Abstract:
Tissue-mounted devices and methods for monitoring a thermal transport property (e.g., thermal conductivity, thermal diffusivity, heat capacity) of tissue, such as skin, are disclosed. The devices conformally mount to the tissue and comprise one or more thermal actuators and a plurality of sensors. The actuator applies heat to the tissue and the sensors detect a spatio temporal distribution of a physiological tissue parameter or physical property resulting from the heating. This spatio temporal information may be correlated with a rate, velocity and/or direction of blood flow, the presence of a vascular occlusion, circulation changes due to in flammation, hydration level and other physiological parameters.
Abstract:
The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.
Abstract:
Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.
Abstract:
Provided are methods and devices for interfacing with brain tissue, specifically for monitoring and/or actuation of spatio-temporal electrical waveforms. The device is conformable having a high electrode density and high spatial and temporal resolution. A conformable substrate supports a conformable electronic circuit and a barrier layer. Electrodes are positioned to provide electrical contact with a brain tissue. A controller monitors or actuates the electrodes, thereby interfacing with the brain tissue. In an aspect, methods are provided to monitor or actuate spatio-temporal electrical waveform over large brain surface areas by any of the devices disclosed herein.
Abstract:
Provided herein are implantable biomedical devices and methods of administering implantable biomedical devices, making implantable biomedical devices, and using implantable biomedical devices to actuate a target tissue or sense a parameter associated with the target tissue in a biological environment.
Abstract:
Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
Abstract:
The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.
Abstract:
Skin-mounted or epidermal devices and methods for monitoring biofluids are disclosed. The devices comprise a functional substrate that is mechanically and/or thermally matched to skin to provide durable adhesion for long-term wear. The functional substrates allow for the microfluidic transport of biofluids from the skin to one or more sensors that measure and/or detect biological parameters, such as rate of biofluid production, biofluid volume, and biomarker concentration. Sensors within the devices may be mechanical, electrical or chemical, with colorimetric indicators being observable by the naked eye or with a portable electronic device (e.g., a smartphone). By monitoring changes in an individual's health state over time, the disclosed devices may provide early indications of abnormal conditions.
Abstract:
THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (100), AND SMART-MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.