THERMOPLASTIC RESIN COMPOSITION
    31.
    发明专利

    公开(公告)号:JPH04114060A

    公开(公告)日:1992-04-15

    申请号:JP23217190

    申请日:1990-08-31

    Abstract: PURPOSE:To obtain a resin composition, excellent in drawability, gas barrier properties, hot water resistance, etc., and suitable for continuously molding packaging materials by blending specific amounts of saponified ethylene-vinyl acetate copolymer with a terminal-modified polyamide. CONSTITUTION:A resin composition is obtained by blending (A) 1-99wt.%, preferably 5-95wt.% saponified ethylene vinyl acetate copolymer having 10-50wt.% ethylene content with (B) 99-1wt.%, preferably 95-5wt.% terminal-modified polyamide having the terminal amino groups modified with an acid anhydride and >=3X10 equiv. content of the residual amino groups and 2-7 relative viscosity.

    RESIN COMPOSITION
    32.
    发明专利

    公开(公告)号:JPH0476040A

    公开(公告)日:1992-03-10

    申请号:JP18951790

    申请日:1990-07-19

    Abstract: PURPOSE:To improve stretching properties, gas barrier properties, and resistance to hot water, oil and impact by mixing a specified ethylene-vinyl alcohol copolymer with a specific aliph. copolyamide. CONSTITUTION:A polyamide having an m.p. of 120-200 deg.C and obtd. by copolymerizing 25-80wt.% caproamide with 75-20wt.% at least two aliph. polyamides at random is allowed to react with an agent for modifying terminal group contents (e.g. acetic acid) to give an aliph. copolyamide having a relative viscosity (JIS K6810, in 98% sulfuric acid, in 1% concn., and at 25 deg.C) of 1.7-4.0 and contents of terminal carboxyl group [X] and terminal amino group [Y] satisfying the formula (wherein the unit of [X] and [Y] is mol/g-polymer). 40-5wt.% said copolyamide is mixed with 60-95wt.% saponified ethylene-vinyl alcohol copolymer having an ethylene content of 25-60mol% and a degree of saponification of 90mol% or higher.

    THERMOPLASTIC RESIN COMPOSITION
    33.
    发明专利

    公开(公告)号:JPH0224347A

    公开(公告)日:1990-01-26

    申请号:JP17536388

    申请日:1988-07-13

    Abstract: PURPOSE:To obtain a thermoplastic resin composition excellent in impact resistance, moldability and chemical resistance by adding a small amount of a phosphorus compound to a resin composition comprising an ABS resin, a polyamide resin and a modified vinyl polymer. CONSTITUTION:0.01-1 pt.wt. phosphorus compound (e.g., phosphoric acid, sodium phosphite or triisodecyl phosphite) is added to 100 pts.wt. resin composition comprising 5-95wt.% ABS resin, 5-95wt.% polyamide resin and 1-70wt.% modified vinyl polymer comprising an aromatic vinyl, a vinyl cyanide and an alpha,beta-unsaturated carboxylic acid (e.g., styrene/acrylonitrile/methacrylic acid copolymer). A resin composition having moldability and impact resistance equivalent to those of an ABS resin and heat resistance and chemical resistance inherent in the polyamide can be obtained.

    THERMOPLASTIC RESIN COMPOSITION
    34.
    发明专利

    公开(公告)号:JPS62265340A

    公开(公告)日:1987-11-18

    申请号:JP10850286

    申请日:1986-05-14

    Abstract: PURPOSE:To obtain an antistatic resin composition having a permanent antistatic property and good mechanical properties by a simple production process, by mixing a polyether-ester-amide formed by using polyethylene glycol as a polyether component with a rubber-modified aromatic vinyl (co)polymer. CONSTITUTION:This resin composition contains 1-90wt% following polyether- ester-amide [A] and 99-10wt% rubber-modified aromatic vinyl (co)polymer. [A]: a polyether-ester-amide consisting of a 6C or higher aminocarboxylic acid, a lactam or a salt of a 6C or higher diamine with a dicarboxylic acid (a), polyethylene glycol (b) of a number-average MW of 200-6,000 and a 4-20C dicarboxylic acid and containing 95-10wt% polyether-ester units.

    RECOVERY OF POLYMER FROM COPOLYMER LATEX

    公开(公告)号:JPS62250015A

    公开(公告)日:1987-10-30

    申请号:JP9237586

    申请日:1986-04-23

    Abstract: PURPOSE:To obtain a granular polymer having a large grain diameter, improved productivity and high heat distortion temperature, by coagulating a copolymer latex containing an N-substituted phenylmaleimide at a specific temperature and heating the coagulation reaction system by a specific method. CONSTITUTION:A mixture consisting of (A) 20-80wt% styrene and/or alpha- methylstyrene, (B) 5-40wt% acrylonitrile, (C) 1-45wt% N-substituted phenylmaleimide and (D) 0-40wt% vinyl based monomer copolymerizable therewith is initially emulsion polymerized. The resultant copolymer latex is then coagulated with a coagulating agent, e.g. NaCl, etc., at 20-120 deg.C and the above- mentioned coagulation reaction system is further heated at 130-195 deg.C for 5sec-3hr while vigorously stirring to give ); Nqd is the discharge flow rate number; D is the diameter of the tank (m); d is the agitating blade span (m); n is the number of revolutions (r.p.s)]. The formed copolymer powder is then separated and recovered.

    THERMOPLASTIC RESIN COMPOSITION
    36.
    发明专利

    公开(公告)号:JPS62241945A

    公开(公告)日:1987-10-22

    申请号:JP8433886

    申请日:1986-04-14

    Abstract: PURPOSE:To obtain a compsn. having permanent antistatic properties as well as excellent mechanical properties, moldability and resistance to delamination, by blending a polyether ester amide with a graft (co)polymer-contg. material and a modified vinyl polymer. CONSTITUTION:A resin compsn. is obtd. by blending 1-40pts.wt. polyether ester amide (A) composed of a salt of an aminocarboxylic acid, lactam or diamine with a dicarboxylic acid, a poly(alkylene oxide) glycol and a dicarboxylic acid with 55-98pts.wt. material (B) contg. a graft (co)polymer obtd. by graft-copolymerizing a monomer component consisting of an arom. vinyl monomer and/or a (meth)acrylic ester monomer or a mixture thereof, or a monomer component consisting of an arom. vinyl monomer and/or a (meth) acrylic ester monomer and a vinyl cyanide monomer or a mixture thereof onto a rubbery polymer and 0.1-20pts.wt. modified vinyl monomer (C) having carboxyl groups in such a proportion that the amount of the rubbery polymer accounts for 1-40wt% of the whole of the compsn.

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