element ( 115 ). Said cap structure ( 125 ) comprises an opening ( 125 A ) for inputting / outputting the ultrasonic waves into/from the cavity ( 130 ). Said cap structure ( 125 ) and said membrane element ( 115 ) act as tunable Helmholtz resonator, whereby said resonance frequency is variable according to the volume of the cavity ( 130 ).

公开(公告)号：EP3343265A1

公开(公告)日：2018-07-04

申请号：EP17172096.4

申请日：2017-05-19

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  GIUSTI, Domenico ,  COSTANTINI, Sonia

IPC: G02B26/08

CPC classification number: G02B26/0858 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2203/0118 ,  G02B26/105 ,  H04N9/3129

Abstract: A MEMS device comprising a fixed structure (22) and a suspended structure (26) including an internal structure (29; 109) and a first arm (B1) and a second arm (B2), each of which has a respective first end and a respective second end, the first ends being fixed to the fixed structure and being angularly arranged at a distance apart, the second ends being fixed to the internal structure, being angularly arranged at a distance apart and being arranged angularly in a same direction of rotation with respect to the corresponding first ends. The MEMS device further includes a number of piezoelectric actuators (50, 52, 54, 56), each of which can be driven so as to cause deformation of a corresponding arm, thus causing a rotation of the internal structure. In resting conditions, each of the first and second arms has a respective elongated portion (30, 32) with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

公开(公告)号：EP3178783A1

公开(公告)日：2017-06-14

申请号：EP16175301.7

申请日：2016-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  CARMINATI, Roberto ,  MERLI, Massimiliano

IPC: B81B3/00 ,  G02B26/08

CPC classification number: G02B26/105 ,  B81B3/0048 ,  B81B3/0083 ,  B81B2201/042 ,  G02B26/0858 ,  H04N9/3173

Abstract: A micromechanical device (50) having an tiltable structure (52) rotatable about a first rotation axis (B); a fixed structure (51); and an actuation structure (54) of a piezoelectric type, coupled between the tiltable structure and the fixed structure. The actuation structure (54) is formed by spring elements (55, 56) having a spiral shape. The spring elements (55, 56) are each formed by a plurality of actuation arms (70-73) extending transversely to the first rotation axis (B), each actuation arm carrying a respective piezoelectric band (74, 75) of piezoelectric material. The actuation arms are divided into two sets biased in phase opposition to obtain rotation in opposite directions of the tiltable structure about the first rotation axis (B).

Abstract translation: 具有可围绕第一旋转轴线（B）旋转的可倾斜结构（52）的微机械装置（50）; 固定结构（51）; 以及耦合在可倾斜结构和固定结构之间的压电型致动结构（54）。 致动结构（54）由具有螺旋形状的弹簧元件（55,56）形成。 弹簧元件（55,56）各自由横向于第一旋转轴线（B）延伸的多个致动臂（70-73）形成，每个致动臂承载压电材料的相应压电带（74,75）。 致动臂被分成两组，它们以相位相反的方式偏置，以绕第一旋转轴线（B）绕可倾斜结构的相反方向旋转。