Abstract:
A row selector for a semiconductor memory including a plurality of memory cells coupled to a corresponding plurality of word lines, the row selector comprising, for each word line: a first biasing circuit path (230;215;260) adapted to bias the corresponding word line to a programming voltage when said corresponding word line is selected for selectively performing a program operation on at least one memory cell coupled to the corresponding word line, the first biasing circuit path comprising programming voltage provisioning means (215) adapted to provide the programming voltage; a second biasing circuit path (235) which is adapted to receive, from program-inhibit voltage provisioning means (250) a program inhibit voltage (GND), and to provide to the corresponding word line said program inhibit voltage (GND) when the word line is unselected during the program operation, first biasing means (220,225) for driving the second biasing circuit path in order to control a conduction state thereof; wherein: said first biasing circuit path includes a first transistor (M2) controlled to be electrically conductive when the corresponding word line is selected, and to be electrically non-conductive when the corresponding word line is unselected; said first biasing means controls the second biasing circuit path to be conductive when, during the program operation, the corresponding word line is unselected, said second biasing circuit path includes a plurality of series connected transistors, a number of transistors in said plurality being at least equal to the smallest integer not less than an absolute value of a ratio between a voltage equal to the difference between the programming voltage and the program-inhibit voltage to a predetermined maximum voltage given by the maximum voltage which a transistor of said series-connected transistors can sustain before it breaks down.
Abstract:
The present invention relates to a particular single cell erasing method for recovering memory cells under reading or programming disturbs in non volatile semiconductor memory electronic devices comprising cell matrix split in sectors and organised in rows, or word lines, and columns, or bit lines. This kind of memory devices generally provides the application of a sector erasing algorithm with subsequent testing phase (erase-verify); but the method according to the present invention provides a bit by bit erasing by applying to each single word line a negative voltage used during the erasing of a whole sector and on the drain terminal of each single cell a programming voltage. With this kind of selective bias it is possible to perform a single cell, or bit by bit, erasing, allowing all the cells in case under a reading or programming disturb increasing the original threshold value thereof to be recovered.
Abstract:
The invention relates to a method for pinpointing erase-failed memory cells and to a relevant integrated non-volatile memory device, of the programmable and electrically erasable type comprising a sectored array of memory cells (4) arranged in rows and columns, with at least one row-decoding circuit portion per sector (20) being supplied positive and negative voltages (Vpcx, HVNEG). This method becomes operative upon a negative erase algorithm issue, and comprises the following steps:
forcing the read condition of a sector (20) that has not been completely erased; scanning the rows of said sector (20) to check for the presence of a spurious current indicating a failed state; finding the failed row and electrically isolating it for re-addressing the same to a redundant row provided in the same sector (20).
Abstract:
The circuit for generating reference voltages for reading a multilevel memory cell includes the following: a first memory cell (236) and a second memory cell (236) respectively having a first reference programming level and a second reference programming level; a first reference circuit (46) and a second reference circuit (47) respectively connected to said first and said second memory cells (236) and having respective output terminals (60) which respectively supply a first reference voltage (VR1) and a second reference voltage (VRN-1); and a voltage divider (48) having a first connection node (42.1) and a second connection node (42.N-1) respectively connected to the output terminals (60) of the first reference circuit (46) and of the second reference circuit (47) to receive, respectively, the first reference voltage (VR1) and the second reference voltage (VRN-1), and a plurality of intermediate nodes (42.2,..., 42.N-2) supplying respective third reference voltages (VR2,..., VRN-2) at equal distances apart.