公开(公告)号：CA3096164A1

公开(公告)日：2019-10-24

申请号：CA3096164

申请日：2019-04-16

Applicant: STORA ENSO OYJ

Inventor： NASLI BAKIR BEN ,  ZAFAR ASHAR ,  EKSTROM JESPER

IPC: C09J197/00 ,  B27N3/00 ,  B32B21/08 ,  C08L97/00 ,  C09J161/06

Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

公开(公告)号：SE1750944A1

公开(公告)日：2019-01-19

申请号：SE1750944

申请日：2017-07-18

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  ARESKOGH DIMITRI ,  EKSTRÖM JESPER

IPC: C08L97/02 ,  B27N3/00 ,  C08H7/00 ,  C09J161/00 ,  C09J197/02

Abstract: The present invention relates to a liquid lignin composition, particularly useful in the manufacture of resins for products such as insulation, laminates and engineered wood products such as oriented strand boards (OSB). The liquid lignin composition has a low viscosity even at low water content.

公开(公告)号：CA2979990A1

公开(公告)日：2016-10-06

申请号：CA2979990

申请日：2016-04-01

Applicant: STORA ENSO OYJ

Inventor： ARESKOGH DIMITRI ,  ZAFAR ASHAR

IPC: C08H7/00 ,  C08G8/20 ,  C08G8/24 ,  C08L97/00 ,  C09J161/12 ,  C09J197/00 ,  D21D1/00

Abstract: The present invention relates to an activated lignin composition, its manufacture and its use thereof. It also relates to a resin comprising lignin, its manufacture and use.

公开(公告)号：CA2924977A1

公开(公告)日：2015-04-02

申请号：CA2924977

申请日：2014-09-25

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  ARESKOGH DIMITRI

IPC: C09D197/00 ,  C07G1/00 ,  C08G59/04 ,  C08G59/18 ,  C08G59/40 ,  C08H7/00 ,  C08L63/00 ,  C08L63/02 ,  C09J197/00

Abstract: The present invention relates to a composition for coating, in particular a composition comprising lignin and one or more epoxy-group containing compounds,and methods for the manufacturing thereof and uses thereof. The present invention also relates to products obtainable by said methods and uses thereof.

公开(公告)号：SE546842C2

公开(公告)日：2025-02-25

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE2051281A1

公开(公告)日：2022-05-05

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE544233C2

公开(公告)日：2022-03-08

申请号：SE1951514

申请日：2019-12-20

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  EKSTRÖM JESPER

IPC: C09J197/02 ,  B27N3/00 ,  B32B21/00 ,  C07G1/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/02 ,  C09D163/00 ,  C09D197/02 ,  C09J163/00

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of a crosslinker and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

公开(公告)号：SE2050835A1

公开(公告)日：2022-01-04

申请号：SE2050835

申请日：2020-07-03

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH

IPC: C09J197/00 ,  C08K5/00 ,  C08K5/16 ,  C08L97/00

Abstract: The present invention is directed to a method for preparing a bonding resin, wherein lignin in powder form or in the form of an aqueous dispersion is mixed with at an aqueous solution of least one substantially formaldehydefree crosslinker that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the lignin, at a pH in the range of from 3 to 9, and optionally one or more additives.

公开(公告)号：CL2020002713A1

公开(公告)日：2021-04-09

申请号：CL2020002713

申请日：2020-10-20

Applicant: STORA ENSO OYJ

Inventor： NASLI BAKIR BEN ,  ZAFAR ASHAR ,  EKSTRÖM JESPER

IPC: C08H8/00 ,  C08L97/00 ,  C09J161/00 ,  C09J197/00

Abstract: La presente invención se refiere a una formulación adhesiva que comprende lignina, adecuada para su uso en la manufactura de, por ejemplo, productos de madera. La lignina se proporciona en forma de una solución o dispersión o en forma de sólido seco, como en forma de un polvo. La formulación adhesiva también comprende resina fenol-formaldehído (PF) y/o resina lignina-fenolformaldehído (LPF). La formulación adhesiva también puede comprender diluyentes, endurecedores, rellenos y otros aditivos, para lograr una formulación adhesiva útil en la manufactura de, por ejemplo, productos de madera, como madera contrachapada y madera microlaminada (LVL). La formulación adhesiva también se puede usar en la manufactura de laminados y tableros de partículas orientadas.

公开(公告)号：SE543346C2

公开(公告)日：2020-12-08

申请号：SE1850468

申请日：2018-04-20

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

IPC: C09J197/00 ,  B27N3/14 ,  B32B21/08 ,  C08L97/00 ,  C09J161/06

Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of oriented strand board (OSB).